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TSM104AIN

STMicroelectronics

TSM104AIN by STMicroelectronics

TSM104AIN by STMicroelectronics is an operational amplifier with 4 functions, 4000uV max input offset voltage, and 85dB nominal CMRR. It is used in industrial applications for its 900kHz unity gain bandwidth, -40 to 105 °C operating temperature range, and low bias current of 0.2uA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,856 parts In-Stock

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10,856

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Digiode

USA . 4,335 parts In-Stock

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4,335

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Anansix

USA . 575 parts In-Stock

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575

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Distributors (Availability)

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Microchip USA

USA . 399 parts In-Stock

1+ parts

$1.750

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399

$1.750

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IDEA Electronic Components Group

UK . 2,269 parts In-Stock

1+ parts

$6.578

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-

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$5.920

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2,269

$6.578

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$5.920

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MKK Technologies

India . 61 parts In-Stock

1+ parts

$12.370

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61

$12.370

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DigiPath Technology Company

USA . 61 parts In-Stock

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$12.370

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61

$12.370

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AZTECH Wire

Italy . 1,135 parts In-Stock

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$18.160

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1,135

$18.160

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Vigor

Singapore . 10,000 parts In-Stock

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Corphita

USA . 3,802 parts In-Stock

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Parana Technologies

USA . 2,372 parts In-Stock

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$7.865

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2,372

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$7.865

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Kepictronics

USA . 300 parts In-Stock

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300

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Overview

Enhance your electronic projects with the TSM104AIN operational amplifier by STMicroelectronics. With a reputation for high-quality components, STMicroelectronics delivers unmatched performance and reliability in their products. The TSM104AIN offers versatile applications in various industries, providing customers with precise and efficient amplification solutions. Elevate your designs with the value, benefits, and advantages of this top-of-the-line operational amplifier from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protects the internal components of the operational amplifier from external elements.

Maximum Input Offset Voltage: 4000 uV

The low maximum input offset voltage ensures minimal error in signal processing, making this operational amplifier suitable for precision applications.

Maximum Average Bias Current (IIB): 0.2 uA

The low bias current ensures minimal power consumption and accurate signal amplification in low current applications.

No. of Functions: 4

Having multiple functions in a single component saves space on the circuit board and simplifies the overall design.

Nominal Common Mode Reject Ratio: 85 dB

A high common mode rejection ratio ensures that unwanted noise and interference from the environment are effectively rejected, resulting in clean output signals.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes this operational amplifier compatible with a wide range of applications that require standard voltage levels.

No. of Terminals: 16

The higher number of terminals allows for more versatile connectivity options and enables interfacing with other components in the circuit.

Maximum Supply Voltage Limit: 36 V

With a high supply voltage limit, this operational amplifier can withstand overvoltage conditions and operate reliably in a variety of power supply configurations.

Maximum Operating Temperature: 105 °C

The wide operating temperature range ensures the operational amplifier can perform consistently even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments without risking damage to the component.

Terminal Finish: TIN LEAD

The tin-lead finish on the terminals provides good solderability and ensures secure electrical connections in the circuit.

Nominal Unity Gain Bandwidth: 900 kHz

The high unity gain bandwidth indicates the operational amplifier's ability to amplify signals accurately at high frequencies, making it suitable for applications requiring fast response times.

Technical Specifications

Operational Amplifiers (Op Amps) TSM104AIN attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

4

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

900 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

4000 uV

Nominal Slew Rate:

0.3 V/us

Peak Bias Current:

200 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Physical Characteristics

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.201 in (5.1 mm)

Total Terminals:

16

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Trade Compliance

TSM104AIN Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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