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TSM102IDT

STMicroelectronics

TSM102IDT by STMicroelectronics

TSM102IDT from STMicroelectronics is a dual operational amplifier featuring a max input offset voltage of 6500 µV and a nominal voltage of 5 V. With a high common mode reject ratio of 90 dB, it’s ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,997 parts In-Stock

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Digiode

USA . 2,523 parts In-Stock

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Anansix

USA . 2,477 parts In-Stock

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Vigor

Singapore . 2,368 parts In-Stock

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$0.343

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2,368

$0.343

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IDEA Electronic Components Group

UK . 257 parts In-Stock

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$1.853

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-

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$1.668

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257

$1.853

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$1.668

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Microchip USA

USA . 468 parts In-Stock

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$2.110

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$2.110

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$2.110

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$2.110

468

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$2.110

MKK Technologies

India . 960 parts In-Stock

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$3.484

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960

$3.484

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DigiPath Technology Company

USA . 960 parts In-Stock

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$3.484

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960

$3.484

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AZTECH Wire

Italy . 264 parts In-Stock

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$19.250

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QUARKTWIN TECHNOLOGY LTD

USA . 22,082 parts In-Stock

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Metaverse IC Inc.

Canada . 12,000 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Assy Fe

Spain . 10,000 parts In-Stock

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RC Electronics

USA . 8,100 parts In-Stock

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$0.230

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Perfect Parts

USA . 2,391 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,514 parts In-Stock

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Corphita

USA . 881 parts In-Stock

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Parana Technologies

USA . 617 parts In-Stock

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$2.215

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617

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Overview

Elevate your designs with the TSM102IDT from STMicroelectronics, where unmatched precision meets reliability. As a leader in semiconductor innovation, STMicroelectronics delivers exceptional operational amplifiers that enhance performance across diverse applications—from industrial automation to consumer electronics. Experience superior quality, low power consumption, and robustness, ensuring your projects thrive in demanding environments while maximizing efficiency and minimizing noise. Choose TSM102IDT for optimal results and unyielding support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and resistance to environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 6500 uV

A low input offset voltage is critical for precision applications, ensuring minimal error in signal processing.

Maximum Average Bias Current (IIB): 0.2 uA

Lower bias current enhances accuracy and efficiency, making this op-amp suitable for battery-powered devices.

Surface Mount: YES

Surface mount technology allows for compact design and automated assembly, improving manufacturing efficiency.

No. of Functions: 2

This dual-functionality enables versatile applications, maximizing utility in circuit designs.

Package Shape: RECTANGULAR

Rectangular packaging provides a convenient form factor for efficient PCB layout and design.

Nominal Common Mode Reject Ratio: 90 dB

A high CMRR ensures excellent performance in noisy environments, making it suitable for sensitive applications.

Nominal Supply Voltage / Vsup(V): 5

A nominal supply voltage of 5V is common and compatible with many electronic systems, facilitating integration.

Power Supplies (V): 5

Simple and widely-used power supply requirement allows for cost-effective implementations in existing designs.

No. of Terminals: 16

With multiple terminals, this op-amp can support various configurations for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

Small outline packages save board space and allow for denser component placement.

Minimum Slew Rate: 1.6 V/us

A minimum slew rate ensures the op-amp can respond quickly to changing signals, suitable for high-frequency applications.

Maximum Supply Voltage Limit: 36 V

A high supply voltage limit allows for use in a wide range of applications without the risk of damage.

Maximum Operating Temperature: 85 °C

This temperature rating ensures reliable operation in industrial and higher temperature environments.

Maximum Bias Current (IIB) @ 25C: 0.1 uA

Very low bias current reinforces the precision and stability of the amplifier across varying conditions.

Frequency Compensation: YES

Built-in frequency compensation makes this op-amp easier to work with in feedback configurations, enhancing stability.

Minimum Voltage Gain: 25000

A high minimum voltage gain allows for effective amplification of weak signals, optimal for sensor applications.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this product suitable for harsh environments and critical applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes enhance solder joint reliability and overall component durability.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing on PCB layouts and improved flexibility in designs.

Maximum Seated Height: 1.75 mm

A low profile ensures compatibility with compact electronic assemblies, particularly in space-constrained environments.

Width: 3.9 mm

Narrow width aids in efficient packing on PCBs, allowing for intelligent layout design.

Maximum Time At Peak Reflow Temperature (s): 30

A longer maximum time limit provides flexibility in assembly processes, enhancing solderability.

Peak Reflow Temperature °C: 260

A high reflow temperature capability allows for compatibility with various soldering processes and increases reliability.

Length: 9.9 mm

Compact length enhances design efficiency, allowing for better placement among other components.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability in critical applications and environments demanding robustness.

Nominal Unity Gain Bandwidth: 2100 kHz

High bandwidth capacity allows for effective performance in a wide array of high-speed applications.

Technology: BIPOLAR

Bipolar technology provides high speed and low noise characteristics, beneficial for precision amplification.

Terminal Form: GULL WING

Gull-wing terminal forms aid in automated assembly processes, ensuring stable and reliable connections.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this component is versatile and widely applicable across various electronics.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture allows for flexible design configurations and straightforward applications.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated handling and efficient production processes.

Nominal Slow Rate: 2 V/us

A reasonable nominal slow rate supports diverse applications, offering a balance between speed and stability.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB design and integration with existing systems, promoting compatibility.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, suitable for standard manufacturing and handling practices.

Technical Specifications

Operational Amplifiers (Op Amps) TSM102IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

6500 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

1.6 V/us

Nominal Slew Rate:

2 V/us

Peak Bias Current:

200 nA

Maximum Bias Current (IIB) @25 °C:

100 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.39 in (9.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

16

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP16,.25

Trade Compliance

TSM102IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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