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TSM007IDT

STMicroelectronics

TSM007IDT by STMicroelectronics

TSM007IDT by STMicroelectronics is a compact switching regulator with a max operating temp of 95 °C and supports input voltages from 12V to 25V. It features an 8-terminal design, operates at up to 500 kHz, and utilizes PWM control. Ideal for efficient power management in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,768 parts In-Stock

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6,768

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Digiode

USA . 3,524 parts In-Stock

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3,524

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Anansix

USA . 2,304 parts In-Stock

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2,304

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Distributors (Availability)

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AZTECH Wire

Italy . 1,052 parts In-Stock

1+ parts

$16.530

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-

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1,052

$16.530

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IDEA Electronic Components Group

UK . 618 parts In-Stock

1+ parts

$16.681

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-

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$15.012

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618

$16.681

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$15.012

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MKK Technologies

India . 818 parts In-Stock

1+ parts

$31.367

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818

$31.367

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DigiPath Technology Company

USA . 818 parts In-Stock

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$31.367

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818

$31.367

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Microchip USA

USA . 5,448 parts In-Stock

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5,448

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QUARKTWIN TECHNOLOGY LTD

USA . 5,033 parts In-Stock

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Corphita

USA . 2,398 parts In-Stock

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2,398

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Parana Technologies

USA . 2,320 parts In-Stock

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$19.944

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2,320

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$19.944

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Vigor

Singapore . 1,816 parts In-Stock

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1,816

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Overview

Elevate your designs with the TSM007IDT from STMicroelectronics, a leader in innovative semiconductor solutions. This compact switching regulator offers unmatched efficiency and reliability, making it ideal for various applications, from consumer electronics to industrial systems. With superior performance under demanding conditions, you can trust TSM007IDT to deliver consistent results, ensuring your projects are a success while optimizing power usage and space.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stresses, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and facilitates automated assembly, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on PCB, allowing for better integration with other components.

No. of Terminals: 8

Eight terminals provide ample connectivity options, enabling flexibility in circuit design and simplification of board layout.

Package Style (Meter): SMALL OUTLINE

The small outline package enables compact designs, which is essential for space-constrained applications.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95 °C, this product can perform reliably in high-temperature environments.

Control Mode: CURRENT-MODE

Current-mode control enhances transient response and provides better regulation, making this regulator more efficient under varying loads.

Minimum Operating Temperature: 0 °C

Operating at temperatures down to 0 °C allows for a wider range of applications, including those in cooler environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish improves solderability and ensures long-term reliability of electrical connections.

Terminal Position: DUAL

Dual terminal positions provide design flexibility and ease of integration into various layouts.

Maximum Seated Height: 1.75 mm

With a low seated height, this regulator fits well into low-profile applications, maintaining a compact system design.

Width: 3.9 mm

The narrow width helps conserve PCB space, allowing for more components to be placed in close proximity.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it offers higher efficiency compared to linear regulators, resulting in less heat generation and energy loss.

Nominal Input Voltage: 12 V

The nominal input voltage of 12V is suitable for standard applications, ensuring compatibility with widely used power supplies.

Length: 4.9 mm

A compact length contributes to space-saving designs, enabling efficient circuit layout and reduced board size.

Maximum Switching Frequency: 500 kHz

A high switching frequency allows for smaller passive components, enabling more compact designs while maintaining performance.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide excellent mechanical strength, enhancing assembly reliability.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control allows for precise regulation of output voltage, improving power efficiency.

Switcher Config: SINGLE

The single switcher configuration simplifies design and reduces component count, leading to lower costs and complexities.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm suits modern PCB layouts while enabling compatibility with standard PCB hole sizes.

Minimum Input Voltage: 12 V

A minimum input voltage of 12V ensures stable operation for typical electronic and power applications.

Maximum Input Voltage: 25 V

Handling a maximum input voltage of 25V allows this regulator to connect to a variety of power sources with higher voltage outputs.

Technical Specifications

Switching Regulators & Controllers TSM007IDT attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

25 V

Minimum Input Voltage:

12 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TSM007IDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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