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TSM007ID

STMicroelectronics

TSM007ID by STMicroelectronics

TSM007ID by STMicroelectronics is a compact switching regulator with a max operating temp of 95 °C and supports input voltages from 12V to 25V. It features an 8-terminal design, operates at up to 500 kHz, and utilizes PWM control for efficient power management in various applications. Ideal for space-constrained designs, it ensures reliable performance in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,306 parts In-Stock

1+ parts

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4,306

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Digiode

USA . 3,768 parts In-Stock

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3,768

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Anansix

USA . 380 parts In-Stock

1+ parts

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380

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,529 parts In-Stock

1+ parts

$5.091

100+ parts

-

1k+ parts

$4.582

10k+ parts

-

1,529

$5.091

-

$4.582

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MKK Technologies

India . 1,720 parts In-Stock

1+ parts

$9.574

100+ parts

-

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1,720

$9.574

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DigiPath Technology Company

USA . 1,720 parts In-Stock

1+ parts

$9.574

100+ parts

-

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1,720

$9.574

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AZTECH Wire

Italy . 525 parts In-Stock

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$13.140

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525

$13.140

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QUARKTWIN TECHNOLOGY LTD

USA . 16,891 parts In-Stock

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16,891

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Microchip USA

USA . 5,140 parts In-Stock

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5,140

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Vigor

Singapore . 1,955 parts In-Stock

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1,955

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Parana Technologies

USA . 1,226 parts In-Stock

1+ parts

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100+ parts

$6.087

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1,226

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$6.087

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Corphita

USA . 1,206 parts In-Stock

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1,206

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Overview

Elevate your designs with the TSM007ID from STMicroelectronics—where innovation meets reliability. This compact switching regulator delivers exceptional performance, optimizing power efficiency in a variety of applications, from industrial to consumer electronics. Crafted with precision and backed by ST’s renowned quality, it ensures your projects thrive while reducing energy costs. Experience seamless integration and superior performance that empowers your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures robust durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, facilitating compact designs.

Package Shape: RECTANGULAR

The rectangular shape is optimal for straightforward integration into standard PCB layouts.

No. of Terminals: 8

With 8 terminals, this device provides flexibility in circuit design and effective connectivity.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space-saving capabilities on PCBs without compromising performance.

Maximum Operating Temperature: 95 °C

A high maximum operating temperature rating signifies suitability for applications in demanding thermal environments.

Control Mode: CURRENT-MODE

Current-mode control allows for improved response and stability, making it a reliable choice for precision applications.

Minimum Operating Temperature: 0 °C

This ensures functionality in a wide range of environments, including low-temperature applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish enhances solderability and reliability, resulting in improved electrical connections.

Terminal Position: DUAL

The dual terminal position offers versatile mounting options, increasing design flexibility.

Maximum Seated Height: 1.75 mm

A low seated height enables compatibility with designs requiring minimal profile components.

Width: 3.9 mm

The compact width fits well in space-constrained applications while maintaining performance.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it enhances efficiency, reducing power loss and heat generation.

Nominal Input Voltage: 12 V

Designed for a nominal 12 V input, this product is ideal for standard power supply applications.

Length: 4.9 mm

The short length contributes to space-efficient board design.

Maximum Switching Frequency: 500 kHz

A high switching frequency allows for smaller passive components, improving overall circuit efficiency.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical and electrical connections, facilitating better soldering.

Control Technique: PULSE WIDTH MODULATION

PWM control ensures efficient energy regulation, making it suitable for dynamic load applications.

Switcher Config: SINGLE

A single configuration simplifies design complexity and improves reliability in switching applications.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with a variety of PCB layouts and designs.

Minimum Input Voltage: 12 V

With a minimum input voltage of 12 V, this regulator ensures consistent performance in standard voltage applications.

Maximum Input Voltage: 25 V

The ability to handle up to 25 V input provides flexibility for various power systems and enhances design options.

Technical Specifications

Switching Regulators & Controllers TSM007ID attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

25 V

Minimum Input Voltage:

12 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TSM007ID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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