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TSH511CFT

STMicroelectronics

TSH511CFT by STMicroelectronics

TSH511CFT by STMicroelectronics is a low-profile consumer IC designed for industrial applications. It operates b/w -40 °C and 85 °C, with a supply voltage range of 2.3V to 5.5V and a max current of 18mA. Its compact design features a square package with 44 terminals for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,469 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,469

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-

-

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Anansix

USA . 2,518 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,518

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Digiode

USA . 536 parts In-Stock

1+ parts

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100+ parts

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536

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LWI Electronics Inc

India . 10 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 910 parts In-Stock

1+ parts

$0.644

100+ parts

-

1k+ parts

$0.580

10k+ parts

-

910

$0.644

-

$0.580

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MKK Technologies

India . 1,596 parts In-Stock

1+ parts

$1.211

100+ parts

-

1k+ parts

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10k+ parts

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1,596

$1.211

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-

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DigiPath Technology Company

USA . 1,596 parts In-Stock

1+ parts

$1.211

100+ parts

-

1k+ parts

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10k+ parts

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1,596

$1.211

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-

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AZTECH Wire

Italy . 231 parts In-Stock

1+ parts

$16.240

100+ parts

-

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10k+ parts

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231

$16.240

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Corphita

USA . 3,537 parts In-Stock

1+ parts

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3,537

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Parana Technologies

USA . 2,071 parts In-Stock

1+ parts

-

100+ parts

$0.770

1k+ parts

-

10k+ parts

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2,071

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$0.770

-

-

Overview

Unlock unparalleled performance with the TSH511CFT from STMicroelectronics, a leader in semiconductor innovation. This sophisticated consumer IC combines low power consumption with robust temperature resilience, ensuring reliability across various applications, from industrial automation to consumer electronics. Experience seamless integration and high-quality design that enhances your product's efficiency and longevity, making it the perfect choice for discerning engineers and manufacturers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making this IC suitable for various consumer applications.

Surface Mount: YES

The surface mount feature allows for more compact designs and improved performance in modern electronics, enhancing versatility in application.

Package Shape: SQUARE

The square package shape facilitates efficient PCB layout, leading to better space utilization and design flexibility.

General IC Type: CONSUMER CIRCUIT

This classification indicates suitability for various consumer electronics, ensuring reliability and performance in typical applications.

No. of Terminals: 44

A higher number of terminals allows for more complex functions and greater flexibility in circuit design, enabling more features in the final product.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is advantageous for space-constrained applications, allowing for slimmer device designs.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this IC suitable for various environments, ensuring reliability under typical industry conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IC is capable of functioning in extreme cold, broadening its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing long-term reliability.

Terminal Position: QUAD

Quad terminal configuration simplifies PCB layout while maximizing electrical performance, making it easy to integrate into designs.

Maximum Seated Height: 1.6 mm

The low seated height enables the creation of slim-profile devices, suitable for modern consumer electronics.

Width: 10 mm

The compact width allows efficient use of PCB space, which is essential for complex electronic devices.

Minimum Supply Voltage (Vsup): 2.3 V

The low minimum supply voltage allows this IC to be powered by a wider variety of power sources, enhancing its adaptability.

Length: 10 mm

A balanced length of 10 mm supports standard designs, ensuring ease of integration into various applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions signifies the IC's robustness and reliability in demanding environments.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and enhance mechanical stability in surface mount applications.

Maximum Supply Current: 18 mA

A moderate maximum supply current ensures efficient power consumption, making this IC suitable for battery-operated devices.

Terminal Pitch: 0.8 mm

The 0.8 mm pitch facilitates compact designs while maintaining reliable electrical connections, essential for high-density circuits.

Maximum Supply Voltage (Vsup): 5.5 V

The adequate maximum supply voltage allows this IC to interface with a broad range of power supply sources, enhancing versatility in application.

Technical Specifications

Other Function Consumer ICs TSH511CFT attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

18 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TSH511CFT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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