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TSB712IYST

STMicroelectronics

TSB712IYST by STMicroelectronics

TSB712IYST by STMicroelectronics is a dual operational amplifier designed for automotive applications, featuring a max input offset voltage of 1400 µV and a nominal voltage of 5 V. It operates within -40 °C to 125 °C, ensuring reliability in harsh environments. With a common mode reject ratio of 105 dB, it excels in precision signal processing.

Median Price

$2.035

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,942 parts In-Stock

1+ parts

$2.010

100+ parts

$1.200

1k+ parts

$1.040

10k+ parts

$0.995

3,942

$2.010

$1.200

$1.040

$0.995

DigiKey

USA . 1,435 parts In-Stock

1+ parts

$2.060

100+ parts

$1.238

1k+ parts

$1.127

10k+ parts

-

1,435

$2.060

$1.238

$1.127

-

Avnet

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 178 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

-

178

$1.900

-

-

-

Vyrian

USA . 4,788 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

4,788

$2.000

-

-

-

Flip Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Anansix

USA . 623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

623

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 752 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

752

$1.800

-

-

-

IDEA Electronic Components Group

UK . 1,528 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

$1.899

10k+ parts

-

1,528

$2.110

-

$1.899

-

Component Stockers USA

USA . 3,870 parts In-Stock

1+ parts

$2.150

100+ parts

$1.560

1k+ parts

$1.060

10k+ parts

-

3,870

$2.150

$1.560

$1.060

-

Vigor

Singapore . 2,992 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

-

10k+ parts

-

2,992

$2.450

-

-

-

MKK Technologies

India . 1,633 parts In-Stock

1+ parts

$3.969

100+ parts

-

1k+ parts

-

10k+ parts

-

1,633

$3.969

-

-

-

DigiPath Technology Company

USA . 1,633 parts In-Stock

1+ parts

$3.969

100+ parts

-

1k+ parts

-

10k+ parts

-

1,633

$3.969

-

-

-

Microchip USA

USA . 6,167 parts In-Stock

1+ parts

$10.208

100+ parts

-

1k+ parts

-

10k+ parts

-

6,167

$10.208

-

-

-

Perfect Parts

USA . 13,440 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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13,440

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

-

Parana Technologies

USA . 989 parts In-Stock

1+ parts

-

100+ parts

$2.523

1k+ parts

-

10k+ parts

-

989

-

$2.523

-

-

Overview

Elevate your designs with the TSB712IYST by STMicroelectronics, a premier operational amplifier crafted for excellence. Renowned for its robust automotive-grade quality and precision, this Op Amp ensures superior performance across various applications, from industrial control to advanced automotive systems. With its compact design and low power consumption, you gain efficiency without sacrificing reliability—making it the smart choice for innovators seeking quality and innovation in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stress, making it suitable for automotive applications.

Maximum Input Offset Voltage: 1400 uV

A low input offset voltage enhances accuracy in signal processing, positioning this op-amp as reliable for precision tasks.

Maximum Average Bias Current (IIB): 0.9 uA

A low bias current minimizes power consumption and enhances battery life in low-power applications.

Surface Mount: YES

Surface mount compatibility allows for easier integration into compact and modern circuit designs.

No. of Functions: 2

Having multiple functions allows the device to be versatile and efficient in handling various operational tasks.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability, making this op-amp a solid choice for automotive environments.

Package Shape: SQUARE

The square shape provides efficient PCB space usage, enabling more compact designs.

Nominal Common Mode Reject Ratio: 105 dB

A high common mode rejection ratio improves performance in noisy environments, ensuring signal integrity.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard, making it easy to integrate into most electronic circuits.

No. of Terminals: 8

Having 8 terminals facilitates various connection options and increases flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for high-density circuit layouts, ideal for space-constrained applications.

Maximum Supply Voltage Limit: 40 V

A high supply voltage limit supports a wide range of applications, enhancing versatility in design.

Maximum Operating Temperature: 125 °C

Operating at high temperatures ensures reliability in harsh environments, suitable for automotive use.

Minimum Operating Temperature: -40 °C

Withstanding low temperatures makes this op-amp reliable in extreme weather conditions.

Terminal Position: DUAL

Dual terminal positioning provides flexible mounting options for various circuit designs.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a slim profile, ideal for compact electronic products.

Width: 3 mm

A width of 3 mm supports space efficiency in PCB design, beneficial for miniaturization.

Length: 3 mm

A matching length also aids in compact design, making it appropriate for tight spaces.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring it meets stringent industry standards.

Nominal Unity Gain Bandwidth: 6000 kHz

A high bandwidth allows for effective signal amplification across a range of frequencies, enhancing performance.

Terminal Form: GULL WING

Gull wing terminals provide stable and secure connection points, facilitating reliable assembly in PCB manufacturing.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile for various signal processing applications, from filters to signal conditioning.

Packing Method: TR

Tape and reel packing method is convenient for automatic assembly processes, improving manufacturing efficiency.

Nominal Slew Rate: 2.7 V/us

A high slew rate supports fast signal changes, making it suitable for dynamic applications.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for tighter packing on the PCB, which is critical in modern electronics.

Technical Specifications

Operational Amplifiers (Op Amps) TSB712IYST attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

6 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

105 dB

Input Offset Voltage Limit:

1400 uV

Nominal Slew Rate:

2.7 V/us

Peak Bias Current:

900 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

40 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

TSB712IYST Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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