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TS982DWT

STMicroelectronics

TS982DWT by STMicroelectronics

TS982DWT by STMicroelectronics is a dual operational amplifier ideal for automotive applications. It features a max input offset voltage of 5000 µV, a nominal CMRR of 75 dB, and operates within -40 °C to 125 °C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

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3

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1k+

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Digiode

USA . 4,617 parts In-Stock

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4,617

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Vyrian

USA . 2,870 parts In-Stock

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2,870

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Anansix

USA . 564 parts In-Stock

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564

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IDEA Electronic Components Group

UK . 1,930 parts In-Stock

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$1.638

100+ parts

-

1k+ parts

$1.474

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1,930

$1.638

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$1.474

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MKK Technologies

India . 1,921 parts In-Stock

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$3.079

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$3.079

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DigiPath Technology Company

USA . 1,921 parts In-Stock

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$3.079

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1,921

$3.079

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Corphita

USA . 2,713 parts In-Stock

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2,713

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Parana Technologies

USA . 824 parts In-Stock

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$1.958

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$1.958

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Overview

Unleash the power of precision with the TS982DWT operational amplifier from STMicroelectronics. Renowned for its quality and innovation, STMicroelectronics delivers reliability in every application, from automotive systems to high-performance industrial equipment. The TS982DWT combines low power consumption with exceptional performance, ensuring your designs achieve optimal efficiency and responsiveness. Elevate your projects with this versatile op-amp that’s engineered to exceed expectations and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and provides excellent protection against environmental factors.

Maximum Input Offset Voltage: 5000 uV

A low input offset voltage ensures better accuracy in signal processing, making this op-amp suitable for precision applications.

Maximum Average Bias Current (IIB): 0.5 uA

A low bias current reduces the error in signal amplification, which is crucial for high-performance circuits.

Surface Mount: YES

Surface mount technology allows for compact designs, higher density of circuit components, and automated assembly.

No. of Functions: 2

Having two functions offers versatility, enabling more complex circuit designs with fewer components.

Package Shape: RECTANGULAR

The rectangular shape allows for space-efficient layouts on PCBs, promoting better design flexibility.

Nominal Common Mode Reject Ratio: 75 dB

A high CMRR improves the op-amp's ability to reject noise and common-mode signals, enhancing signal integrity.

Nominal Supply Voltage / Vsup (V): 2.7

A low nominal supply voltage allows operation in battery-powered devices, maximizing energy efficiency.

Power Supplies (V): 3/5

Supports both 3V and 5V supply, offering flexibility in various application scenarios.

No. of Terminals: 8

Eight terminals provide ample connectivity options for various configurations and external components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline with heat sink capability aids in thermal management, allowing for stable operation at high speeds.

Minimum Slew Rate: 0.42 V/us

A higher slew rate enables the op-amp to handle faster signal transitions, making it suitable for dynamic applications.

Maximum Supply Voltage Limit: 6 V

A maximum supply voltage of 6V expands its compatibility with various circuit designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes it suitable for automotive and industrial applications where thermal conditions can be extreme.

Maximum Bias Current (IIB) @25 °C: 0.5 uA

Low bias current at standard temperature ensures consistent performance across varying conditions.

Frequency Compensation: YES

In-built frequency compensation helps maintain stability across a range of operating frequencies.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures is essential for outdoor and extreme environment applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finishes ensure reliable connections and improved overall solderability.

Terminal Position: DUAL

Dual terminal positions allow for flexible circuit layout and better integration into complex PCBs.

Maximum Seated Height: 1.75 mm

A compact seated height makes it suitable for space-constrained designs without compromising performance.

Width: 3.9 mm

Narrow width facilitates placement in tighter spaces on PCBs, aiding in miniaturization of electronic devices.

Length: 4.9 mm

A compact length is ideal for high-density applications, helping save PCB real estate.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance under rigorous conditions.

Maximum Negative Supply Voltage Limit: 0 V

A limit of 0V for the negative supply provides design simplicity and stability in circuits.

Nominal Unity Gain Bandwidth: 2000 kHz

A high bandwidth ensures that the op-amp can efficiently handle a wide range of frequencies, enhancing performance in signal processing.

Technology: BIPOLAR

Bipolar technology offers improved speed and bandwidth compared to other technologies, making it ideal for high-performance applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier PCB assembly and provide reliable electrical connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components essential for various analog applications including filtering, signal conditioning, and amplification.

Maximum Supply Current: 7.2 mA

This op-amp operates efficiently with a relatively low supply current, making it suitable for battery-powered devices.

Nominal Negative Supply Voltage (Vsup): 0 V

A nominal negative supply voltage of 0V indicates ease of operation and design simplicity.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides good stability and performance in a variety of applications.

Packing Method: TAPE AND REEL

Tape and reel packaging allows for efficient handling and automated assembly in high-volume production.

Nominal Slow Rate: 0.65 V/us

A moderate slew rate ensures that the op-amp can handle signal changes smoothly, reducing distortion.

Terminal Pitch: 1.27 mm

A standard terminal pitch enhances compatibility with various PCB designs and simplifies layout considerations.

Technical Specifications

Operational Amplifiers (Op Amps) TS982DWT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

5000 uV

Minimum Slew Rate:

0.42 V/us

Nominal Slew Rate:

0.65 V/us

Peak Bias Current:

500 nA

Maximum Bias Current (IIB) @25 °C:

500 nA

Operational Characteristics

Nominal Supply Voltage:

2.7 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

7.2 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS982DWT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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