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TS974ID

STMicroelectronics

TS974ID by STMicroelectronics

TS974ID by STMicroelectronics is a versatile operational amplifier featuring a max input offset voltage of 7mV, low bias current of 1µA, and an impressive common mode reject ratio of 85 dB. It’s ideal for automotive applications due to its wide temp range (-40 °C to 125°C). This compact SMD device ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

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Digiode

USA . 4,292 parts In-Stock

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Vyrian

USA . 3,875 parts In-Stock

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3,875

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Anansix

USA . 791 parts In-Stock

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791

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Cyclops Electronics Ltd

UK . 527 parts In-Stock

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Ashlea Components Ltd

UK . 34 parts In-Stock

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34

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Component Sense

UK . 30 parts In-Stock

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Zilex Electronics Inc.

Canada . 26 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 196 parts In-Stock

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$3.360

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$3.024

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196

$3.360

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$3.024

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$4.095

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$3.726

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$3.358

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100

$4.095

$3.726

$3.358

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MKK Technologies

India . 1,826 parts In-Stock

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$6.318

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$6.318

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DigiPath Technology Company

USA . 1,826 parts In-Stock

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$6.318

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Microchip USA

USA . 270 parts In-Stock

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$6.751

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270

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AZTECH Wire

Italy . 761 parts In-Stock

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$20.790

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Vigor

Singapore . 8,730 parts In-Stock

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Perfect Parts

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Corphita

USA . 2,850 parts In-Stock

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Parana Technologies

USA . 1,742 parts In-Stock

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$4.017

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Kepictronics

USA . 666 parts In-Stock

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Assy Fe

Spain . 130 parts In-Stock

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Overview

Elevate your designs with the TS974ID operational amplifier from STMicroelectronics, a leader in innovation and reliability. This versatile op-amp delivers exceptional performance with ultra-low bias currents and impressive common-mode rejection, making it perfect for automotive applications and more. Its compact design ensures seamless integration into your projects, while STMicroelectronics’ commitment to quality guarantees long-lasting value. Experience precision and efficiency like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection for the operational amplifier, making it suitable for various environments.

Maximum Input Offset Voltage: 7000 uV

A low input offset voltage ensures precise signal amplification, improving overall system accuracy.

Maximum Average Bias Current (IIB): 1 uA

Low bias current contributes to lower power consumption, enhancing the efficiency of battery-operated devices.

Surface Mount: YES

Surface mount technology allows for compact designs and better performance, ideal for modern electronics.

No. of Functions: 4

Multiple functions offer versatility in applications, making this op amp a valuable component in complex circuits.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB layout and space utilization.

Nominal Common Mode Reject Ratio: 85 dB

A high common mode reject ratio ensures excellent performance in noisy environments by filtering out common noise signals.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5 V is compatible with a wide range of digital and analog circuits.

Power Supplies (V): +-2.5

Dual supply voltage allows for symmetrical signal processing, essential for AC signals.

No. of Terminals: 14

Having 14 terminals provides multiple connection options, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline packages enable high-density designs, saving space on printed circuit boards.

Minimum Slew Rate: 2.8 V/us

A minimum slew rate of 2.8 V/us enables the amplifier to respond quickly to rapid signal changes, suitable for high-speed applications.

Maximum Supply Voltage Limit: 6 V

A maximum supply voltage limit of 6 V provides flexibility for various application requirements while ensuring safe operation.

Maximum Operating Temperature: 125 °C

An operating temperature up to 125 °C makes this op amp ideal for automotive and high-temperature applications.

Maximum Bias Current (IIB) @25°C: 0.75 uA

Very low bias current at 25 °C enhances performance in precision analog applications and reduces offset errors.

Frequency Compensation: YES

Built-in frequency compensation enhances stability and makes the amplifier easier to use in feedback applications.

Minimum Voltage Gain: 3160

A minimum voltage gain of 3160 provides strong amplification capabilities, making it ideal for a variety of signal processing tasks.

Minimum Operating Temperature: -40 °C

Operating temperatures as low as -40 °C enhance suitability for harsh environments, especially in automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish ensures excellent solderability and long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning simplifies layout and integration into complex circuits.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows for compact designs while maintaining performance.

Width: 3.9 mm

Width of 3.9 mm is suited for applications where space is a premium.

Maximum Time At Peak Reflow Temperature (s): 40

Ability to withstand peak reflow temperature for up to 40 seconds ensures reliability during assembly processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C accommodates various soldering techniques, essential for modern manufacturing.

Length: 8.65 mm

Length of 8.65 mm is optimized for space-saving applications while maintaining functional integrity.

Temperature Grade: AUTOMOTIVE

Automotive grade indicates reliability and durability for automotive applications, ensuring performance under challenging conditions.

Maximum Negative Supply Voltage Limit: -6 V

The ability to handle a maximum negative supply of -6 V allows operation in a broader range of applications.

Nominal Unity Gain Bandwidth: 12000 kHz

A high unity gain bandwidth of 12000 kHz enhances performance in fast signal applications.

Technology: BIPOLAR

Bipolar technology provides improved performance characteristics, such as better linearity and lower distortion.

Terminal Form: GULL WING

Gull wing terminals are ideal for easy soldering and assembly, enhancing manufacturability.

Amplifier Type: OPERATIONAL AMPLIFIER

As a standard operational amplifier, it's versatile for a wide range of applications such as amplification, filtering, and signal conditioning.

Maximum Supply Current: 11.2 mA

Max supply current of 11.2 mA allows for robust performance while maintaining low power consumption.

Nominal Negative Supply Voltage (Vsup): -2.5 V

Providing a nominal negative supply voltage of -2.5 V adds to the flexibility for dual supply applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture ensures stability and is widely used in accurate analog signal applications.

Packing Method: TUBE

Packed in tubes ensures easy handling in manufacturing and protects components from damage during transport.

Nominal Slow Rate: 4 V/us

A nominal slow rate of 4 V/us is suitable for applications where moderate speed is adequate, delivering stability and reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between versatility and ease of integration into various PCBs.

Technical Specifications

Operational Amplifiers (Op Amps) TS974ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±2.5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

12 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

7000 uV

Minimum Voltage Gain:

3160

Minimum Slew Rate:

2.8 V/us

Nominal Slew Rate:

4 V/us

Peak Bias Current:

1 uA

Maximum Bias Current (IIB) @25 °C:

750 nA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

11.2 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TS974ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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