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TS9224ID

STMicroelectronics

TS9224ID by STMicroelectronics

TS9224ID by STMicroelectronics is a versatile operational amplifier featuring a low input offset voltage of 900 µV, a nominal voltage of 3 V, and an impressive common mode reject ratio of 85 dB. Ideal for automotive applications, it operates efficiently across -40 °C to 125°C. Its compact design with 14 terminals ensures easy integration in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,958 parts In-Stock

1+ parts

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2,958

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Vyrian

USA . 1,944 parts In-Stock

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1,944

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Anansix

USA . 1,629 parts In-Stock

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1,629

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 969 parts In-Stock

1+ parts

$1.906

100+ parts

-

1k+ parts

$1.716

10k+ parts

-

969

$1.906

-

$1.716

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MKK Technologies

India . 2,219 parts In-Stock

1+ parts

$3.585

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-

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2,219

$3.585

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DigiPath Technology Company

USA . 2,219 parts In-Stock

1+ parts

$3.585

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2,219

$3.585

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AZTECH Wire

Italy . 1,219 parts In-Stock

1+ parts

$17.990

100+ parts

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1,219

$17.990

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Microchip USA

USA . 234 parts In-Stock

1+ parts

$40.010

100+ parts

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234

$40.010

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Vigor

Singapore . 2,442 parts In-Stock

1+ parts

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2,442

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Corphita

USA . 1,576 parts In-Stock

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1,576

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Parana Technologies

USA . 881 parts In-Stock

1+ parts

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$2.279

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881

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$2.279

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Overview

Elevate your designs with the TS9224ID from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance operational amplifier boasts incredibly low offset voltage and unmatched power efficiency, making it ideal for precision applications across automotive, industrial, and consumer electronics. Experience seamless integration, superior reliability, and enhanced functionality that empower your projects to achieve new heights of quality and performance. Choose TS9224ID for outstanding results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making the op-amp suitable for a variety of applications.

Maximum Input Offset Voltage: 900 uV

A low input offset voltage enhances precision in signal amplification, making this op-amp ideal for sensitive applications requiring high accuracy.

Maximum Average Bias Current (IIB): 0.055 uA

The low bias current minimizes errors in signal processing, which is crucial for high-impedance applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs and automated production processes, improving manufacturability and saving space.

No. of Functions: 4

Multiple functions provide versatility, enabling a single op-amp to perform various roles in complex circuit designs.

Package Shape: RECTANGULAR

A rectangular package shape optimizes board layout and component placement, aiding in efficient circuit design.

Nominal Common Mode Reject Ratio: 85 dB

A high CMRR reduces the impact of noise and interference, making this op-amp a reliable choice for precision applications.

Nominal Supply Voltage / Vsup (V): 3

Designed for low supply voltage operation, this op-amp is suitable for battery-powered and energy-efficient applications.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies enhances flexibility in system design, accommodating different voltage requirements.

No. of Terminals: 14

The 14-terminal configuration allows for extensive connectivity options, making it adaptable to complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save PCB space and allows for high-density circuit designs.

Maximum Supply Voltage Limit: 14 V

A high maximum supply voltage limit offers design flexibility for various applications that may require higher voltage operation.

Maximum Operating Temperature: 125 °C

With a high operating temperature rating, this op-amp is suitable for automotive and other demanding environments.

Maximum Bias Current (IIB) @25°C: 0.055 uA

Consistent low bias current performance ensures reliable operation, maintaining accuracy even under varying temperature conditions.

Frequency Compensation: YES

Built-in frequency compensation reduces design complexity and enhances stability in feedback systems.

Minimum Voltage Gain: 1800

A high voltage gain indicates strong amplification capabilities, making it suitable for weak signal handling.

Minimum Operating Temperature: -40 °C

A wide operating temperature range enables use in harsh environments, increasing the versatility of the product.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures excellent solderability and corrosion resistance, contributing to long-term reliability.

Terminal Position: DUAL

Dual terminal position facilitates easy integration into various circuit layouts, improving design flexibility.

Low-Offset: YES

Low offset characteristics enhance the accuracy of signal amplification in sensitive applications, making it an attractive choice for precision tasks.

Maximum Seated Height: 1.75 mm

A low seated height allows for easier integration into compact designs, making it suitable for space-constrained applications.

Width: 3.9 mm

The compact width aids in efficient PCB layout, allowing for high-density designs.

Length: 8.65 mm

The small length enhances layout design flexibility, making it feasible for a variety of applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliable operation in extreme conditions typical of vehicle environments.

Nominal Unity Gain Bandwidth: 4000 kHz

A high unity gain bandwidth enhances the op-amp's ability to process high-frequency signals, ideal for advanced applications.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies, offering high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide good soldering characteristics, ensuring reliable electrical contacts and ease of handling.

Amplifier Type: OPERATIONAL AMPLIFIER

As a versatile operational amplifier, it can be used in a wide range of analog circuits and applications.

Maximum Supply Current: 5.2 mA

A moderate supply current ensures energy efficiency while still providing robust performance for operational needs.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is well-suited for a variety of applications, providing stability and predictable behavior in circuit designs.

Packing Method: TUBE

Tube packing makes handling and assembly easier, ensuring efficient use in manufacturing environments.

Nominal Slow Rate: 1.3 V/us

A reasonable slew rate allows for fast response in signal changes, making it suitable for dynamic applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard size that facilitates compatibility with various PCB layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TS9224ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

3/5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

900 uV

Minimum Voltage Gain:

1800

Nominal Slew Rate:

1.3 V/us

Peak Bias Current:

55 nA

Maximum Bias Current (IIB) @25 °C:

55 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

14 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

5.2 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TS9224ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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