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TS512AID-DT

STMicroelectronics

TS512AID-DT by STMicroelectronics

TS512AID-DT by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 1500 µV and a nominal voltage of ±15 V. It features a high common mode reject ratio of 90 dB, making it ideal for automotive applications. With an operating temp range from -40 °C to 125°C, it's suitable for demanding environments.

Median Price

-

Lifecycle Status

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3

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1k+

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Vyrian

USA . 2,893 parts In-Stock

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2,893

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Digiode

USA . 1,729 parts In-Stock

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1,729

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Anansix

USA . 936 parts In-Stock

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936

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IDEA Electronic Components Group

UK . 95 parts In-Stock

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$6.132

100+ parts

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$5.519

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95

$6.132

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$5.519

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MKK Technologies

India . 185 parts In-Stock

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$11.530

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185

$11.530

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DigiPath Technology Company

USA . 185 parts In-Stock

1+ parts

$11.530

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185

$11.530

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Parana Technologies

USA . 960 parts In-Stock

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$7.332

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960

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$7.332

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Corphita

USA . 394 parts In-Stock

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394

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Overview

Unlock a world of precision and efficiency with the TS512AID-DT operational amplifier from STMicroelectronics. Renowned for quality, STMicroelectronics delivers unmatched reliability in automotive applications, ensuring your designs thrive even in demanding environments. Enjoy micropower consumption and exceptional performance metrics that elevate signal processing capabilities. Choose the TS512AID-DT for seamless integration, enhanced functionality, and peace of mind in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making this Op Amp suitable for various applications.

Maximum Input Offset Voltage: 1500 uV

A low input offset voltage enhances accuracy in signal amplification, making the Op Amp ideal for precision applications.

Maximum Average Bias Current (IIB): 0.3 uA

The low bias current helps minimize error and drift in high-impedance applications, improving overall performance.

Surface Mount: YES

Surface mount capability enables easier integration into modern compact circuit designs, saving space and improving manufacturing efficiency.

Number of Functions: 2

Dual functionality allows for versatile applications, providing designers with flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout and assembly in PCB designs, optimizing space utilization.

Nominal Common Mode Reject Ratio: 90 dB

A high common mode rejection ratio ensures that the Op Amp can effectively ignore noise, enhancing signal integrity.

Nominal Supply Voltage / Vsup (V): 15

Standard supply voltage allows for compatibility with a wide range of systems and designs.

Power Supplies (V): ±15

Dual supply operation provides the necessary headroom for accurately amplifying both positive and negative signals.

Number of Terminals: 8

Having 8 terminals facilitates multiple connection options, making the part adaptable for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for placement in tighter layouts.

Minimum Slew Rate: 0.8 V/us

This slew rate supports fast signal changes, making the Op Amp suitable for high-speed applications.

Maximum Supply Voltage Limit: 18 V

The high maximum supply voltage limit provides flexibility in applications needing higher voltage operations.

Maximum Operating Temperature: 125 °C

High operating temperature rating guarantees reliability in demanding environments, such as automotive applications.

Maximum Bias Current (IIB) @25 °C: 0.15 uA

Very low bias current further reduces errors in applications with high-impedance sources, enhancing precision.

Frequency Compensation: YES

Built-in frequency compensation enables stable operation across a wide range of frequencies, reducing design complexity.

Minimum Voltage Gain: 31620

A high minimum voltage gain indicates strong amplification capability, suited for low-level signal processing.

Minimum Operating Temperature: -40 °C

Low temperature rating expands the range of applications in harsh environments, ensuring reliable performance.

Terminal Position: DUAL

Dual terminal positioning facilitates easier PCB design and layout, allowing for better thermal management.

Maximum Seated Height: 1.75 mm

Low height profile makes this part suitable for space-restricted designs without compromising performance.

Width: 3.9 mm

Compact width allows for high-density PCB designs, accommodating more components in a smaller area.

Micropower: YES

Micropower operation enhances battery life in portable applications, making it a great choice for energy-efficient designs.

Length: 4.9 mm

Short length contributes to compact designs, allowing integration into smaller electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade components ensure reliability and robustness under harsh operating conditions commonly found in vehicles.

Maximum Negative Supply Voltage Limit: -18 V

Ability to handle a negative supply voltage of -18 V provides additional design flexibility in specific applications.

Nominal Unity Gain Bandwidth: 3000 kHz

High unity gain bandwidth makes the Op Amp suitable for a wide range of applications, including fast feedback systems.

Technology: BIPOLAR

Bipolar technology offers better performance characteristics in terms of speed and power consumption for this Op Amp.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering, enhancing manufacturability and reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components, widely used in a variety of analog signal processing applications.

Maximum Supply Current: 1.5 mA

Low supply current enhances energy efficiency, making this Op Amp suitable for battery-powered devices.

Nominal Negative Supply Voltage (Vsup): -15 V

The nominal negative supply voltage of -15 V ensures compatibility with a range of applications requiring negative voltage.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture offers high linearity and bandwidth, ideal for a variety of signal processing tasks.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated pick-and-place assembly, improving production efficiency.

Nominal Slow Rate: 1.5 V/us

A nominal slow rate of 1.5 V/us allows for controlled response time, important for stable signal processing applications.

Terminal Pitch: 1.27 mm

The standard terminal pitch aids in compatibility with various PCB designs, making integration seamless.

Technical Specifications

Operational Amplifiers (Op Amps) TS512AID-DT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

1500 uV

Minimum Voltage Gain:

31620

Minimum Slew Rate:

0.8 V/us

Nominal Slew Rate:

1.5 V/us

Peak Bias Current:

300 nA

Maximum Bias Current (IIB) @25 °C:

150 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1.5 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS512AID-DT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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