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TS421IDT

STMicroelectronics

TS421IDT by STMicroelectronics

TS421IDT by STMicroelectronics is a compact audio amplifier designed for industrial applications, featuring a nominal output power of 0.367 W and operating temperature range from -40 °C to 85°C. It supports supply voltages b/w 2V and 5.5V, ensuring versatility in various setups. With an 8-terminal gull-wing package, it offers reliable performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,312 parts In-Stock

1+ parts

-

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3,312

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Anansix

USA . 2,515 parts In-Stock

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2,515

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R&J Components

USA . 2,444 parts In-Stock

1+ parts

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2,444

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Digiode

USA . 2,341 parts In-Stock

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2,341

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 680 parts In-Stock

1+ parts

$3.623

100+ parts

-

1k+ parts

$3.261

10k+ parts

-

680

$3.623

-

$3.261

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Andel Nordic

Denmark . 1,138 parts In-Stock

1+ parts

$5.981

100+ parts

-

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$5.742

10k+ parts

$5.742

1,138

$5.981

-

$5.742

$5.742

MKK Technologies

India . 2,332 parts In-Stock

1+ parts

$6.813

100+ parts

-

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2,332

$6.813

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DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$6.813

100+ parts

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2,332

$6.813

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AZTECH Wire

Italy . 1,140 parts In-Stock

1+ parts

$16.950

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1,140

$16.950

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Microchip USA

USA . 5,721 parts In-Stock

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5,721

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Vigor

Singapore . 3,143 parts In-Stock

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3,143

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Corphita

USA . 3,034 parts In-Stock

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3,034

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Parana Technologies

USA . 546 parts In-Stock

1+ parts

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100+ parts

$4.332

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546

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$4.332

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Overview

Elevate your audio experience with the TS421IDT from STMicroelectronics—a trusted leader in innovation and quality. This compact audio amplifier delivers impressive sound clarity while being designed for diverse applications, from consumer electronics to industrial systems. With its robust temperature range and efficient power consumption, you gain reliability and performance that enhance any project. Choose TS421IDT and unlock exceptional value for your audio needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material enhances durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs with reduced PCB space, enabling more flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and space management on the PCB, optimizing the design.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this product is specifically designed to enhance audio signals, ensuring high-quality sound performance.

Power Supplies (V): 2/5

A wide supply voltage range of 2 to 5V offers flexibility in integration with various power supply systems.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for various circuit configurations, allowing for versatile usage.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to compactness, supporting modern trends in miniaturized electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability and performance even in relatively high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C expands usage possibilities in harsh or extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish improves conductivity and enhances solderability, ensuring long-lasting connections.

Terminal Position: DUAL

Dual terminal positioning improves circuit layout flexibility and simplifies integration into different designs.

Nominal Output Power: 0.367 W

A nominal output power of 0.367 W makes it suitable for driving small speakers or headphones effectively.

Maximum Seated Height: 1.75 mm

With a low seated height, this amplifier is ideal for space-constrained applications without compromising performance.

Width: 3.9 mm

A compact width of 3.9 mm allows for high-density layouts, catering to modern electronic device designs.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage enhances compatibility with low-voltage systems, making it versatile for designers.

Length: 4.9 mm

Short length facilitates ease of placement and routing on PCBs, aiding in efficient design processes.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures robust performance in demanding environments, promoting reliability in various applications.

Technology: BIPOLAR

Bipolar technology offers excellent linearity and low distortion, essential for high-fidelity audio applications.

Nominal Bandwidth: 0.02 kHz

A wide bandwidth allows for handling a variety of audio frequencies, ensuring versatility in audio applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability on the PCB.

Maximum Supply Current: 2.5 mA

A low maximum supply current of 2.5 mA aids in power efficiency, making it suitable for battery-operated devices.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch strikes a balance between compactness and ease of handling during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

The generous maximum supply voltage of 5.5 V allows for compatibility with a wide range of power sources.

Technical Specifications

Audio & Video Amplifiers TS421IDT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.367 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TS421IDT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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