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TS421ID

STMicroelectronics

TS421ID by STMicroelectronics

TS421ID by STMicroelectronics is a compact audio amplifier designed for industrial applications, featuring a nominal output power of 0.367 W and operating temperature range from -40 °C to 85°C. It supports supply voltages b/w 2V and 5.5V with a max current of 2.5 mA. Its small outline package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,552 parts In-Stock

1+ parts

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7,552

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Digiode

USA . 3,129 parts In-Stock

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3,129

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Anansix

USA . 2,871 parts In-Stock

1+ parts

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2,871

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 159 parts In-Stock

1+ parts

$0.889

100+ parts

-

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159

$0.889

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IDEA Electronic Components Group

UK . 2,192 parts In-Stock

1+ parts

$1.265

100+ parts

-

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$1.138

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-

2,192

$1.265

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$1.138

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MKK Technologies

India . 1,505 parts In-Stock

1+ parts

$2.379

100+ parts

-

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1,505

$2.379

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DigiPath Technology Company

USA . 1,505 parts In-Stock

1+ parts

$2.379

100+ parts

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1,505

$2.379

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AZTECH Wire

Italy . 232 parts In-Stock

1+ parts

$9.940

100+ parts

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232

$9.940

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QUARKTWIN TECHNOLOGY LTD

USA . 26,644 parts In-Stock

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26,644

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,841 parts In-Stock

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1,841

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Parana Technologies

USA . 1,505 parts In-Stock

1+ parts

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100+ parts

$1.512

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1,505

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$1.512

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Overview

Elevate your audio experience with the TS421ID from STMicroelectronics, a leader in innovative technology. This compact audio amplifier delivers superior sound quality while ensuring reliability across diverse industrial applications. With its robust design and exceptional thermal performance, it thrives in demanding environments. Trust in STMicroelectronics for unparalleled value, enhancing your projects with efficient power management and impressive output, making every listening moment extraordinary!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protects the internal components from environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for easy integration into modern compact electronic circuit designs, saving space and simplifying manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for efficient space usage on PCBs and facilitates straightforward placement during the assembly process.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is specifically designed for high-quality audio performance, making it an excellent choice for audio applications.

Power Supplies (V): 2/5

A dual supply voltage capability (2V to 5V) provides flexibility in powering the amplifier, catering to various electronic designs and requirements.

No. of Terminals: 8

With 8 terminals, the amplifier can support multiple connections for input, output, and power supply, allowing for versatile integration in circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained applications, enabling the design of more compact devices.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C ensures reliable performance in high-thermal environments, which is critical for industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows this audio amplifier to function in extreme low-temperature conditions, enhancing its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish improves connectivity and signal integrity, contributing to better performance and reliability over time.

Terminal Position: DUAL

Dual terminal positioning offers design flexibility and simplifies PCB layout, making the integration process smoother.

Nominal Output Power: 0.367 W

A nominal output power of 0.367 W is effective for driving small speakers or providing audio amplification in compact devices.

Maximum Seated Height: 1.75 mm

The low maximum seated height ensures that the amplifier can fit in compact, low-profile designs while maintaining performance.

Width: 3.9 mm

A width of 3.9 mm supports dense circuit layouts and provides versatility in design without compromising the performance of the amplifier.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V makes the amplifier suitable for battery-powered devices, enhancing energy efficiency.

Length: 4.9 mm

The compact length of 4.9 mm allows for efficient use of PCB space, accommodating more components in the same layout.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies reliability in demanding conditions, ensuring the amplifier's consistent performance in tough environments.

Technology: BIPOLAR

The bipolar technology utilized in this amplifier provides excellent linearity and fidelity, which is crucial for high-quality audio amplification.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz indicates the ability to produce deep bass frequencies, making it an exceptional choice for audio applications that require rich sound.

Terminal Form: GULL WING

The gull wing terminal form facilitates strong connections to PCBs, ensuring robust electrical performance and mechanical stability.

Maximum Supply Current: 2.5 mA

With a maximum supply current of just 2.5 mA, the amplifier promotes low power consumption, making it ideal for energy-efficient applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports precise soldering and compatibility with standard mounting practices, facilitating easier design and manufacturing processes.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power management, allowing for broader application in varying circuit designs.

Technical Specifications

Audio & Video Amplifiers TS421ID attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.367 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TS421ID General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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