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TS393MDT

STMicroelectronics

TS393MDT by STMicroelectronics

TS393MDT by STMicroelectronics is a dual comparator in a compact SO package, ideal for military applications. It features a max input offset voltage of 6.5 mV, operates from -55 °C to 125 °C, and supports supply voltages up to 18 V. Its open-drain output ensures versatility in circuit design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,100 parts In-Stock

1+ parts

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6,100

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Digiode

USA . 4,977 parts In-Stock

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4,977

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Anansix

USA . 1,491 parts In-Stock

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1,491

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,076 parts In-Stock

1+ parts

$0.601

100+ parts

-

1k+ parts

$0.541

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-

1,076

$0.601

-

$0.541

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MKK Technologies

India . 1,333 parts In-Stock

1+ parts

$1.130

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1,333

$1.130

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DigiPath Technology Company

USA . 1,333 parts In-Stock

1+ parts

$1.130

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1,333

$1.130

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Ampacity Inc.

Singapore . 644 parts In-Stock

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$1.410

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644

$1.410

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Microchip USA

USA . 184 parts In-Stock

1+ parts

$2.790

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184

$2.790

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AZTECH Wire

Italy . 742 parts In-Stock

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$10.330

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742

$10.330

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Component Stockers USA

USA . 590 parts In-Stock

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$99.990

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590

$99.990

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Vigor

Singapore . 5,061 parts In-Stock

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Corphita

USA . 430 parts In-Stock

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430

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Parana Technologies

USA . 400 parts In-Stock

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$0.718

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400

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$0.718

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Overview

Unlock unparalleled precision with the TS393MDT from STMicroelectronics, a leading name in high-performance electronics. This dual comparator delivers exceptional accuracy and low power consumption, making it ideal for automotive, industrial, and consumer applications. With its robust design and military-grade reliability, the TS393MDT ensures optimal performance even in extreme conditions. Elevate your projects with this trusted solution that combines quality, innovation, and dependability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and insulation, making this comparator suitable for various environments.

Maximum Input Offset Voltage: 6500 uV

A low input offset voltage ensures better accuracy and precision in signal processing, making it a reliable choice for critical applications.

Maximum Average Bias Current (IIB): 0.0006 uA

The extremely low bias current contributes to power efficiency and enhances battery life in portable applications.

Surface Mount: YES

The surface mount design facilitates compact PCB layouts, saving space and improving performance in high-density applications.

Number of Functions: 2

Having two functions allows for multitasking capabilities within the same package, optimizing design resources.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space usage on the PCB, allowing for better placement and routing flexibility.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is standard in many applications, enhancing compatibility with existing systems.

Power Supplies (V): 5

Supports a 5V power supply, making it easy to integrate into various electronic circuits.

Number of Terminals: 8

An 8-terminal configuration provides sufficient connection points for diverse circuit integration without clutter.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained designs, enabling use in compact devices.

Maximum Supply Voltage Limit: 18 V

A high supply voltage limit provides flexibility in design while ensuring robust performance under varying conditions.

Maximum Operating Temperature: 125 °C

The ability to operate safely at high temperatures makes it suitable for demanding industrial and military applications.

Output Type: OPEN-DRAIN

An open-drain output allows for flexible interfacing with various logic levels, enhancing versatility in design.

Nominal Response Time: 1500 ns

A nominal response time of 1500 ns ensures fast processing of signals, making it effective in high-speed applications.

Minimum Operating Temperature: -55 °C

The capability to function at low temperatures makes this comparator suitable for harsh environments, including aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical performance over time.

Terminal Position: DUAL

Dual terminal position allows for better orientation in circuit design, improving layout efficiency.

Maximum Seated Height: 1.75 mm

A low seated height reduces the overall profile of the device, making it compatible with low-height designs.

Width: 3.9 mm

A compact width ensures efficient use of PCB space and facilitates high-density integration.

Length: 4.9 mm

A short length enhances the versatility of placement within confined spaces, ideal for compact electronic devices.

Temperature Grade: MILITARY

Military-grade temperature reliability ensures consistent performance under extreme conditions, making it suitable for defense applications.

Maximum Negative Supply Voltage Limit: -18 V

High negative supply voltage capability increases operational flexibility in diverse circuit applications.

Technology: CMOS

CMOS technology contributes to low power consumption and high-speed operations, making it energy-efficient.

Terminal Form: GULL WING

The gull wing terminal design facilitates easy soldering and reliable connections in automated assembly processes.

Amplifier Type: COMPARATOR

As a comparator, this device is specifically designed for signal comparison, ensuring optimal performance for various sensing applications.

Maximum Supply Current: 0.05 mA

The low supply current further enhances energy efficiency, making it suitable for battery-operated devices.

Nominal Negative Supply Voltage (Vsup): 0 V

With a nominal negative supply voltage of 0V, it integrates seamlessly into circuits requiring dual supply configurations.

Terminal Pitch: 1.27 mm

A standard terminal pitch simplifies PCB design and component placement, facilitating easier manufacturing processes.

Technical Specifications

Comparators TS393MDT attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Operational Characteristics

Maximum Supply Current:

50 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

1.5 µs

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS393MDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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