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TL7705ACD1013TRA

STMicroelectronics

TL7705ACD1013TRA by STMicroelectronics

TL7705ACD1013TRA by STMicroelectronics is a Power Management IC with 8 terminals, operating voltage range of 3.6-18V, and max supply current of 3.3mA. It is used in power supply support circuits for commercial applications due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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ComSIT USA

USA . 5,097 parts In-Stock

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PC Components Company LLC

USA . 4,116 parts In-Stock

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Bristol Electronics

USA . 4,116 parts In-Stock

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Vyrian

USA . 4,024 parts In-Stock

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Digiode

USA . 3,263 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,685 parts In-Stock

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Magnum Semiconductors LLP

India . 2,500 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 2,500 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 1,912 parts In-Stock

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Pegasus Components GmbH

Germany . 500 parts In-Stock

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500

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Anansix

USA . 170 parts In-Stock

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170

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Nova Conductors

Japan . 150 parts In-Stock

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150

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IDEA Electronic Components Group

UK . 2,267 parts In-Stock

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$1.209

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$1.088

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$1.209

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$1.088

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Corohmni

South Africa . 109 parts In-Stock

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$1.278

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$1.278

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MKK Technologies

India . 241 parts In-Stock

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$2.273

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241

$2.273

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DigiPath Technology Company

USA . 241 parts In-Stock

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$2.273

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$2.273

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Semicontronic

India . 678 parts In-Stock

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$3.500

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$3.412

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$3.395

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678

$3.500

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$3.395

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Aztec Data Supply Inc.

USA . 142 parts In-Stock

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$4.142

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$4.142

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Ampacity Inc.

Singapore . 311 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 873 parts In-Stock

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$12.637

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$12.637

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Microchip USA

USA . 299 parts In-Stock

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$15.750

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$15.750

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$15.750

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$15.750

299

$15.750

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$15.750

A-Z Elektronik GmbH

Germany . 5,784 parts In-Stock

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Corphita

USA . 4,197 parts In-Stock

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Argo Parts USA

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 3,500 parts In-Stock

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Lixinc

USA . 2,911 parts In-Stock

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Continental Prestige Electronics

USA . 2,789 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Kepictronics

USA . 2,084 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Parana Technologies

USA . 401 parts In-Stock

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$1.445

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience top-notch power management with the TL7705ACD1013TRA by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers high-quality products that exceed expectations. This power management IC is perfect for a wide range of applications, providing efficient and reliable performance. With a compact design and superior technology, this product offers customers unmatched value, benefits, and advantages. Trust STMicroelectronics to meet all your power management needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for power management.

Surface Mount: YES

This feature allows for easy installation and saves space on the PCB, making the product suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular shape provides compatibility with standard PCB layouts, simplifying the integration process.

Power Supplies (V): 3.6/18

This wide range of power supply voltages makes the IC versatile and compatible with a variety of applications.

No. of Terminals: 8

With a sufficient number of terminals, this IC offers flexibility in connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables efficient heat dissipation.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand demanding operating conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall reliability of the IC.

Terminal Position: DUAL

The dual terminal position allows for multiple connection options, increasing the flexibility of the IC in different circuit configurations.

Technical Specifications

Power Management ICs TL7705ACD1013TRA attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.6/18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

3.3 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55V

Width (mm):

3.9 mm

Trade Compliance

TL7705ACD1013TRA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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