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TJM4558CPT

STMicroelectronics

TJM4558CPT by STMicroelectronics

TJM4558CPT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 6mV and a common mode reject ratio of 70 dB. It operates on ±15V supply, ideal for precision signal processing in compact applications. Its small outline package ensures efficient space utilization.

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Anansix

USA . 1,680 parts In-Stock

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1,680

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Vyrian

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IDEA Electronic Components Group

UK . 1,601 parts In-Stock

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MKK Technologies

India . 292 parts In-Stock

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DigiPath Technology Company

USA . 292 parts In-Stock

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292

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Corphita

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Parana Technologies

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410

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Overview

Experience superior performance with the TJM4558CPT operational amplifier from STMicroelectronics. Renowned for its exceptional quality, this versatile op-amp excels in a variety of applications, from audio processing to signal conditioning. With low bias current and high common-mode rejection, it ensures precision in your circuits. Trust in STMicroelectronics' legacy of innovation to enhance your designs, delivering reliability that you can count on every time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protection for the internal components, making it suitable for various environments.

Maximum Input Offset Voltage: 6000 uV

A maximum input offset voltage of 6000 uV ensures that the op-amp maintains accuracy in low-signal applications, which is crucial for precision circuits.

Maximum Average Bias Current (IIB): 0.4 uA

With a low average bias current of 0.4 uA, this op-amp is ideal for battery-operated devices and applications requiring minimal power consumption.

Surface Mount: YES

The surface mount design allows for compact layouts and is compatible with modern PCB designs, making it easy to integrate into various systems.

No. of Functions: 2

Having dual functionalities enhances design flexibility, allowing the op-amp to handle multiple tasks within a single package.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient space utilization on PCB layouts.

Nominal Common Mode Reject Ratio: 70 dB

A common mode reject ratio of 70 dB aids in rejecting noise, enhancing signal integrity in noisy environments.

Nominal Supply Voltage / Vsup (V): 15

A nominal supply voltage of 15V provides compatibility with standard power supply voltages often used in electronic devices.

Power Supplies (V): ±15

Dual power supplies of ±15V enhance versatility, enabling use in differential applications without compromising performance.

No. of Terminals: 8

An 8-terminal configuration allows for complete functionality while remaining compact for space-constrained applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is ideal for high-density applications, providing a thin profile that helps save space on PCBs.

Maximum Supply Voltage Limit: 22 V

A maximum supply voltage limit of 22V allows for compatibility with a wide variety of system voltages, increasing its application range.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this op-amp can function effectively in moderately warm environments.

Maximum Bias Current (IIB) @25 °C: 0.4 uA

Maintaining a bias current of 0.4 uA at 25 °C preserves energy efficiency, crucial for low-power applications.

Frequency Compensation: YES

Built-in frequency compensation enhances stability in feedback configurations, making it suitable for high-frequency applications.

Minimum Voltage Gain: 25000

A minimum voltage gain of 25000 indicates high amplification performance, making it suitable for applications requiring significant signal enhancement.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this op-amp can function in a range of ambient conditions, enhancing its usability.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality nickel palladium gold finish ensures excellent solderability and enhances reliability over long-term use.

Terminal Position: DUAL

Dual terminal positioning simplifies circuit layout in PCB designs and improves ease of assembly.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm makes it ideal for compact designs while ensuring that it fits standard footprints.

Width: 3 mm

A compact width of 3 mm supports high-density designs, allowing for smaller overall product dimensions.

Length: 4.4 mm

The short length accommodates tighter spacing on PCBs, optimizing design layouts.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, it suits non-industrial applications while maintaining reliable performance.

Maximum Negative Supply Voltage Limit: -22 V

This capability allows the op-amp to work efficiently in applications requiring greater negative biasing.

Nominal Unity Gain Bandwidth: 5500 kHz

A high unity gain bandwidth of 5500 kHz offers versatility in signal processing for a range of applications, ensuring fast response times.

Technology: BIPOLAR

Bipolar technology provides low noise and high-speed performance, making this op-amp suitable for applications in audio and RF circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering in automatic assembly processes, improving production efficiency.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it is versatile and widely used in various analog applications, ranging from signal conditioning to filtering.

Maximum Supply Current: 4.5 mA

A maximum supply current of 4.5 mA indicates low power consumption, making it ideal for battery-powered applications.

Nominal Negative Supply Voltage (Vsup): -15 V

Providing a nominal negative supply voltage of -15V supports a variety of operational configurations, including differential signal processing.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture ensures linearity and stability across a wide range of applications, enhancing its performance.

Packing Method: TAPE AND REEL

The tape and reel packaging method allows for automated assembly and easy handling in mass production environments.

Nominal Slow Rate: 2.2 V/µs

A nominal slow rate of 2.2 V/µs allows for good transient response, making it suitable for applications needing a balance between speed and stability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm aids in the design of compact PCBs while ensuring reliable connectivity.

Technical Specifications

Operational Amplifiers (Op Amps) TJM4558CPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

25000

Nominal Slew Rate:

2.2 V/us

Peak Bias Current:

400 nA

Maximum Bias Current (IIB) @25 °C:

400 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

4.5 mA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TJM4558CPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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