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TDA7577LVPDTR

STMicroelectronics

TDA7577LVPDTR by STMicroelectronics

TDA7577LVPDTR by STMicroelectronics is a 2-function audio amplifier with 36 terminals. It operates b/w -40 to 105 °C, suitable for industrial applications. With a power supply of 14.4V, it comes in a small outline package ideal for surface mount assembly in audio and video amplifiers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,622 parts In-Stock

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3,622

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Digiode

USA . 1,789 parts In-Stock

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1,789

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LIBRA Elektronik GmbH

Germany . 1,194 parts In-Stock

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1,194

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Anansix

USA . 926 parts In-Stock

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926

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,365 parts In-Stock

1+ parts

$2.624

100+ parts

-

1k+ parts

$2.361

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2,365

$2.624

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$2.361

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MKK Technologies

India . 2,263 parts In-Stock

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$4.934

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2,263

$4.934

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DigiPath Technology Company

USA . 2,263 parts In-Stock

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$4.934

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2,263

$4.934

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Microchip USA

USA . 2,085 parts In-Stock

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$5.410

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2,085

$5.410

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AZTECH Wire

Italy . 589 parts In-Stock

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$14.100

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589

$14.100

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RC Electronics

USA . 6,358 parts In-Stock

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6,358

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Kepictronics

USA . 5,300 parts In-Stock

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5,300

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,309 parts In-Stock

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$3.137

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1,309

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$3.137

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Overview

Elevate your audio experience with the TDA7577LVPDTR by STMicroelectronics. Designed with precision and quality in mind, this audio amplifier offers unmatched performance and reliability. Perfect for a wide range of applications in the audio and video industry, this product delivers crystal-clear sound and powerful amplification. With its innovative design and advanced features, customers can expect nothing but excellence when using the TDA7577LVPDTR. Upgrade your audio systems today and enjoy the benefits of superior quality and exceptional value that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the amplifier, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving integration into electronic devices.

No. of Functions: 2

Having multiple functions in one amplifier allows for versatility in audio applications, making it a versatile choice.

Package Shape: RECTANGULAR

The rectangular shape simplifies mounting and placement of the amplifier in electronic devices.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification, ensuring high-quality sound output for various audio devices.

Power Supplies (V): 14.4

Operates at a voltage suitable for audio amplification, providing reliable power to drive speakers or headphones.

No. of Terminals: 36

Having a higher number of terminals allows for more connectivity options, enabling versatile usage in audio setups.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact size and spacing make it ideal for integration in small electronic devices, saving valuable space.

Maximum Operating Temperature: 105 °C

Can operate at high temperatures without compromising performance, ensuring reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures without malfunction, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connection options, enhancing usability in different setups.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial environments, ensuring robust performance in demanding conditions.

Terminal Form: GULL WING

Gull wing terminals are suitable for surface mounting, simplifying installation and ensuring secure connections.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting, enabling efficient use of space on the circuit board.

Technical Specifications

Audio & Video Amplifiers TDA7577LVPDTR attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Functions:

2

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDA7577LVPDTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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