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TDA7567PD

STMicroelectronics

TDA7567PD by STMicroelectronics

TDA7567PD by STMicroelectronics is a compact audio amplifier with 50 W output power, 0.2% harmonic distortion, and operates b/w 8-18 V. Its small outline package (11x15.9 mm) makes it ideal for space-constrained applications in automotive audio systems. With a gain of 26 dB, it delivers high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,811 parts In-Stock

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2,811

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Anansix

USA . 2,598 parts In-Stock

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2,598

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Vyrian

USA . 1,961 parts In-Stock

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1,961

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 545 parts In-Stock

1+ parts

$2.346

100+ parts

-

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$2.111

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545

$2.346

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$2.111

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MKK Technologies

India . 1,150 parts In-Stock

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$4.412

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$4.412

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DigiPath Technology Company

USA . 1,150 parts In-Stock

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$4.412

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1,150

$4.412

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AZTECH Wire

Italy . 1,185 parts In-Stock

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$19.320

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1,185

$19.320

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Ampacity Inc.

Singapore . 180 parts In-Stock

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$19.800

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180

$19.800

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Microchip USA

USA . 2,673 parts In-Stock

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$23.582

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$23.582

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Corphita

USA . 792 parts In-Stock

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Eastek

USA . 589 parts In-Stock

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GreenTree Electronics

Israel . 589 parts In-Stock

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Parana Technologies

USA . 210 parts In-Stock

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$2.805

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210

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$2.805

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Overview

Transform your audio experience with the TDA7567PD from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality audio amplifier delivers an impressive 50W output, ensuring crystal-clear sound for all your entertainment needs. Engineered for versatility, it's perfect for automotive and consumer applications. Enjoy enhanced audio fidelity, reliability, and seamless integration—making every listening moment unforgettable!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and lightweight construction, enhancing the amplifier's portability.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern PCB layouts, saving space in the overall system.

Package Shape: RECTANGULAR

The rectangular shape provides a streamlined design that facilitates efficient heat dissipation and optimized circuit layout.

General IC Type: AUDIO AMPLIFIER

As a dedicated audio amplifier, this IC is tailored for high-fidelity sound reproduction, making it suitable for various audio applications.

Harmonic Distortion: 0.2%

With a low harmonic distortion rate, the amplifier delivers clean audio signals, ensuring high-quality sound performance.

Power Supplies (V): 14.4

An optimal operating voltage of 14.4V provides enough power for robust audio performance while maintaining efficiency.

No. of Terminals: 36

A higher number of terminals offers flexible connection options, increasing compatibility with various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for dense placement on PCBs, which is ideal for space-constrained designs.

Terminal Finish: Tin (Sn)

The tin finish on terminals ensures good solderability and reliability in thermal and mechanical conditions.

Terminal Position: DUAL

Dual terminal positions allow for versatile mount options on a variety of circuit boards, enhancing design flexibility.

Nominal Output Power: 50 W

A nominal output power of 50W is suitable for driving a wide range of speakers, providing ample sound for various applications.

Maximum Seated Height: 3.41 mm

The low seated height fits easily into low-profile designs, making it ideal for compact audio products.

Width: 11 mm

A compact width allows for efficient layouts in tight spaces, helping to meet modern design requirements.

Minimum Supply Voltage (Vsup): 8 V

The ability to operate with a minimum supply voltage of 8V provides flexibility for various battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, improving manufacturing efficiency.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245 °C, this amplifier can withstand the high heat associated with surface mount soldering.

Length: 15.9 mm

A length of 15.9 mm keeps the amplifier compact, supporting its use in slim and portable devices.

Technology: BIPOLAR

Using bipolar technology allows for high-speed operation and good linearity, contributing to better audio performance.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection, ensuring stability and ease of mounting on PCBs.

Maximum Supply Current: 300 mA

A maximum supply current of 300 mA allows for sustained performance in demanding audio applications without risking overcurrent conditions.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is standard for many applications, enabling compatibility with a wide range of PCB layouts.

Gain: 26 dB

A gain of 26 dB provides sufficient amplification for a variety of audio signals, making it effective for both consumer and professional audio.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this amplifier has moderate moisture sensitivity, and appropriate handling procedures ensure component reliability.

Maximum Supply Voltage (Vsup): 18 V

The maximum supply voltage of 18V allows for a broad voltage range, providing versatility for different systems and applications.

Technical Specifications

Audio & Video Amplifiers TDA7567PD attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

Gain:

26 dB

Harmonic Distortion:

.2 %

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Nominal Output Power:

50 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.41 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

300 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

TDA7567PD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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