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TDA7563ASM

STMicroelectronics

TDA7563ASM by STMicroelectronics

TDA7563ASM by STMicroelectronics is a Class AB audio amplifier with 4 channels and delivers 50 W output power. It operates b/w 8-18 V, featuring a harmonic distortion of just 10%. Ideal for automotive audio systems, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,625 parts In-Stock

1+ parts

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2,625

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Anansix

USA . 327 parts In-Stock

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327

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Digiode

USA . 274 parts In-Stock

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274

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,923 parts In-Stock

1+ parts

$2.970

100+ parts

-

1k+ parts

$2.673

10k+ parts

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1,923

$2.970

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$2.673

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MKK Technologies

India . 444 parts In-Stock

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$5.584

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444

$5.584

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DigiPath Technology Company

USA . 444 parts In-Stock

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$5.584

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444

$5.584

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Ampacity Inc.

Singapore . 177 parts In-Stock

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$5.800

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177

$5.800

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AZTECH Wire

Italy . 886 parts In-Stock

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$14.980

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886

$14.980

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Microchip USA

USA . 2,553 parts In-Stock

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$26.922

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2,553

$26.922

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QUARKTWIN TECHNOLOGY LTD

USA . 27,373 parts In-Stock

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27,373

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,603 parts In-Stock

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$3.551

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1,603

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$3.551

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Corphita

USA . 508 parts In-Stock

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508

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Overview

Unlock superior sound quality with the TDA7563ASM from STMicroelectronics, a leader in innovative audio solutions. This Class AB audio amplifier offers an exceptional listening experience with rich, distortion-free sound. Designed for versatility, it seamlessly enhances automotive audio systems and home entertainment setups alike. Experience powerful performance, reliability, and unmatched value—transform your soundscape today!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization in various audio and video setups, making it a versatile choice for integration.

IC Type: CLASS AB AUDIO AMPLIFIER

Class AB amplifiers combine the benefits of Class A and Class B designs, providing high-quality sound with excellent linearity and efficiency, making it ideal for audio applications.

Harmonic Distortion: 10 %

With a harmonic distortion of 10%, this amplifier offers a good balance between performance and quality, ensuring that the audio output remains clean and pleasant.

Power Supplies (V): 14.4

Operating at a nominal power supply of 14.4V provides the amplifier with sufficient headroom to deliver robust audio signals without distortion.

No. of Terminals: 27

Having 27 terminals facilitates diverse connectivity options and flexible circuit design, making integration into existing systems easier.

Package Style (Meter): FLANGE MOUNT

The flange mount design enhances mechanical stability, allowing for reliable installation in various audio equipment setups.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning helps in compact layout designs while ensuring efficient thermal dissipation.

Nominal Output Power: 50 W

With a nominal output power of 50W, this amplifier can drive a wide range of speakers, delivering powerful audio performance for home or professional audio systems.

Minimum Supply Voltage (Vsup): 8 V

The minimum supply voltage of 8V allows for flexibility in power supply choices, making it suitable for battery-operated devices.

No. of Channels: 4

The 4-channel design enables connection to multiple speakers, making it perfect for surround sound systems or multi-room audio setups.

Technology: BCDMOS

BCDMOS technology offers high efficiency and low power consumption while maintaining high-quality audio output, making this amplifier friendly to both the environment and user energy costs.

Nominal Bandwidth: 0.022 kHz

The nominal bandwidth of 0.022 kHz ensures good reproduction of audio frequencies, providing a range suitable for various audio applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form improves the reliability and mechanical strength of connections, making it ideal for both prototyping and permanent installations.

Maximum Supply Current: 300 mA

With a maximum supply current of 300 mA, this amplifier can provide sufficient power to drive the speakers effectively without overheating.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatibility with a wide range of circuit board designs, facilitating ease of manufacturing and assembly.

Maximum Supply Voltage (Vsup): 18 V

The maximum supply voltage of 18V allows for greater flexibility in power supply configurations, enabling users to tailor their setups according to specific performance needs.

Technical Specifications

Audio & Video Amplifiers TDA7563ASM attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-XZFM-T27

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

27

Nominal Output Power:

50 W

Package Body Material:

UNSPECIFIED

Package Code:

ZIP

Package Equivalence Code:

ZIP27H,.08,.7

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

300 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TDA7563ASM General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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