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TDA7563

STMicroelectronics

TDA7563 by STMicroelectronics

TDA7563 by STMicroelectronics is a versatile 4-channel audio amplifier with a nominal output power of 46 W and harmonic distortion at 10%. It operates b/w 8-18 V, making it ideal for automotive audio systems. Its BCDMOS technology ensures efficient performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,740 parts In-Stock

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3,740

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Anansix

USA . 1,242 parts In-Stock

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1,242

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Lakeland Logistics Inc

USA . 1,037 parts In-Stock

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1,037

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Bristol Electronics

USA . 1,037 parts In-Stock

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Digiode

USA . 463 parts In-Stock

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463

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ACDS - Activité Composants Distribution Service

France . 284 parts In-Stock

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284

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Elcom Components

USA . 9 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,018 parts In-Stock

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$1.868

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$1.681

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$1.868

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$1.681

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MKK Technologies

India . 1,949 parts In-Stock

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$3.512

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1,949

$3.512

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DigiPath Technology Company

USA . 1,949 parts In-Stock

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$3.512

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1,949

$3.512

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AZTECH Wire

Italy . 55 parts In-Stock

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$13.990

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55

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Microchip USA

USA . 246 parts In-Stock

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$127.719

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QUARKTWIN TECHNOLOGY LTD

USA . 25,514 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,927 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Corphita

USA . 3,498 parts In-Stock

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3,498

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Infinite Electronics LLP (Excess)

. 2,932 parts In-Stock

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2,932

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Parana Technologies

USA . 1,894 parts In-Stock

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$2.233

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$2.233

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Metaverse IC Inc.

Canada . 328 parts In-Stock

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328

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Overview

Experience exceptional audio quality with the TDA7563 from STMicroelectronics, a leader in innovative solutions. This versatile 4-channel audio amplifier offers unparalleled sound clarity and power, making it ideal for automotive audio systems and home entertainment setups. With ST’s commitment to reliability and performance, you’ll enjoy rich, immersive sound that elevates your listening experience. Transform ordinary audio into extraordinary with TDA7563's superb efficiency and robust design!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection from environmental factors, making it a reliable choice for audio applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization, making it easier to integrate into various circuit designs.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is specifically designed to enhance sound quality, making it suitable for high-fidelity audio systems.

Harmonic Distortion: 10 %

A harmonic distortion of 10% indicates decent sound clarity, suitable for applications where moderate distortion is acceptable.

Power Supplies (V): 14.4

A nominal supply voltage of 14.4 V allows the amplifier to function efficiently within typical automotive or professional audio environments.

No. of Terminals: 27

With 27 terminals, this amplifier provides a range of connection options for versatile circuit design and integration.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging facilitates easy installation and robust mechanical support in various electronic assemblies.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning allows for compact layouts, optimizing the space on circuit boards while maintaining accessibility.

Nominal Output Power: 46 W

A nominal output power of 46 W ensures powerful audio performance, making it suitable for high-volume applications.

Minimum Supply Voltage (Vsup): 8 V

The low minimum supply voltage means flexibility in power sources, allowing it to operate in a wide range of applications.

No. of Channels: 4

The 4-channel configuration supports multi-channel audio outputs, ideal for surround sound systems and advanced audio setups.

Technology: BCDMOS

BCD (Bipolar-CMOS-DMOS) technology enhances efficiency and performance, making this amplifier suitable for high-power audio applications.

Nominal Bandwidth: 0.022 kHz

With a nominal bandwidth of 0.022 kHz, this amplifier can effectively handle a wide range of audio frequencies.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide enhanced mechanical strength and ease of soldering, ensuring reliable connections in diverse environments.

Maximum Supply Current: 300 mA

A maximum supply current of 300 mA ensures sufficient power delivery for demanding audio applications.

Terminal Pitch: 1 mm

The 1 mm terminal pitch allows for compact designs while ensuring ease of connection and soldering in PCB layouts.

Gain: 30 dB

A gain of 30 dB delivers substantial amplification, ideal for boosting weak audio signals in various scenarios.

Maximum Supply Voltage (Vsup): 18 V

The ability to handle a maximum supply voltage of 18 V provides flexibility for different power supply configurations.

Technical Specifications

Audio & Video Amplifiers TDA7563 attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

30 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PZFM-T27

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

27

Nominal Output Power:

46 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP27,.16,.16,40

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

300 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA7563 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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