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TDA75610LVPDTR

STMicroelectronics

TDA75610LVPDTR by STMicroelectronics

TDA75610LVPDTR by STMicroelectronics is a 4-channel audio amplifier with 44W nominal output power. It operates b/w -40 to 105 °C, suitable for industrial applications. With a low harmonic distortion of 10%, it supports a wide bandwidth of 0.022 kHz, making it ideal for audio and video amplification in compact setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,595 parts In-Stock

1+ parts

-

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5,595

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Digiode

USA . 1,157 parts In-Stock

1+ parts

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1,157

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Anansix

USA . 337 parts In-Stock

1+ parts

-

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337

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,787 parts In-Stock

1+ parts

$3.032

100+ parts

-

1k+ parts

$2.729

10k+ parts

-

1,787

$3.032

-

$2.729

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MKK Technologies

India . 2,312 parts In-Stock

1+ parts

$5.702

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-

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2,312

$5.702

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DigiPath Technology Company

USA . 2,312 parts In-Stock

1+ parts

$5.702

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-

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10k+ parts

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2,312

$5.702

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AZTECH Wire

Italy . 67 parts In-Stock

1+ parts

$19.830

100+ parts

-

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67

$19.830

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Component Stockers USA

USA . 978 parts In-Stock

1+ parts

$96.380

100+ parts

-

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978

$96.380

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Corphita

USA . 4,875 parts In-Stock

1+ parts

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4,875

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Microchip USA

USA . 2,753 parts In-Stock

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2,753

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Parana Technologies

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$3.626

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-

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25

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$3.626

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Overview

Elevate your audio experience with the TDA75610LVPDTR by STMicroelectronics. Crafted with precision and innovation, this audio amplifier offers unparalleled sound quality and performance. Perfect for automotive applications, this compact device delivers 44W of power across 4 channels, ensuring crystal-clear audio in any vehicle. With a wide operating temperature range and advanced BCDMOS technology, this audio amplifier is designed to exceed expectations. Upgrade your audio system today with the TDA75610LVPDTR and enjoy immersive sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the amplifier easy to handle and transport.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

Power Supplies (V): 14.4

Optimal power supply voltage for efficient performance and energy consumption.

Nominal Output Power: 44 W

High output power for loud and clear audio playback.

No. of Channels: 4

Multiple channels allow for more versatile audio configurations and speaker setups.

Maximum Operating Temperature: 105 °C

Can operate in high-temperature environments without overheating, ensuring reliability.

Minimum Supply Voltage (Vsup): 6 V

Can operate at low voltage levels, making it compatible with a wide range of power sources.

Technology: BCDMOS

BCDMOS technology offers high efficiency and low power consumption for improved performance.

Gain: 26 dB

High gain value ensures strong and clear amplification of audio signals.

Technical Specifications

Audio & Video Amplifiers TDA75610LVPDTR attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

44 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.41 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11 mm

Trade Compliance

TDA75610LVPDTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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