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TDA749313TR

STMicroelectronics

TDA749313TR by STMicroelectronics

TDA749313TR by STMicroelectronics is a compact audio amplifier with 3W output power, dual channels, and a gain of 18 dB. It operates b/w 3V to 5.5V with a max temp of 70 °C. Ideal for space-constrained audio applications, it features a thin profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,872 parts In-Stock

1+ parts

-

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2,872

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Vyrian

USA . 2,749 parts In-Stock

1+ parts

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2,749

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Anansix

USA . 2,585 parts In-Stock

1+ parts

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2,585

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 606 parts In-Stock

1+ parts

$2.848

100+ parts

-

1k+ parts

$2.563

10k+ parts

-

606

$2.848

-

$2.563

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Microchip USA

USA . 299 parts In-Stock

1+ parts

$3.122

100+ parts

-

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299

$3.122

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MKK Technologies

India . 1,433 parts In-Stock

1+ parts

$5.356

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1,433

$5.356

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DigiPath Technology Company

USA . 1,433 parts In-Stock

1+ parts

$5.356

100+ parts

-

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1,433

$5.356

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Ampacity Inc.

Singapore . 242 parts In-Stock

1+ parts

$6.800

100+ parts

-

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242

$6.800

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AZTECH Wire

Italy . 687 parts In-Stock

1+ parts

$21.250

100+ parts

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687

$21.250

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Component Stockers USA

USA . 275 parts In-Stock

1+ parts

$99.990

100+ parts

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275

$99.990

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Perfect Parts

USA . 16,156 parts In-Stock

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16,156

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

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2,700

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Corphita

USA . 1,283 parts In-Stock

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1,283

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Parana Technologies

USA . 764 parts In-Stock

1+ parts

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100+ parts

$3.406

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764

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$3.406

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Elevate your audio experience with the TDA749313TR from STMicroelectronics, a leader in innovative solutions. This compact audio amplifier ensures crystal-clear sound and robust performance across diverse applications, from TVs to portable speakers. Designed for efficiency and reliability, it offers exceptional value with low harmonic distortion and dual-channel output. Trust STMicroelectronics for quality that resonates, empowering your projects with superior sound fidelity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight properties, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on circuit boards, making it ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape enhances placement flexibility and better thermal management.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is optimized for enhancing sound quality and performance in audio applications.

Harmonic Distortion: 10 %

A harmonic distortion of 10% indicates a good balance between sound clarity and power, making it suitable for various audio systems.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies adds versatility, accommodating a wider range of electronic devices.

No. of Terminals: 24

With 24 terminals, this amplifier provides multiple connection points for enhanced functionality and configuration options.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style allows for effective heat dissipation and fits into space-restricted designs without compromising performance.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability and stability in high-temperature environments.

Minimum Operating Temperature: 0 °C

Starting from 0 °C allows for use in colder environments, increasing the amplifier's application range.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces the risk of corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual-terminal positioning allows for flexible circuit design, improving layout and connectivity.

Nominal Output Power: 3 W

With a nominal output power of 3 W, this amplifier provides sufficient power for small to medium audio applications.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm helps it fit well in compact assemblies, ensuring versatility in integration.

Width: 4.4 mm

A width of 4.4 mm allows for efficient placement on tightly spaced boards.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V provides flexibility in choosing the power supply, accommodating various devices.

Length: 7.8 mm

Compact length aids in minimizing board space usage, ideal for portable and space-sensitive applications.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures suitability for general use in consumer electronics.

No. of Channels: 2

Having 2 channels enables stereo audio playback, enhancing the listening experience for users.

Nominal Bandwidth: 0.022 kHz

A nominal bandwidth of 0.022 kHz means this amplifier can effectively cater to a wide range of audio frequencies.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and connection, simplifying assembly and manufacturing processes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for denser component placement without compromising design integrity.

Gain: 18 dB

A gain of 18 dB indicates effective sound amplification, making it suitable for various audio applications.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of systems and enhances performance under varying conditions.

Technical Specifications

Audio & Video Amplifiers TDA749313TR attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

18 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

3 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TDA749313TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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