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TDA7492P

STMicroelectronics

TDA7492P by STMicroelectronics

TDA7492P by STMicroelectronics is a compact audio amplifier with 25W output power, operating b/w 8-26V. It features low harmonic distortion (10%) and supports dual-channel configurations. Ideal for high-quality audio applications in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 31,090 parts In-Stock

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31,090

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Digiode

USA . 4,767 parts In-Stock

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4,767

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Vyrian

USA . 3,088 parts In-Stock

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3,088

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Anansix

USA . 264 parts In-Stock

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264

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,988 parts In-Stock

1+ parts

$2.282

100+ parts

-

1k+ parts

$2.053

10k+ parts

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1,988

$2.282

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$2.053

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MKK Technologies

India . 774 parts In-Stock

1+ parts

$4.290

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774

$4.290

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DigiPath Technology Company

USA . 774 parts In-Stock

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$4.290

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774

$4.290

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Microchip USA

USA . 441 parts In-Stock

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$4.591

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441

$4.591

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AZTECH Wire

Italy . 990 parts In-Stock

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$16.150

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990

$16.150

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 4,664 parts In-Stock

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4,664

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Corphita

USA . 3,916 parts In-Stock

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3,916

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Parana Technologies

USA . 2,359 parts In-Stock

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$2.728

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2,359

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$2.728

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Perfect Parts

USA . 1,891 parts In-Stock

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RC Electronics

USA . 1,858 parts In-Stock

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Overview

Experience the superior audio quality with the TDA7492P from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile audio amplifier is perfect for a wide range of applications, from home audio systems to portable speakers. With its compact design and exceptional performance, it ensures crystal-clear sound and efficient power use. Elevate your projects and captivate your audience with the unmatched reliability and excellence that comes with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy for the package body ensures resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact designs, facilitating space-saving arrangements in PCB layouts.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient placement on PCBs, optimizing layout design for electronic devices.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this component is specifically tailored for superior sound performance, enhancing audio quality in various applications.

Harmonic Distortion: 10%

With a harmonic distortion of 10%, this amplifier maintains sound fidelity, making it suitable for high-quality audio systems.

Power Supplies (V): 20

The specified power supply voltage of 20V provides flexibility for a range of audio configurations, ensuring compatibility with many devices.

No. of Terminals: 36

Having 36 terminals enhances connectivity options, allowing for complex audio routing and integration in advanced systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with shrink pitch style promotes compact and efficient space usage on PCBs, ideal for modern electronic designs.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures reliability in various environmental conditions, making it suitable for both indoor and outdoor applications.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C ensures versatility in different climates, contributing to overall product reliability.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish ensures excellent solderability and corrosion resistance, enhancing the longevity of the connections.

Terminal Position: DUAL

Dual terminal positions provide flexibility in design for electrical connections, accommodating various PCB layouts.

Nominal Output Power: 25 W

With a nominal output power of 25W, this amplifier is suitable for driving a variety of speakers, delivering powerful sound.

Maximum Seated Height: 2.45 mm

The low seated height allows for thin profile designs, which is essential in portable and compact devices.

Width: 7.5 mm

Compact width enables integration into slim devices, maximizing design flexibility without compromising performance.

Minimum Supply Voltage (Vsup): 8 V

A minimum supply voltage of 8V allows the amplifier to operate effectively in a range of low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the component can withstand the soldering process, ensuring durability and reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with modern soldering processes, streamlining manufacturing.

Length: 10.3 mm

The compact length supports space-efficient designs, crucial for portable electronic applications.

Temperature Grade: COMMERCIAL

Designed with a commercial temperature grade, this amplifier performs reliably under normal operational conditions, ideal for consumer electronics.

No. of Channels: 2

With two channels, this product can support stereo audio applications, enhancing user experience in multimedia devices.

Nominal Bandwidth: 0.022 kHz

0.022 kHz nominal bandwidth ensures clarity in low-frequency audio, making this amplifier perfect for bass-heavy applications.

Terminal Form: GULL WING

Gull wing terminal configuration facilitates easy soldering, enhancing manufacturing efficiency.

Maximum Supply Current: 35 mA

A maximum supply current of 35 mA ensures energy efficiency, crucial for battery-powered devices.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density layouts, making it suitable for miniaturized electronic designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, allowing for reasonable handling and storage conditions.

Maximum Supply Voltage (Vsup): 26 V

With a maximum supply voltage of 26V, this amplifier provides versatility in high-power audio applications.

Technical Specifications

Audio & Video Amplifiers TDA7492P attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

25 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

20

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TDA7492P General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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