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TDA7387EPAG

STMicroelectronics

TDA7387EPAG by STMicroelectronics

TDA7387EPAG by STMicroelectronics is a Class AB audio amplifier with 4 channels and 22W nominal output power. It has a harmonic distortion of 10% and operates in an industrial temperature range from -40 °C to 105°C. This rectangular package amplifier is suitable for audio and video applications requiring high-quality sound amplification.

Median Price

$3.780

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 595 parts In-Stock

1+ parts

$3.780

100+ parts

$2.310

1k+ parts

$2.060

10k+ parts

$1.960

595

$3.780

$2.310

$2.060

$1.960

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,213 parts In-Stock

1+ parts

$3.848

100+ parts

-

1k+ parts

-

10k+ parts

-

1,213

$3.848

-

-

-

Vyrian

USA . 4,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,702

-

-

-

-

Anansix

USA . 2,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,715

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,858 parts In-Stock

1+ parts

$0.919

100+ parts

-

1k+ parts

$0.827

10k+ parts

-

1,858

$0.919

-

$0.827

-

MKK Technologies

India . 191 parts In-Stock

1+ parts

$1.728

100+ parts

-

1k+ parts

-

10k+ parts

-

191

$1.728

-

-

-

DigiPath Technology Company

USA . 191 parts In-Stock

1+ parts

$1.728

100+ parts

-

1k+ parts

-

10k+ parts

-

191

$1.728

-

-

-

Corphita

USA . 985 parts In-Stock

1+ parts

$3.645

100+ parts

-

1k+ parts

-

10k+ parts

-

985

$3.645

-

-

-

Component Stockers USA

USA . 732 parts In-Stock

1+ parts

$4.760

100+ parts

$4.760

1k+ parts

-

10k+ parts

-

732

$4.760

$4.760

-

-

Microchip USA

USA . 2,923 parts In-Stock

1+ parts

$21.452

100+ parts

-

1k+ parts

-

10k+ parts

-

2,923

$21.452

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,379

-

-

-

-

Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

-

100+ parts

$1.099

1k+ parts

-

10k+ parts

-

2,100

-

$1.099

-

-

Overview

Experience unparalleled audio quality with the TDA7387EPAG by STMicroelectronics, a leading manufacturer in the industry. This Class AB audio amplifier offers 4 channels and a nominal output power of 22W, delivering crystal-clear sound for your audio and video applications. With a wide operating temperature range and low harmonic distortion, this amplifier ensures reliability and superior performance. Upgrade your audio experience today with the TDA7387EPAG and enjoy the benefits of high-quality sound reproduction in any industrial setting.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into various audio systems.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB amplifiers offer a good balance between efficiency and sound quality, making this product suitable for audio applications.

Harmonic Distortion: 10 %

Low harmonic distortion ensures clear and distortion-free audio output.

No. of Terminals: 25

Having 25 terminals provides flexibility for connecting multiple input and output devices.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure mounting and attachment to the audio system.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance even in extreme conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in a variety of environments.

Terminal Position: ZIG-ZAG

Zig-zag terminal position enables efficient signal flow and connectivity.

Nominal Output Power: 22 W

22W output power provides sufficient power for driving speakers and delivering high-quality audio.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures durability and longevity in industrial settings.

No. of Channels: 4

4 channels offer flexibility for connecting multiple audio sources and speakers.

Nominal Bandwidth: 0.02 kHz

Wide nominal bandwidth ensures accurate and detailed audio reproduction across the frequency spectrum.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections for long-term use.

Gain: 26 dB

26 dB gain amplifies audio signals effectively without introducing noise or distortion.

Technical Specifications

Audio & Video Amplifiers TDA7387EPAG attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-XZFM-T25

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

22 W

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TDA7387EPAG General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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