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TDA7376PD

STMicroelectronics

TDA7376PD by STMicroelectronics

TDA7376PD by STMicroelectronics is a Class AB audio amplifier with 37 W output power and low harmonic distortion of 10%. It operates b/w 8-18 V, making it ideal for automotive audio applications. Its compact design features a dual terminal layout in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,831 parts In-Stock

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8,831

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Digiode

USA . 1,600 parts In-Stock

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1,600

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Anansix

USA . 842 parts In-Stock

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842

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Chip Stock

USA . 185 parts In-Stock

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185

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$2.260

100+ parts

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$2.034

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431

$2.260

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$2.034

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MKK Technologies

India . 498 parts In-Stock

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$4.249

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498

$4.249

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DigiPath Technology Company

USA . 498 parts In-Stock

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$4.249

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498

$4.249

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AZTECH Wire

Italy . 471 parts In-Stock

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$8.970

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471

$8.970

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Ampacity Inc.

Singapore . 1,315 parts In-Stock

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$13.800

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$13.800

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Microchip USA

USA . 2,317 parts In-Stock

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$31.548

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$31.548

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Component Stockers USA

USA . 1,941 parts In-Stock

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$52.630

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1,941

$52.630

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Corphita

USA . 3,417 parts In-Stock

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Parana Technologies

USA . 138 parts In-Stock

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$2.702

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138

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$2.702

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Overview

Elevate your audio experience with the TDA7376PD from STMicroelectronics, a leader in innovative semiconductor solutions. This Class AB audio amplifier delivers exceptional sound quality and reliability for various applications, from automotive systems to home entertainment setups. With its compact design and impressive power output, it ensures clear, distortion-free audio while maximizing efficiency. Enhance your projects with a trusted component that embodies performance and durability, bringing unparalleled value to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers a durable yet light-weight construction, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient circuitry design and compact layouts, enhancing versatility.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space usage on PCBs, making it easier to integrate into designs.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB amplifiers are known for their sound quality and efficiency, providing a good balance between performance and power consumption.

Harmonic Distortion: 10 %

Lower harmonic distortion ensures clearer sound reproduction, enhancing the audio quality for listeners.

Power Supplies (V): 14.4

Operating at 14.4V provides enough power for robust performance across a variety of audio applications.

No. of Terminals: 36

A high number of terminals allows for versatile connections and supports complex circuitry requirements.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style promotes effective heat dissipation, maintaining performance under demanding conditions.

Terminal Finish: Matte Tin (Sn) - annealed

A matte tin finish improves solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB design, simplifying integration into various applications.

Nominal Output Power: 37 W

With a nominal output power of 37W, this amplifier is capable of driving adequate speakers for most audio applications.

Maximum Seated Height: 3.43 mm

A low profile height facilitates integration into space-constrained designs without compromising performance.

Width: 11 mm

Compact width enables efficient use of PCB space, making it a suitable choice for small devices.

Minimum Supply Voltage (Vsup): 8 V

The flexibility of a minimum supply voltage of 8V allows for operation in a range of environments.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds indicates compatibility with commercial manufacturing processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures stability during soldering processes, reducing the risk of damage.

Length: 15.9 mm

A compact length aids in designing smaller and more efficient electronic systems.

No. of Channels: 2

With two channels, this amplifier is ideal for stereo applications, delivering balanced audio output.

Technology: BIPOLAR

Bipolar technology provides high-performance characteristics in audio applications, enhancing sound quality.

Nominal Bandwidth: 0.033 kHz

A wide bandwidth supports a wider range of audio frequencies, contributing to improved sound fidelity.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and mechanical stability, ensuring reliable connections.

Maximum Supply Current: 200 mA

The maximum supply current of 200 mA allows for efficient power management without overheating.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports densely packed designs while maintaining reliability.

Gain: 26 dB

A gain of 26 dB provides sufficiently amplified output for driving various audio systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable handling precautions, making it suitable for standard manufacturing environments.

Maximum Supply Voltage (Vsup): 18 V

The ability to operate up to 18V enhances versatility, allowing for various power supply configurations.

Technical Specifications

Audio & Video Amplifiers TDA7376PD attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.033 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

36

Nominal Output Power:

37 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

200 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

TDA7376PD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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