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TBA810S

STMicroelectronics

TBA810S by STMicroelectronics

TBA810S by STMicroelectronics is an audio amplifier IC with 16 terminals in a rectangular package. It operates on bipolar technology, with a max supply current of 20mA. Ideal for audio and video applications requiring high-quality amplification in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 4,530 parts In-Stock

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4,530

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Digiode

USA . 3,923 parts In-Stock

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Vyrian

USA . 1,959 parts In-Stock

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Anansix

USA . 1,954 parts In-Stock

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M&R Communications

USA . 1,221 parts In-Stock

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GES GmbH

Germany . 304 parts In-Stock

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304

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Bristol Electronics

USA . 84 parts In-Stock

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84

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Dan-Mar Components

USA . 84 parts In-Stock

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84

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Goldney Electronics S.L.

Spain . 74 parts In-Stock

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Halfin

Belgium . 38 parts In-Stock

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38

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LittleDiode

UK . 25 parts In-Stock

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25

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Fibra_Brandt Electronic GMBH

Germany . 24 parts In-Stock

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24

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Manotoh

Italy . 24 parts In-Stock

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24

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ICP Electronique

France . 21 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 19 parts In-Stock

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ECAB

Sweden . 13 parts In-Stock

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Huijzer Components

Netherlands . 5 parts In-Stock

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Electronic Expediters

USA . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,223 parts In-Stock

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$2.279

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$2.051

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$2.279

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$2.051

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MKK Technologies

India . 1,446 parts In-Stock

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$4.285

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$4.285

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DigiPath Technology Company

USA . 1,446 parts In-Stock

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$4.285

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$4.285

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RC Electronics

USA . 20,453 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,822 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 2,302 parts In-Stock

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Supply Digital

USA . 1,471 parts In-Stock

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Perfect Parts

USA . 224 parts In-Stock

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224

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Parana Technologies

USA . 143 parts In-Stock

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$2.725

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143

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$2.725

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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100

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Assy Fe

Spain . 45 parts In-Stock

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Overview

Elevate your audio experience with the TBA810S by STMicroelectronics, a top-quality audio amplifier that delivers unparalleled sound performance. Manufactured by STMicroelectronics, a trusted name in the industry, this product is designed to enhance your audio and video systems with crystal-clear sound quality. Perfect for a wide range of applications, the TBA810S offers customers exceptional value, benefits, and advantages. Upgrade your audio setup today and immerse yourself in a world of superior sound with the TBA810S.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio amplification devices.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into various electronic devices without taking up too much space.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures optimal performance and high-quality sound output.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting to various components and peripherals, allowing for versatile usage.

Package Style (Meter): IN-LINE

The in-line package style makes installation and connection straightforward, saving time and effort during setup.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead finish on the terminals ensures good conductivity and reliability in signal transmission, reducing the risk of signal loss.

Terminal Position: QUAD

The quad terminal position allows for efficient routing and organization of connections, improving overall system stability and performance.

Technology: BIPOLAR

The bipolar technology used in the amplifier offers efficient power management and enhanced signal processing capabilities, resulting in improved audio quality.

Terminal Form: PIN/PEG

The pin/peg terminal form simplifies the connection process and ensures secure contact, minimizing the likelihood of signal interference or loss.

Maximum Supply Current: 20 mA

With a maximum supply current of 20 mA, the amplifier operates efficiently without drawing excessive power or risking overheating.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy alignment and insertion of connectors, facilitating smooth integration into existing circuitry.

Technical Specifications

Audio & Video Amplifiers TBA810S attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PQIP-P16

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

QIP

Package Equivalence Code:

QI16B,.2/.4,100TB

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

20 mA

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

QUAD

Trade Compliance

TBA810S General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

NSN

5962-15-114-2865, 5962151142865

NIIN

151142865

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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