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STTH5L06B

STMicroelectronics

STTH5L06B by STMicroelectronics

STTH5L06B by STMicroelectronics is a high-voltage ultra-fast recovery rectifier diode, ideal for applications requiring rapid switching. It features a max reverse recovery time of 0.095 µs, supports up to 600 V, and operates at temperatures up to 175 °C. This surface-mount device offers efficient performance with a forward voltage of 1.05 V and a current rating of 5 A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 53,500 parts In-Stock

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Vyrian

USA . 7,123 parts In-Stock

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Digiode

USA . 2,961 parts In-Stock

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2,961

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Anansix

USA . 679 parts In-Stock

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Cogito LLC

Ukraine . 5 parts In-Stock

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IDEA Electronic Components Group

UK . 948 parts In-Stock

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$0.035

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-

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$0.031

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948

$0.035

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$0.031

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MKK Technologies

India . 902 parts In-Stock

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$0.066

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902

$0.066

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DigiPath Technology Company

USA . 902 parts In-Stock

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$0.066

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902

$0.066

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AZTECH Wire

Italy . 1,133 parts In-Stock

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$13.710

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Component Stockers USA

USA . 667 parts In-Stock

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$99.990

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$99.990

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RC Electronics

USA . 40,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,304 parts In-Stock

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S.R.D Solutions

India . 4,500 parts In-Stock

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Kepictronics

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Corphita

USA . 2,679 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 2,245 parts In-Stock

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$0.042

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$0.042

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Overview

Boost your designs with the STTH5L06B from STMicroelectronics, a high-performance rectifier diode engineered for ultra-fast recovery in high voltage applications. With ST's commitment to quality and innovation, this reliable component ensures optimal efficiency and durability, even at elevated temperatures. Its compact surface mount design simplifies integration, making it perfect for diverse electronics ranging from power supplies to automotive systems. Elevate your projects with unmatched reliability and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, making it suitable for various applications.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for easy integration into various electronic devices.

Surface Mount: YES

Surface mount technology enables efficient use of space on PCBs and supports automated assembly processes.

Maximum Reverse Recovery Time: 0.095 μs

A low reverse recovery time enhances switching performance, allowing for better efficiency in high-frequency applications.

Package Shape: RECTANGULAR

The rectangular shape provides better thermal dissipation and fits well in compact circuit layouts.

Number of Terminals: 2

With only two terminals, installation is streamlined, facilitating straightforward electrical connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for high-density mounting on PCBs, fitting into smaller designs.

Application: HIGH VOLTAGE ULTRA FAST RECOVERY

Designed for high voltage applications, this diode offers reliable performance in critical electronic circuits requiring swift recovery.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this diode to perform in demanding environments, ensuring reliability in extreme conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish enhances solderability and prevents corrosion, leading to improved longevity and performance.

Terminal Position: SINGLE

Single terminal positioning provides clear and straightforward layout design, reducing assembly complexity.

Case Connection: CATHODE

A cathode case connection aligns with standard designs and simplifies the integration into existing circuits.

Maximum Time At Peak Reflow Temperature: 30 seconds

The extended time at peak reflow temperature ensures proper soldering processes while maintaining component integrity.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature caters to robust soldering processes, suitable for high-reliability applications.

Diode Type: RECTIFIER DIODE

This rectifier diode effectively converts AC to DC, making it essential for power supply applications.

Maximum Forward Voltage (VF): 1.05 V

A low forward voltage drop promotes energy efficiency, reducing heat loss during operation.

Maximum Output Current: 5 A

With a maximum output of 5 A, this diode is capable of handling significant loads in various applications.

Terminal Form: GULL WING

Gull wing terminals provide stable connections and ease of use during automated mounting, enhancing assembly speed.

Maximum Repetitive Peak Reverse Voltage: 600 V

The high reverse voltage rating makes this diode ideal for safeguarding circuits in high voltage environments.

Maximum Non-Repetitive Peak Forward Current: 60 A

The ability to handle higher non-repetitive peak forward currents allows for flexibility in burst applications where transient current spikes may occur.

Diode Element Material: SILICON

Silicon as the diode element material ensures reliability and efficiency, making it a standard choice in diode manufacturing.

Technical Specifications

Diodes & Rectifiers STTH5L06B attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Additional Features:

FREE WHEELING DIODE

Application:

HIGH VOLTAGE ULTRA FAST RECOVERY

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.05 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

60 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Maximum Output Current:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

600 V

Maximum Reverse Recovery Time:

.095 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STTH5L06B Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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