Loading...

STTH20LCD06CG-TR

STMicroelectronics

STTH20LCD06CG-TR by STMicroelectronics

STTH20LCD06CG-TR by STMicroelectronics is a high-voltage ultra-fast recovery rectifier diode with a max reverse recovery time of 0.05 µs, 600 V peak reverse voltage, and 10 A output current. It features a compact surface mount design and operates up to 175 °C. Ideal for applications requiring efficient power management in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,062

-

-

-

-

Anansix

USA . 1,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,723

-

-

-

-

Digiode

USA . 758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

758

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,184 parts In-Stock

1+ parts

$0.157

100+ parts

-

1k+ parts

$0.142

10k+ parts

-

1,184

$0.157

-

$0.142

-

MKK Technologies

India . 1,099 parts In-Stock

1+ parts

$0.296

100+ parts

-

1k+ parts

-

10k+ parts

-

1,099

$0.296

-

-

-

DigiPath Technology Company

USA . 1,099 parts In-Stock

1+ parts

$0.296

100+ parts

-

1k+ parts

-

10k+ parts

-

1,099

$0.296

-

-

-

AZTECH Wire

Italy . 947 parts In-Stock

1+ parts

$13.480

100+ parts

-

1k+ parts

-

10k+ parts

-

947

$13.480

-

-

-

Perfect Parts

USA . 7,809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,809

-

-

-

-

Corphita

USA . 2,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,504

-

-

-

-

Parana Technologies

USA . 2,195 parts In-Stock

1+ parts

-

100+ parts

$0.188

1k+ parts

-

10k+ parts

-

2,195

-

$0.188

-

-

Overview

Unlock the potential of your designs with the STTH20LCD06CG-TR from STMicroelectronics, a leader in innovation and reliability. This high-voltage ultra-fast recovery diode ensures optimal performance in demanding applications, delivering low forward voltage and swift recovery times. With its compact surface mount design, it not only saves space but also enhances efficiency, providing unmatched durability even in extreme conditions. Elevate your projects with a trusted component that guarantees quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and provides protection against environmental factors.

Config: COMMON CATHODE, 2 ELEMENTS

This configuration allows for efficient design in circuits requiring multiple rectifying functions.

Surface Mount: YES

Surface mounting allows for compact designs and simplifies the assembly process on printed circuit boards.

Maximum Reverse Recovery Time: 0.05 us

The ultra-fast recovery time improves the efficiency of switching applications, reducing power losses.

Package Shape: RECTANGULAR

The rectangular shape enables effective space utilization on PCBs, making it easy to integrate into various designs.

No. of Terminals: 2

Having two terminals simplifies connections and reduces potential points of failure in circuits.

Package Style (Meter): SMALL OUTLINE

The small outline style is ideal for modern electronic devices where space-saving designs are critical.

Application: HIGH VOLTAGE ULTRA FAST RECOVERY

Designed for high voltage applications, making it suitable for demanding power supply circuits.

Maximum Operating Temperature: 175 °C

High temperature tolerance ensures reliable operation in harsh environments, enhancing overall product lifespan.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and enhances corrosion resistance.

Terminal Position: SINGLE

Single terminal position aids in simplifying PCB layouts and improving soldering accuracy.

Case Connection: CATHODE

The cathode connection allows for versatile circuit configurations, enhancing design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

This limit ensures that the diode can withstand high temperatures during the soldering process without damage.

Peak Reflow Temperature (°C): 245

The high peak reflow temperature capability makes it compatible with modern soldering processes.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it efficiently converts AC to DC power, crucial for power supply applications.

Maximum Forward Voltage (VF): 1.6 V

Low forward voltage drop minimizes power loss during operation, improving energy efficiency.

Maximum Output Current: 10 A

Capable of handling a maximum output current of 10 A, making it suitable for high-power applications.

Terminal Form: GULL WING

Gull wing terminals facilitate strong mechanical support and enhance solder joint reliability.

No. of Elements: 2

With two elements, it can handle higher load requirements, making it versatile for various applications.

Maximum Repetitive Peak Reverse Voltage: 600 V

High voltage rating supports robust performance in demanding environments where voltage spikes may occur.

Maximum Non Repetitive Peak Forward Current: 80 A

The ability to handle high forward currents allows this diode to effectively manage load surges.

Diode Element Material: SILICON

Silicon as a diode element material provides reliable performance, thermal stability, and efficient current conduction.

Technical Specifications

Diodes & Rectifiers STTH20LCD06CG-TR attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Application:

HIGH VOLTAGE ULTRA FAST RECOVERY

Case Connection:

CATHODE

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.6 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

80 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Maximum Output Current:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

600 V

Maximum Reverse Recovery Time:

.05 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STTH20LCD06CG-TR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20