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STTH10R04B-TR

STMicroelectronics

STTH10R04B-TR by STMicroelectronics

STTH10R04B-TR by STMicroelectronics is an ultra-fast recovery rectifier diode with a max reverse recovery time of 0.04 µs and can handle up to 10 A output current. It operates at a peak reverse voltage of 400 V and features a compact surface mount design. Ideal for high-efficiency applications, it withstands temperatures up to 175 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,096 parts In-Stock

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10,096

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Digiode

USA . 2,908 parts In-Stock

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2,908

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Anansix

USA . 856 parts In-Stock

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856

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 486 parts In-Stock

1+ parts

$0.035

100+ parts

-

1k+ parts

$0.031

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486

$0.035

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$0.031

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MKK Technologies

India . 2,011 parts In-Stock

1+ parts

$0.066

100+ parts

-

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2,011

$0.066

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DigiPath Technology Company

USA . 2,011 parts In-Stock

1+ parts

$0.066

100+ parts

-

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2,011

$0.066

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AZTECH Wire

Italy . 353 parts In-Stock

1+ parts

$14.720

100+ parts

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353

$14.720

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QUARKTWIN TECHNOLOGY LTD

USA . 26,135 parts In-Stock

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26,135

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Parana Technologies

USA . 1,762 parts In-Stock

1+ parts

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100+ parts

$0.042

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1,762

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$0.042

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Corphita

USA . 1,371 parts In-Stock

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1,371

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Overview

Unlock exceptional performance with the STTH10R04B-TR from STMicroelectronics, a leader in innovative semiconductor solutions. This ultra-fast recovery rectifier diode combines reliability with superior efficiency, making it perfect for demanding applications in power management and energy conversion. With its compact design and robust thermal characteristics, you'll enjoy seamless integration and enhanced system longevity. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using durable plastic/epoxy ensures reliability and protection against environmental factors.

Config: SINGLE

Single configuration simplifies circuit design and minimizes space requirements.

Surface Mount: YES

Surface mount capability facilitates automated assembly and saves PCB space.

Maximum Reverse Recovery Time: 0.04 us

Ultra-fast recovery time enhances switching performance, making it ideal for high-frequency applications.

Package Shape: RECTANGULAR

The rectangular shape is tailored for efficient space utilization on boards.

No. of Terminals: 2

Two terminals provide straightforward connectivity for simplified integration.

Package Style (Meter): SMALL OUTLINE

Small outline design allows for compact placement on printed circuit boards.

Application: ULTRA FAST RECOVERY

Designed for ultra-fast recovery applications, making it suitable for high-speed circuits.

Maximum Operating Temperature: 175 °C

High operating temperature rating ensures reliability even in demanding thermal environments.

Terminal Position: SINGLE

Single terminal position allows for ease of soldering and connection.

Case Connection: CATHODE

Cathode connection enhances performance in various circuit designs.

Diode Type: RECTIFIER DIODE

Rectifier diode type is ideal for converting AC to DC, suitable for power applications.

Maximum Forward Voltage (VF): 1.35 V

Low forward voltage drop improves efficiency and reduces power loss in circuits.

Maximum Output Current: 10 A

Rated for 10 A output current, making it suitable for a variety of power applications.

Terminal Form: GULL WING

Gull wing terminals allow for better solder joint visibility and reliability.

Maximum Repetitive Peak Reverse Voltage: 400 V

High reverse voltage capability ensures it can withstand demanding conditions without failing.

Maximum Non-Repetitive Peak Forward Current: 100 A

Able to handle high transient currents, making it robust for peak performance situations.

Diode Element Material: SILICON

Silicon material provides excellent electrical characteristics and stability.

Technical Specifications

Diodes & Rectifiers STTH10R04B-TR attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Application:

ULTRA FAST RECOVERY

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.35 V

JESD-30 Code:

R-PSSO-G2

Maximum Non Repetitive Peak Forward Current:

100 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Maximum Output Current:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

400 V

Maximum Reverse Recovery Time:

.04 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STTH10R04B-TR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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