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STSMIA832TBR

STMicroelectronics

STSMIA832TBR by STMicroelectronics

STSMIA832TBR by STMicroelectronics is a CMOS line receiver with a max supply voltage of 3.6V and operates in industrial conditions from -40 °C to 85 °C. It features a compact 25-terminal grid array design, supporting up to 4A output current. Ideal for high-speed data transmission applications, it ensures minimal delay at just 8.5ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,722 parts In-Stock

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5,722

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Digiode

USA . 3,719 parts In-Stock

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3,719

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Anansix

USA . 1,314 parts In-Stock

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1,314

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Distributors (Availability)

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Component Stockers USA

USA . 825 parts In-Stock

1+ parts

$1.580

100+ parts

$1.500

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-

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825

$1.580

$1.500

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IDEA Electronic Components Group

UK . 2,089 parts In-Stock

1+ parts

$2.039

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-

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$1.835

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2,089

$2.039

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$1.835

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MKK Technologies

India . 1,801 parts In-Stock

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$3.834

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1,801

$3.834

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DigiPath Technology Company

USA . 1,801 parts In-Stock

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$3.834

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1,801

$3.834

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Microchip USA

USA . 384 parts In-Stock

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$7.426

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384

$7.426

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AZTECH Wire

Italy . 458 parts In-Stock

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$9.300

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458

$9.300

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Kepictronics

USA . 14,567 parts In-Stock

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Perfect Parts

USA . 8,028 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,244 parts In-Stock

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Parana Technologies

USA . 2,086 parts In-Stock

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$2.438

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ChipstoGo Electronic ltd

UK . 989 parts In-Stock

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Corphita

USA . 304 parts In-Stock

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GreenTree Electronics

Israel . 110 parts In-Stock

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Overview

Elevate your designs with the STSMIA832TBR from STMicroelectronics, a premier choice in line drivers and receivers. Crafted with precision, this high-quality component ensures robust performance in demanding industrial applications. Enjoy seamless integration with its thin profile and efficient power management, while benefiting from STMicroelectronics' renowned reliability. Experience enhanced signal integrity and operational flexibility, all in a compact package that delivers exceptional value for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for more compact circuit designs and easier automated assembly.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage is well-suited for a range of low-voltage applications, enhancing compatibility.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, providing flexibility in layout designs.

Power Supplies (V): 2.8

Operating at a nominal voltage of 2.8V supports efficient power management in low-power applications.

No. of Terminals: 25

With 25 terminals, this device can support multiple inputs and outputs for complex interfacing.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array design helps in optimizing thermal performance and minimizes signal degradation.

Minimum Supply Voltage: 2.65 V

A low minimum supply voltage extends usability in battery-operated devices.

Maximum Operating Temperature: 85 °C

Compatible with high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold ensures reliability in harsh environments.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish improves solderability and enhances overall conductivity.

Terminal Position: BOTTOM

Bottom terminal position improves space efficiency and power distribution on the PCB.

Maximum Seated Height: 1.16 mm

The low seated height allows for thinner designs, which is crucial for modern compact devices.

Width: 3 mm

Compact width facilitates integration into space-constrained applications.

Maximum Output Low Current: 4 Amp

The capability to handle 4A current supports robust performance in high-demand applications.

Length: 3 mm

The small length ensures minimal footprint, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and performance in demanding conditions.

Maximum Receive Delay: 8.5 ns

Fast receive delay enhances system performance and responsiveness.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form enhances the connection reliability and ease of soldering.

Maximum Supply Current: 9 mA

Low supply current allows for energy-efficient designs, leading to prolonged battery life in portable devices.

Input Characteristics: DIFFERENTIAL

Differential input characteristics improve noise immunity and signal integrity.

Nominal Supply Voltage: 2.8 V

Nominal supply voltage of 2.8V is ideal for compatibility with typical digital logic levels.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch supports finer pitch PCB designs, allowing for higher component density.

Interface IC Type: LINE RECEIVER

As a line receiver, this IC is specifically designed for high-speed data transmission with excellent performance.

Technical Specifications

Line Drivers & Receivers STSMIA832TBR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

3 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

2.8

Qualification:

Not Qualified

Maximum Receive Delay:

8.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.16 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.65 V

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

STSMIA832TBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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