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STPS3045CG

STMicroelectronics

STPS3045CG by STMicroelectronics

STMicroelectronics' STPS3045CG is a Schottky rectifier diode with 45V reverse voltage and 15A output current. It features common cathode configuration, matte tin terminal finish, and small outline package suitable for power applications. The diode has a max forward voltage of 0.57V and can handle non-repetitive peak forward currents up to 220A.

Median Price

$0.414

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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EXC GmbH

Germany . 19 parts In-Stock

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$0.414

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Chip Stock

USA . 19,500 parts In-Stock

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Vyrian

USA . 9,399 parts In-Stock

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ECAB

Sweden . 6,303 parts In-Stock

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Digiode

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,049 parts In-Stock

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Anansix

USA . 910 parts In-Stock

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910

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Bristol Electronics

USA . 350 parts In-Stock

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350

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Dan-Mar Components

USA . 350 parts In-Stock

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Atlantic Semiconductor

USA . 279 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 11 parts In-Stock

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IDEA Electronic Components Group

UK . 484 parts In-Stock

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$0.132

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$0.118

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484

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$0.118

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MKK Technologies

India . 2,161 parts In-Stock

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$0.247

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DigiPath Technology Company

USA . 2,161 parts In-Stock

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$0.247

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AZTECH Wire

Italy . 160 parts In-Stock

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$12.500

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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S.R.D Solutions

India . 30,000 parts In-Stock

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RC Electronics

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Cyclops Electronics Ltd (Excess)

UK . 4,355 parts In-Stock

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Corphita

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Parana Technologies

USA . 2,018 parts In-Stock

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$0.157

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Assy Fe

Spain . 700 parts In-Stock

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Overview

Unlock the power of efficiency and reliability with the STPS3045CG diode by STMicroelectronics. Crafted with precision and quality in mind, this common cathode Schottky rectifier diode offers peak performance in power applications. With a maximum output current of 15A and a maximum repetitive peak reverse voltage of 45V, this small outline package delivers unmatched value and benefits to customers seeking superior electronic components. Trust in STMicroelectronics for cutting-edge technology and innovative solutions that drive your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package provides durability and protection for the diodes, ensuring a long lifespan.

Config: COMMON CATHODE, 2 ELEMENTS

Having a common cathode configuration with 2 elements allows for easy integration and efficient circuit design.

Surface Mount: YES

The surface mount capability makes installation and assembly easier, especially for compact electronic devices.

Maximum Reverse Current: 40000 uA

The high maximum reverse current rating ensures reliable performance even under heavy load conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for space-saving and organized placement on circuit boards.

No. of Terminals: 2

With only 2 terminals, this diode is easy to connect and integrate into circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and makes it suitable for compact electronic devices.

Application: POWER

Designed for power applications, this diode can handle high currents and voltages efficiently.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a reliable and durable connection for optimal performance.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and reduces complexity in circuit design.

Case Connection: CATHODE

The cathode case connection ensures proper polarity and efficient circuit operation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures safe and secure soldering during assembly.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245 °C, this diode can withstand high-temperature soldering processes.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it efficiently converts AC to DC current, making it ideal for power applications.

Maximum Forward Voltage (VF): 0.57 V

The low maximum forward voltage drop of 0.57V minimizes power loss and improves efficiency in electronic circuits.

Maximum Output Current: 15 A

With a maximum output current of 15A, this diode can handle high power loads with ease.

Technology: SCHOTTKY

Schottky technology provides fast switching speed and low forward voltage drop, making it suitable for high-frequency applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy surface mounting and secure solder connections.

No. of Elements: 2

Having 2 elements provides redundancy and reliability in circuit design.

Maximum Repetitive Peak Reverse Voltage: 45 V

The high maximum repetitive peak reverse voltage rating ensures protection against reverse voltage spikes and surges.

Maximum Non Repetitive Peak Forward Current: 220 A

With a maximum non-repetitive peak forward current of 220A, this diode can handle short-term power surges effectively.

Diode Element Material: SILICON

Silicon diode elements provide high efficiency and reliability in electronic circuits.

Technical Specifications

Diodes & Rectifiers STPS3045CG attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Additional Features:

FREE WHEELING DIODE

Application:

POWER

Case Connection:

CATHODE

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.57 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

220 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

2

Maximum Output Current:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

45 V

Maximum Reverse Current:

40000 uA

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STPS3045CG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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