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STPS20SM120SFP

STMicroelectronics

STPS20SM120SFP by STMicroelectronics

STPS20SM120SFP by STMicroelectronics is a Schottky rectifier diode designed for high efficiency applications. It features a max output current of 20 A, reverse voltage of 120 V, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,986 parts In-Stock

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Vyrian

USA . 3,796 parts In-Stock

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3,796

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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2,000

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ComSIT USA

USA . 2,000 parts In-Stock

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Anansix

USA . 1,833 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$0.125

100+ parts

$0.114

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$0.102

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300

$0.125

$0.114

$0.102

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IDEA Electronic Components Group

UK . 900 parts In-Stock

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$0.149

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$0.134

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900

$0.149

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$0.134

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MKK Technologies

India . 1,152 parts In-Stock

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$0.280

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$0.280

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DigiPath Technology Company

USA . 1,152 parts In-Stock

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$0.280

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$0.280

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AZTECH Wire

Italy . 994 parts In-Stock

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$20.890

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994

$20.890

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Corphita

USA . 4,961 parts In-Stock

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4,961

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Parana Technologies

USA . 96 parts In-Stock

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$0.178

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Overview

Unlock unparalleled efficiency with the STPS20SM120SFP Schottky rectifier diode from STMicroelectronics, a leader in semiconductor innovation. Designed for peak performance, this reliable component ensures minimal energy loss and high-speed switching, making it ideal for power supply applications and renewable energy systems. With superior thermal management and a compact design, it empowers your projects to achieve optimal functionality while enhancing durability and reliability. Experience quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this diode suitable for a variety of applications.

Config: SINGLE

A single configuration simplifies circuit design and reduces space requirements on the PCB.

Maximum Reverse Current: 210 uA

Low reverse current contributes to higher efficiency and less power loss, which is crucial for energy-sensitive applications.

Package Shape: RECTANGULAR

Rectangular packages typically offer a compact layout, making them easier to integrate into various circuit designs.

No. of Terminals: 3

With three terminals, this diode allows for additional connectivity options, facilitating easier installation and configuration.

Package Style (Meter): FLANGE MOUNT

Flange mounting offers robust mechanical support and can be more reliable in high-stress environments.

Application: EFFICIENCY

Designed for efficiency, this diode can help improve overall system performance by minimizing energy waste.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature enhances reliability, enabling the diode to function in demanding thermal conditions.

Terminal Position: SINGLE

Single terminal position helps in avoiding confusion during installation, ensuring straightforward integration into circuits.

Case Connection: ISOLATED

Isolated case connection helps prevent unwanted electrical interactions with other components, increasing safety and performance.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it is specifically designed for converting AC to DC, making it a key component in power supply applications.

Maximum Forward Voltage (VF): 0.89 V

Low forward voltage drop enhances overall efficiency and reduces heat generation, making it ideal for high-performance applications.

Maximum Output Current: 20 A

Capable of handling up to 20 A, this diode can be used in high-current applications without risk of failure.

Technology: SCHOTTKY

Schottky technology allows for faster switching times and lower conduction losses, greatly improving overall system efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides enhanced mechanical strength and is easier to solder, which benefits reliability.

Maximum Repetitive Peak Reverse Voltage: 120 V

With a high reverse voltage rating of 120 V, this diode can effectively handle voltage spikes without damage.

Maximum Non-Repetitive Peak Forward Current: 220 A

The ability to handle non-repetitive peak currents of 220 A ensures robustness against transient surges, making it resilient in fluctuating applications.

Diode Element Material: SILICON

Silicon as the diode element material ensures reliability and performance in a wide range of electronic applications.

Technical Specifications

Diodes & Rectifiers STPS20SM120SFP attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Application:

EFFICIENCY

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.89 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

Maximum Non Repetitive Peak Forward Current:

220 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Repetitive Peak Reverse Voltage:

120 V

Maximum Reverse Current:

210 uA

Surface Mount:

NO

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STPS20SM120SFP Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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