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STPS20M100SFP

STMicroelectronics

STPS20M100SFP by STMicroelectronics

STPS20M100SFP by STMicroelectronics is a Schottky rectifier diode with a max output current of 20 A and reverse voltage of 100 V. It features a compact flange mount design, ideal for high-efficiency power applications. Operating up to 150 °C, it ensures reliable performance in demanding environments.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5 parts In-Stock

1+ parts

$2.720

100+ parts

-

1k+ parts

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5

$2.720

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 231 parts In-Stock

1+ parts

$2.584

100+ parts

-

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10k+ parts

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231

$2.584

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Vyrian

USA . 6,419 parts In-Stock

1+ parts

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100+ parts

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6,419

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Anansix

USA . 676 parts In-Stock

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676

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 939 parts In-Stock

1+ parts

$0.026

100+ parts

-

1k+ parts

$0.023

10k+ parts

-

939

$0.026

-

$0.023

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MKK Technologies

India . 1,944 parts In-Stock

1+ parts

$0.048

100+ parts

-

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1,944

$0.048

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DigiPath Technology Company

USA . 1,944 parts In-Stock

1+ parts

$0.048

100+ parts

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1,944

$0.048

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Ampacity Inc.

Singapore . 5 parts In-Stock

1+ parts

$2.310

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5

$2.310

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Corphita

USA . 4,972 parts In-Stock

1+ parts

$2.448

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4,972

$2.448

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Microchip USA

USA . 113 parts In-Stock

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$17.550

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113

$17.550

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Component Stockers USA

USA . 5,272 parts In-Stock

1+ parts

$21.730

100+ parts

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5,272

$21.730

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Perfect Parts

USA . 2,308 parts In-Stock

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2,308

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Parana Technologies

USA . 1,730 parts In-Stock

1+ parts

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100+ parts

$0.031

1k+ parts

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10k+ parts

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1,730

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$0.031

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Overview

Unlock superior efficiency and reliability with the STPS20M100SFP Schottky rectifier from STMicroelectronics. Renowned for its commitment to quality, STMicroelectronics ensures this diode excels in demanding applications, offering rapid switching speeds and robust performance in power supplies and converters. With a compact design and impressive thermal stability, it’s engineered to enhance your system's longevity while providing unmatched value and peace of mind for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The epoxy body provides excellent protection against environmental factors, ensuring long-lasting performance and reliability.

Config: SINGLE

A single configuration minimizes space requirements, making it ideal for compact electronic designs.

Maximum Reverse Current: 40 uA

A low reverse current helps to maintain efficiency in applications, reducing power loss during reverse bias.

Package Shape: RECTANGULAR

The rectangular shape allows for easier alignment and optimized layout in circuit designs.

Reverse Test Voltage: 100 V

High reverse test voltage capability ensures reliability under adverse conditions, enhancing overall device performance.

No. of Terminals: 3

Three terminals accommodate a range of circuit configurations, facilitating versatile design options.

Package Style (Meter): FLANGE MOUNT

Flange mount design offers sturdy mechanical support, improving stability in high-vibration environments.

Maximum Operating Temperature: 150 °C

High operating temperature rating allows the diode to function reliably in challenging thermal conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies assembly and reduces the risk of errors during installation.

Case Connection: ISOLATED

Isolated case connection minimizes risk of short circuits, enhancing safety and performance in applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for optimal soldering processes without damaging the component, ensuring high-quality assembly.

Peak Reflow Temperature °C: 260

This high peak temperature ensures compatibility with modern surface mount technologies.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it efficiently converts alternating current (AC) to direct current (DC), making it vital in power supply applications.

Maximum Forward Voltage (VF): 0.85 V

Low forward voltage drop improves energy efficiency, resulting in less heat generation during operation.

Maximum Output Current: 20 A

Support for high output current makes this product suitable for demanding applications, ensuring robust power handling.

Technology: SCHOTTKY

Schottky technology allows for faster switching speeds and lower voltage drops, ideal for high-frequency applications.

Terminal Form: THROUGH-HOLE

Through-hole design provides mechanical stability and enhanced heat dissipation, great for high-current applications.

Maximum Repetitive Peak Reverse Voltage: 100 V

High peak reverse voltage capability ensures protection against voltage spikes, improving circuit reliability.

Maximum Non Repetitive Peak Forward Current: 350 A

A high pulse current rating allows for handling transient loads, making this diode suitable for surge applications.

Diode Element Material: SILICON

Silicon is a reliable semiconductor material, ensuring good performance and durability in a variety of applications.

Technical Specifications

Diodes & Rectifiers STPS20M100SFP attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Application:

GENERAL PURPOSE

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.85 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Non Repetitive Peak Forward Current:

350 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

100 V

Maximum Reverse Current:

40 uA

Reverse Test Voltage:

100 V

Surface Mount:

NO

Technology:

SCHOTTKY

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STPS20M100SFP Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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