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STP20N20

STMicroelectronics

STP20N20 by STMicroelectronics

STP20N20 by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 18 A and a breakdown voltage of 200 V. It operates in enhancement mode with a power dissipation of up to 90 W. Its compact design suits various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,124 parts In-Stock

1+ parts

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5,124

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Digiode

USA . 3,161 parts In-Stock

1+ parts

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3,161

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Anansix

USA . 2,370 parts In-Stock

1+ parts

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2,370

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ComSIT Distribution GmbH

Germany . 1,650 parts In-Stock

1+ parts

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1,650

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ComSIT USA

USA . 1,650 parts In-Stock

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1,650

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Rebound Electronics

UK . 300 parts In-Stock

1+ parts

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300

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Semi Source

USA . 25 parts In-Stock

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25

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Inventory MP

USA . 20 parts In-Stock

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20

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 395 parts In-Stock

1+ parts

$1.448

100+ parts

-

1k+ parts

$1.303

10k+ parts

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395

$1.448

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$1.303

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MKK Technologies

India . 2,113 parts In-Stock

1+ parts

$2.723

100+ parts

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2,113

$2.723

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DigiPath Technology Company

USA . 2,113 parts In-Stock

1+ parts

$2.723

100+ parts

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2,113

$2.723

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AZTECH Wire

Italy . 800 parts In-Stock

1+ parts

$11.860

100+ parts

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800

$11.860

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Alle Elektronik GmbH

Germany . 3,594 parts In-Stock

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3,594

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Parana Technologies

USA . 2,218 parts In-Stock

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$1.731

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2,218

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$1.731

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Kepictronics

USA . 1,750 parts In-Stock

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1,750

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Corphita

USA . 1,705 parts In-Stock

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1,705

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Overview

Unlock unparalleled performance with the STP20N20 from STMicroelectronics, a leading name in semiconductor innovation. Designed for seamless switching applications, this N-channel power FET ensures superior efficiency and reliability, perfect for demanding environments. With robust features like high breakdown voltage and built-in diode, it delivers exceptional value that enhances system longevity and reduces downtime. Elevate your designs with trusted quality from STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight and durable packaging, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher efficiency and faster switching speeds, making this FET ideal for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances circuit protection and simplifies design, reducing overall component count.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET provides reliable performance in power conversion systems.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this product is suitable for high-voltage applications, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCB layouts, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical support, making it easier to handle and solder in various environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables higher efficiency, making this FET suitable for modern power electronics applications.

Maximum Pulsed Drain Current (IDM): 72 A

A high maximum pulsed drain current allows this FET to handle demanding transient conditions, perfect for high-performance circuits.

Avalanche Energy Rating (EAS): 110 mJ

The avalanche energy rating indicates robustness against voltage spikes, enhancing reliability in circuitry.

Maximum Drain Current (Abs) (ID): 18 A

A maximum drain current of 18 A supports powerful applications, making it ideal for high-performance markets.

No. of Terminals: 3

With three terminals, the device enables easy integration into various circuits, simplifying design requirements.

Maximum Power Dissipation (Abs): 90 W

High power dissipation capability ensures effective thermal management, improving performance under heavy loads.

Package Style (Meter): FLANGE MOUNT

Flange mount design enhances thermal dissipation and mounting stability, ensuring reliable operation in the field.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching, making this FET suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

Withstanding temperatures up to 150 °C ensures reliability in high-temperature environments, enhancing safety and longevity.

Transistor Element Material: SILICON

Silicon-based construction is standard in FET technology, offering excellent electrical characteristics and stability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, improving the longevity of connections.

Maximum Drain Current (ID): 18 A

Duplicate specification emphasizing the ability to manage high current loads, adding reliability and performance.

Maximum Drain-Source On Resistance: 0.125 ohm

Low on-resistance minimizes power loss and heat generation during operation, enhancing efficiency in power applications.

Terminal Position: SINGLE

Single terminal positioning allows for straightforward circuit integration and minimizes layout complexity.

Technical Specifications

Power Field Effect Transistors (FET) STP20N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

110 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP20N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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