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STP190N55LF3

STMicroelectronics

STP190N55LF3 by STMicroelectronics

STP190N55LF3 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 120 A, a breakdown voltage of 55 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$3.578

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 647 parts In-Stock

1+ parts

$5.370

100+ parts

$2.557

1k+ parts

$2.013

10k+ parts

-

647

$5.370

$2.557

$2.013

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Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

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$3.578

10k+ parts

$2.713

2,000

-

-

$3.578

$2.713

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.578

10k+ parts

$2.713

2,000

-

-

$3.578

$2.713

Distributors (In-Stock)

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Digiode

USA . 1,505 parts In-Stock

1+ parts

$5.966

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1,505

$5.966

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Vyrian

USA . 7,898 parts In-Stock

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7,898

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Anansix

USA . 1,322 parts In-Stock

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1,322

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Chip Stock

USA . 1,075 parts In-Stock

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1,075

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,301 parts In-Stock

1+ parts

$0.436

100+ parts

-

1k+ parts

$0.392

10k+ parts

-

1,301

$0.436

-

$0.392

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MKK Technologies

India . 549 parts In-Stock

1+ parts

$0.820

100+ parts

-

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549

$0.820

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DigiPath Technology Company

USA . 549 parts In-Stock

1+ parts

$0.820

100+ parts

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549

$0.820

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Component Stockers USA

USA . 2,260 parts In-Stock

1+ parts

$2.890

100+ parts

$2.740

1k+ parts

$2.650

10k+ parts

-

2,260

$2.890

$2.740

$2.650

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Corphita

USA . 3,074 parts In-Stock

1+ parts

$5.652

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3,074

$5.652

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Ampacity Inc.

Singapore . 835 parts In-Stock

1+ parts

$11.620

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835

$11.620

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iodParts Technologies Inc.

India . 50,000 parts In-Stock

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Kepictronics

USA . 10,065 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Alle Elektronik GmbH

Germany . 4,424 parts In-Stock

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4,424

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Perfect Parts

USA . 3,969 parts In-Stock

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3,969

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Parana Technologies

USA . 1,361 parts In-Stock

1+ parts

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$0.521

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1,361

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$0.521

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Overview

Unlock the power of efficiency with STMicroelectronics' STP190N55LF3 Power FET. Crafted for superior performance, this N-channel transistor excels in demanding switching applications, delivering unbeatable reliability and low energy loss. With a robust design and a commitment to quality, STMicroelectronics ensures you benefit from unmatched durability and exceptional operational stability, making it the ideal choice for automotive, industrial, and consumer electronics. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, making it suitable for reliable applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode enhances the versatility and simplifies circuit design, especially in applications requiring flyback or freewheeling diodes.

Transistor Application: SWITCHING

Designed for switching applications, this transistor ensures fast operation, making it perfect for various power management systems.

Minimum DS Breakdown Voltage: 55 V

A minimum breakdown voltage of 55V allows for safe operation in a variety of applications, even under higher stress conditions.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy mounting and integration into diverse electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure a reliable and robust mechanical connection, suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation delivers better switching performance and efficiency, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 480 A

With a pulsed drain current rating of 480 A, this FET can manage high current surges, making it excellent for demanding applications.

Avalanche Energy Rating (EAS): 1000 mJ

An avalanche energy rating of 1000 mJ provides enhanced immunity to voltage spikes, increasing reliability under transient conditions.

Maximum Drain Current (Abs) (ID): 120 A

Capable of handling a maximum drain current of 120 A, this FET is suitable for high-power applications where substantial current is required.

No. of Terminals: 3

The three-terminal design simplifies circuit integration while providing essential connectivity for efficient operation.

Maximum Power Dissipation (Abs): 312 W

A power dissipation capacity of 312 W indicates excellent thermal performance, making it suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides additional mechanical support and easier attachment to heatsinks for better thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

As a MOSFET, it offers fast switching speeds and minimal on-resistance, optimizing power efficiency and thermal performance.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175 °C, this FET can operate in harsh environments, increasing reliability.

Transistor Element Material: SILICON

Silicon as the material ensures excellent electrical properties and thermal conductivity, making it durable for various applications.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish minimizes oxidation and ensures good solderability, enhancing manufacturing and assembly processes.

Maximum Drain Current (ID): 120 A

The ability to handle a maximum drain current of 120 A ensures this FET can be efficiently used in high-performance applications.

Maximum Drain-Source On Resistance: 0.0045 ohm

A low on-resistance of 0.0045 ohm reduces power losses during operation, improving efficiency and lowering heat generation.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and layout, facilitating easier integration into electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) STP190N55LF3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP190N55LF3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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