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STP16NF06FP

STMicroelectronics

STP16NF06FP by STMicroelectronics

STP16NF06FP from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 11 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for efficient power management in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 3,065 parts In-Stock

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Digiode

USA . 2,194 parts In-Stock

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Anansix

USA . 801 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 722 parts In-Stock

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Holdelec - ElecDif-Pro

France . 722 parts In-Stock

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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LIBRA Elektronik GmbH

Germany . 149 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 14 parts In-Stock

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Donberg Electronics Ltd

Ireland . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 667 parts In-Stock

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$1.029

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$0.927

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MKK Technologies

India . 1,155 parts In-Stock

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$1.936

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$1.936

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DigiPath Technology Company

USA . 1,155 parts In-Stock

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$1.936

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AZTECH Wire

Italy . 1,192 parts In-Stock

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Kepictronics

USA . 35,950 parts In-Stock

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Lixinc

USA . 16,233 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,199 parts In-Stock

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Corphita

USA . 3,715 parts In-Stock

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Authorized Procurement Solutions

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Parana Technologies

USA . 2,178 parts In-Stock

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Assy Fe

Spain . 1,244 parts In-Stock

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Glotronic Ltd.

UK . 27 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the STP16NF06FP from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET delivers exceptional switching performance, ensuring reliability and efficiency for demanding applications like motor control and power management. With its sturdy build and enhanced features, this transistor provides unmatched value, empowering your projects to achieve peak performance while simplifying your design process. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and excellent insulation properties, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency and better performance in switching applications, making them ideal for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers enhanced protection and simplifies circuit design, providing greater reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET is optimized for fast operation, making it ideal for modern electronic circuits.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages, making it suitable for a range of demanding applications.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCBs, which is crucial in compact electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures robust mechanical stability and is easy to assemble, especially in rugged applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption while enhancing performance in switching applications.

Maximum Pulsed Drain Current (IDM): 44 A

A high pulsed drain current rating of 44A enables this FET to handle brief surges, making it great for transient applications.

Avalanche Energy Rating (EAS): 130 mJ

The avalanche energy rating indicates its ability to handle energy pulses without failure, enhancing reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 11 A

Able to handle a maximum drain current of 11A, this FET is appropriate for moderate power applications.

No. of Terminals: 3

With only three terminals, this FET simplifies the design process and reduces the footprint on printed circuit boards.

Maximum Power Dissipation (Abs): 25 W

The ability to dissipate up to 25W of power ensures reliable operation in power-hungry applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure mounting options, enhancing the reliability of connections in high-stress environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high-speed operation and low power consumption, making it an excellent choice for high-efficiency designs.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature of 175 °C ensures reliability in demanding applications and extreme conditions.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its efficiency and reliability in various electronic applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent solderability and resistance to oxidation, ensuring long-term performance.

Maximum Drain Current (ID): 11 A

The FET supports a maximum drain current of 11A, allowing it to operate well within safe limits for various applications.

Maximum Drain-Source On Resistance: 0.1 ohm

Low on-resistance of 0.1 ohm minimizes power losses during operation, enhancing overall efficiency.

Terminal Position: SINGLE

Single terminal position simplifies integration into designs, reducing layout complexity.

Case Connection: ISOLATED

Isolated case connection improves safety and prevents unwanted electrical interference, vital for sensitive circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP16NF06FP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

130 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP16NF06FP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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