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STP160N75F3

STMicroelectronics

STP160N75F3 by STMicroelectronics

STP160N75F3 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 120 A, breakdown voltage of 75 V, and power dissipation up to 330 W. Ideal for high-efficiency power management in various electronic devices.

Median Price

$4.370

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 900 parts In-Stock

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900

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Verical

USA . 24 parts In-Stock

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$4.370

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24

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Chip Stock

USA . 5,280 parts In-Stock

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Vyrian

USA . 5,141 parts In-Stock

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Digiode

USA . 3,817 parts In-Stock

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J2 Sourcing AB

Sweden . 3,390 parts In-Stock

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Anansix

USA . 1,566 parts In-Stock

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Pegasus Components GmbH

Germany . 900 parts In-Stock

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900

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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Elcom Components

USA . 23 parts In-Stock

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Inventory MP

USA . 20 parts In-Stock

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Bristol Electronics

USA . 20 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,532 parts In-Stock

1+ parts

$0.940

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$0.846

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1,532

$0.940

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$0.846

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MKK Technologies

India . 159 parts In-Stock

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$1.768

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159

$1.768

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DigiPath Technology Company

USA . 159 parts In-Stock

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$1.768

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$1.768

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Ampacity Inc.

Singapore . 263 parts In-Stock

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$3.710

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$3.710

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AZTECH Wire

Italy . 1,200 parts In-Stock

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$17.510

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A-Z Elektronik GmbH

Germany . 7,010 parts In-Stock

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Perfect Parts

USA . 4,882 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,160 parts In-Stock

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Corphita

USA . 1,432 parts In-Stock

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Kepictronics

USA . 1,424 parts In-Stock

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Epart123

USA . 1,000 parts In-Stock

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$6.880

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$6.250

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$6.250

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$6.250

$6.250

GreenTree Electronics

Israel . 1,000 parts In-Stock

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Parana Technologies

USA . 702 parts In-Stock

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$1.124

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702

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$1.124

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Overview

Unleash the power of efficiency with the STP160N75F3 from STMicroelectronics! This top-tier N-channel Power FET is expertly crafted to deliver exceptional performance in demanding switching applications. With a robust design and built-in diode, it ensures reliable operation under high currents, maximizing your system’s reliability and lifespan. Count on STMicroelectronics' commitment to quality for innovative solutions that drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher efficiency and better performance characteristics in switching applications, making this product a strong candidate for electronic designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection and functionality, reducing the need for additional components in circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can effectively manage high-speed operations, enhancing overall circuit performance.

Minimum DS Breakdown Voltage: 75 V

With a minimum breakdown voltage of 75 V, this FET can handle a wide range of voltages, adding versatility to its usage.

Package Shape: RECTANGULAR

The rectangular package shape facilitates compact layouts and efficient use of PCB space, promoting better design practices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are easy to solder, ensuring reliable connections in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient control of the FET, making it ideal for precision applications.

Maximum Pulsed Drain Current (IDM): 480 A

The high maximum pulsed drain current capability of 480 A enables this FET to handle heavy loads, vital for demanding applications.

Maximum Drain Current (Abs) (ID): 120 A

With an absolute maximum drain current of 120 A, this FET is capable of managing significant current levels, assuring reliable operation in power applications.

No. of Terminals: 3

Having three terminals simplifies the design and enhances integration possibilities in different circuits.

Maximum Power Dissipation (Abs): 330 W

The capability to dissipate up to 330 W of power ensures that this FET can function effectively without overheating in high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging allows for easy attachment to heatsinks, enhancing thermal management and stability in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency and fast switching speeds, making it suitable for modern electronic circuits in computing and automotive applications.

Maximum Operating Temperature: 175 °C

The ability to operate at elevated temperatures up to 175 °C ensures reliability in extreme conditions, making it ideal for industrial applications.

Transistor Element Material: SILICON

Silicon as the element material enhances the stability and reliability of the FET, ensuring consistent performance over time.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring durable electrical connections over the lifespan of the device.

Maximum Drain-Source On Resistance: 0.0045 ohm

Low on-resistance minimizes power losses during operation, increasing efficiency in power management applications.

Terminal Position: SINGLE

Single terminal positioning simplifies the layout and helps in accommodating this FET in various circuit designs without complicating the assembly process.

Technical Specifications

Power Field Effect Transistors (FET) STP160N75F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP160N75F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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