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STP14NF12FP

STMicroelectronics

STP14NF12FP by STMicroelectronics

STP14NF12FP by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 8.5 A, a breakdown voltage of 120 V, and operates at up to 175 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,912 parts In-Stock

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Digiode

USA . 2,157 parts In-Stock

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Anansix

USA . 2,135 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,750 parts In-Stock

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1,750

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Cyclops Electronics Ltd

UK . 75 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 32 parts In-Stock

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LittleDiode

UK . 5 parts In-Stock

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IDEA Electronic Components Group

UK . 1,867 parts In-Stock

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$0.834

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$0.750

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1,867

$0.834

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$0.750

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MKK Technologies

India . 707 parts In-Stock

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$1.567

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707

$1.567

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DigiPath Technology Company

USA . 707 parts In-Stock

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$1.567

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707

$1.567

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AZTECH Wire

Italy . 474 parts In-Stock

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$9.250

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474

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Component Stockers USA

USA . 721 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,421 parts In-Stock

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Kepictronics

USA . 4,800 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,086 parts In-Stock

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Parana Technologies

USA . 2,334 parts In-Stock

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$0.997

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Authorized Procurement Solutions

USA . 2,300 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,979 parts In-Stock

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Perfect Parts

USA . 840 parts In-Stock

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Corphita

USA . 444 parts In-Stock

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ChipstoGo Electronic ltd

UK . 100 parts In-Stock

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Assy Fe

Spain . 18 parts In-Stock

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Overview

Elevate your designs with the STP14NF12FP from STMicroelectronics, a powerhouse in power FETs renowned for their reliability and performance. Engineered for robust switching applications, this N-channel transistor delivers exceptional efficiency and durability, making it ideal for diverse industries—from automotive to consumer electronics. Trust in STMicroelectronics for quality that drives innovation, ensuring your projects benefit from better thermal management and higher current handling capabilities. Unlock new possibilities with the STP14NF12FP and experience unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, ensuring a long lifespan for the device.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency and lower on-resistance, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility of the FET by allowing it to handle inductive loads and provides additional protection against voltage spikes.

Transistor Application: SWITCHING

Ideal for switching applications, this FET allows for quick and efficient control of power in various electronic circuits.

Minimum DS Breakdown Voltage: 120 V

With a minimum breakdown voltage of 120 V, this FET is suitable for high-voltage applications, increasing its usability in diverse circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space and easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing reliability during assembly and operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enables the FET to operate more efficiently in the 'off' state, reducing standby power consumption.

Maximum Pulsed Drain Current (IDM): 34 A

A high pulsed drain current capability allows the device to handle short bursts of high current, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 60 mJ

This rating indicates the FET's ability to withstand energy spikes, contributing to its reliability in protection and switching circuits.

Maximum Drain Current (Abs) (ID): 8.5 A

With a maximum drain current rating of 8.5 A, this FET can efficiently support a variety of power applications.

No. of Terminals: 3

The three terminals enable simplified connection and versatility for various circuit configurations.

Maximum Power Dissipation (Abs): 25 W

A maximum power dissipation of 25 W allows the FET to operate efficiently without overheating in most applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides stability and ease of mounting, essential for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology results in higher input impedance and lower power consumption, enhancing overall performance in circuits.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows this FET to be used in demanding environments without failure.

Transistor Element Material: SILICON

Silicon is a widely used material in FETs, ensuring good performance, availability, and cost-effectiveness.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability, ensuring reliable connections during assembly.

Maximum Drain Current (ID): 8.5 A

This reiterates the FET's ability to control power efficiently, ideal for various high-current applications.

Maximum Drain-Source On Resistance: 0.18 ohm

Low on-resistance reduces power losses during operation, enhancing the overall efficiency of the device.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and integration into a range of applications.

Case Connection: ISOLATED

Isolated case connection enhances safety by preventing unintended current paths, ensuring reliable operation in sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STP14NF12FP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

120 V

Maximum Drain Current (Abs) (ID):

8.5 A

Maximum Drain Current (ID):

8.5 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

34 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP14NF12FP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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