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STP14NF12

STMicroelectronics

STP14NF12 by STMicroelectronics

STP14NF12 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 14 A, a breakdown voltage of 120 V, and operates at up to 175 °C. Ideal for power management in various electronic devices.

Median Price

$1.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1 parts In-Stock

1+ parts

$1.380

100+ parts

$0.904

1k+ parts

$0.630

10k+ parts

$0.538

1

$1.380

$0.904

$0.630

$0.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

R&J Components

USA . 7,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,980

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-

-

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Chip Stock

USA . 7,622 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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7,622

-

-

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Vyrian

USA . 3,693 parts In-Stock

1+ parts

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3,693

-

-

-

-

Anansix

USA . 2,642 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,642

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Digiode

USA . 1,987 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,987

-

-

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 492 parts In-Stock

1+ parts

$0.947

100+ parts

-

1k+ parts

$0.852

10k+ parts

-

492

$0.947

-

$0.852

-

MKK Technologies

India . 13 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$1.780

-

-

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DigiPath Technology Company

USA . 13 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

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13

$1.780

-

-

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AZTECH Wire

Italy . 274 parts In-Stock

1+ parts

$10.050

100+ parts

-

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274

$10.050

-

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Ampacity Inc.

Singapore . 1,593 parts In-Stock

1+ parts

$17.050

100+ parts

-

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1,593

$17.050

-

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Kepictronics

USA . 13,000 parts In-Stock

1+ parts

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13,000

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Perfect Parts

USA . 11,032 parts In-Stock

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11,032

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Alle Elektronik GmbH

Germany . 3,016 parts In-Stock

1+ parts

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3,016

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,759 parts In-Stock

1+ parts

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2,759

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RC Electronics

USA . 2,700 parts In-Stock

1+ parts

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2,700

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Parana Technologies

USA . 1,302 parts In-Stock

1+ parts

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100+ parts

$1.132

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1,302

-

$1.132

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Unlock the power of efficiency with the STP14NF12 from STMicroelectronics—a leader in semiconductor innovation. This N-channel Power FET combines exceptional switching capabilities with robust reliability, making it perfect for various applications, from automotive to industrial. With a strong focus on quality and performance, STMicroelectronics delivers unmatched value, ensuring your designs run cooler and more efficiently. Elevate your projects and experience the benefits today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high efficiency and superior conductivity, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the transistor from reverse voltage, enhancing reliability in switching circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and reliable operation in power management systems.

Minimum DS Breakdown Voltage: 120 V

With a high breakdown voltage, this FET can handle substantial voltage levels, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape aids in space-efficient mounting on PCBs, optimizing layout designs in compact electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical connections and is ideal for high-power applications, ensuring stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs typically offer lower power dissipation and better control, leading to efficient performance in power supply circuits.

Maximum Pulsed Drain Current (IDM): 56 A

This high pulsed drain current rating allows the FET to handle peak loads effectively, making it suitable for applications with transient currents.

Avalanche Energy Rating (EAS): 60 mJ

The avalanche energy rating indicates the FET's ability to withstand energy spikes without damage, enhancing its reliability in unforeseen conditions.

Maximum Drain Current (Abs) (ID): 14 A

A maximum drain current of 14 A ensures that the FET can handle considerable load currents, making it dependable for various applications.

No. of Terminals: 3

With three terminals, this FET is simple to integrate into designs, facilitating easy connections in circuit layouts.

Maximum Power Dissipation (Abs): 60 W

A high power dissipation capability means this FET can handle substantial power levels, making it suitable for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers secure attachment to heatsinks or circuit boards, ensuring efficient heat dissipation for reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low on-resistance and high-speed switching, contributing to overall efficiency in electronic systems.

Maximum Operating Temperature: 175 C

A high operating temperature tolerance makes this FET suitable for demanding environments, ensuring reliable performance at elevated temperatures.

Transistor Element Material: SILICON

Silicon provides excellent thermal stability and performance, making it a preferred choice in power electronics.

Terminal Finish: MATTE TIN

The matte tin finish helps in preventing corrosion and provides reliable electrical connectivity, enhancing long-term performance.

Maximum Drain Current (ID): 14 A

This dual mention strengthens the emphasis on the FET's capability to handle significant current, ensuring dependability in design.

Maximum Drain-Source On Resistance: 0.18 ohm

Low on-state resistance translates to higher efficiency by reducing power losses during operation, making this FET energy-efficient.

Terminal Position: SINGLE

Single terminal position simplifies integration and reduces design complexity, making it user-friendly for engineers.

Case Connection: DRAIN

Direct drain connection facilitates efficient heat dissipation and improves overall performance in power circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP14NF12 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

60 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

120 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP14NF12 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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