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STP12N65M5

STMicroelectronics

STP12N65M5 by STMicroelectronics

STP12N65M5 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 34A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$1.881

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 42 parts In-Stock

1+ parts

$1.492

100+ parts

$1.492

1k+ parts

$1.492

10k+ parts

$1.492

42

$1.492

$1.492

$1.492

$1.492

Chip1Stop

Japan . 12 parts In-Stock

1+ parts

$2.270

100+ parts

-

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-

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12

$2.270

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Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$2.630

100+ parts

$1.910

1k+ parts

$1.450

10k+ parts

$1.310

1

$2.630

$1.910

$1.450

$1.310

Verical

USA . 42 parts In-Stock

1+ parts

-

100+ parts

$1.492

1k+ parts

$1.492

10k+ parts

$1.492

42

-

$1.492

$1.492

$1.492

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,607 parts In-Stock

1+ parts

$1.417

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-

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4,607

$1.417

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-

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Vyrian

USA . 11,843 parts In-Stock

1+ parts

-

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11,843

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Anansix

USA . 2,365 parts In-Stock

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2,365

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LWI Electronics Inc

India . 19 parts In-Stock

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19

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,077 parts In-Stock

1+ parts

$0.511

100+ parts

-

1k+ parts

$0.460

10k+ parts

-

1,077

$0.511

-

$0.460

-

MKK Technologies

India . 966 parts In-Stock

1+ parts

$0.960

100+ parts

-

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966

$0.960

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DigiPath Technology Company

USA . 966 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

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-

966

$0.960

-

-

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.961

100+ parts

$0.875

1k+ parts

$0.788

10k+ parts

-

100

$0.961

$0.875

$0.788

-

Corphita

USA . 4,924 parts In-Stock

1+ parts

$1.343

100+ parts

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4,924

$1.343

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Microchip USA

USA . 8,218 parts In-Stock

1+ parts

$18.980

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8,218

$18.980

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Kepictronics

USA . 10,065 parts In-Stock

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10,065

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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Perfect Parts

USA . 4,400 parts In-Stock

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4,400

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Parana Technologies

USA . 1,748 parts In-Stock

1+ parts

-

100+ parts

$0.610

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1,748

-

$0.610

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Futuretech Components

Singapore . 149 parts In-Stock

1+ parts

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149

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Overview

Elevate your designs with the STP12N65M5 N-Channel Power FET from STMicroelectronics, a trusted name in semiconductor innovation. This high-quality transistor excels in switching applications, offering outstanding performance with impressive efficiency and reliability. Benefit from its robust construction and exceptional thermal management, ensuring long-lasting operation in demanding environments. Empower your projects with superior power solutions that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and faster switching speeds, enhancing the performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added functionality, including protection against voltage spikes and improved circuit efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides reliable performance for controlling power in various electronic systems.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage allows this FET to operate safely in high-voltage environments, increasing its versatility in applications.

Package Shape: RECTANGULAR

Rectangular package shapes facilitate easier layout design and integration into PCB assemblies, enhancing manufacturability.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides excellent mechanical stability and ease of soldering, ensuring reliable connections in demanding conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and higher efficiency in active use, making it ideal for battery-operated devices.

Maximum Pulsed Drain Current (IDM): 34 A

The ability to handle high pulsed drain currents enhances the FET's suitability for dynamic applications where brief surges are present.

Avalanche Energy Rating (EAS): 150 mJ

A high avalanche energy rating indicates the device can safely handle transient energy levels, ensuring robustness in variable conditions.

Maximum Drain Current (Abs) (ID): 8.5 A

The maximum continuous drain current capacity of 8.5 A allows for substantial loads, making this FET ideal for various power electronics.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit design and enables straightforward integration into various electronic systems.

Maximum Power Dissipation (Abs): 70 W

With a power dissipation of 70 W, this FET can efficiently manage heat, improving reliability in high-performance applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style allows for secure mounting in various applications, ensuring stability and reliability under mechanical stress.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making it a great choice for modern circuit designs.

Maximum Operating Temperature: 150 °C

An operating temperature up to 150 °C ensures functionality in extreme environments, enabling wider application usage.

Transistor Element Material: SILICON

Silicon as a material ensures durability and stability in the FET’s performance across various operating conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing the lifespan of the connections.

Maximum Drain Current (ID): 8.5 A

Reiterating the maximum drain current capacity allows for robust performance in multiple applications, emphasizing its capability.

Maximum Drain-Source On Resistance: 0.43 ohm

A low on-resistance of 0.43 ohms reduces heat generation and improves efficiency, making the FET ideal for high-performance applications.

Terminal Position: SINGLE

A single terminal position simplifies PCB layout, allowing for compact and efficient designs in electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP12N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

8.5 A

Maximum Drain Current (ID):

8.5 A

Maximum Drain-Source On Resistance:

.43 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

34 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP12N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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