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STMUX1800LQTR

STMicroelectronics

STMUX1800LQTR by STMicroelectronics

STMUX1800LQTR by STMicroelectronics is a versatile multiplexer with a rectangular chip carrier package and 56 terminals. It supports peak reflow temps of 260 °C for efficient soldering, making it ideal for compact electronic applications. Its nickel-palladium-gold finish ensures reliable connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,569 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,569

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Chip Stock

USA . 4,800 parts In-Stock

1+ parts

-

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-

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4,800

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Digiode

USA . 1,073 parts In-Stock

1+ parts

-

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-

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1,073

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Anansix

USA . 329 parts In-Stock

1+ parts

-

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329

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$18.900

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$18.900

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-

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IDEA Electronic Components Group

UK . 1,347 parts In-Stock

1+ parts

$24.285

100+ parts

-

1k+ parts

$21.857

10k+ parts

-

1,347

$24.285

-

$21.857

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MKK Technologies

India . 1,210 parts In-Stock

1+ parts

$45.667

100+ parts

-

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10k+ parts

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1,210

$45.667

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DigiPath Technology Company

USA . 1,210 parts In-Stock

1+ parts

$45.667

100+ parts

-

1k+ parts

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10k+ parts

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1,210

$45.667

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,733 parts In-Stock

1+ parts

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20,733

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Perfect Parts

USA . 10,152 parts In-Stock

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10,152

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Metaverse IC Inc.

Canada . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Kepictronics

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Microchip USA

USA . 3,638 parts In-Stock

1+ parts

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3,638

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 1,755 parts In-Stock

1+ parts

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1,755

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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-

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Parana Technologies

USA . 144 parts In-Stock

1+ parts

-

100+ parts

$29.037

1k+ parts

-

10k+ parts

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144

-

$29.037

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-

Overview

Unlock the potential of your designs with the STMUX1800LQTR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multiplexer delivers exceptional quality and reliability, enhancing system performance in demanding applications like telecommunications and automotive. With its advanced packaging and superior terminal finishes, experience seamless integration and optimized efficiency, giving you the competitive edge in today's fast-paced market.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design ensures a compact footprint, making it ideal for high-density applications and saving valuable board space.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on the PCB, enabling better layout options for complex circuits.

No. of Terminals: 56

With 56 terminals, this multiplexer/demultiplexer can support multiple signal paths, ideal for applications requiring high channel density.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides ease of integration into various systems, ensuring reliable connections while minimizing signal degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium nickel palladium gold terminal finish enhances solderability and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

Quad terminal positioning facilitates better routing and density management on PCBs, improving overall circuit design flexibility.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for optimal soldering without damaging sensitive components, increasing manufacturing yield.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can be reliably soldered using standard reflow processes, suitable for industrial applications.

Terminal Form: NO LEAD

The no-lead design improves thermal and electrical performance while simplifying PCB design, promoting more efficient use of space.

Packing Method: TR

The tape and reel packing method simplifies automated assembly processes, allowing for efficient manufacturing and reduced handling time.

Technical Specifications

Multiplexer & Demultiplexer STMUX1800LQTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

JESD-30 Code:

R-XQCC-N56

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

56

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STMUX1800LQTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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