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STM8S208R8T6

STMicroelectronics

STM8S208R8T6 by STMicroelectronics

STM8S208R8T6 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 64 terminals, 16 ADC channels, and supports various connectivity options like CAN and I2C. Ideal for industrial applications requiring robust performance.

Median Price

$4.350

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 449 parts In-Stock

1+ parts

$4.350

100+ parts

$2.680

1k+ parts

$2.480

10k+ parts

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449

$4.350

$2.680

$2.480

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Distributors (In-Stock)

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Digiode

USA . 589 parts In-Stock

1+ parts

$4.360

100+ parts

-

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589

$4.360

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Ozdisan Elektronik

Türkiye . 160 parts In-Stock

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$53.769

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160

$53.769

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 1,964 parts In-Stock

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1,964

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Anansix

USA . 327 parts In-Stock

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327

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

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30

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Distributors (Availability)

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Vigor

Singapore . 4,000 parts In-Stock

1+ parts

$3.690

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-

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4,000

$3.690

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Corphita

USA . 4,856 parts In-Stock

1+ parts

$4.131

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4,856

$4.131

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Microchip USA

USA . 2,080 parts In-Stock

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$18.645

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2,080

$18.645

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IDEA Electronic Components Group

UK . 1,057 parts In-Stock

1+ parts

$48.470

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$43.623

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1,057

$48.470

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$43.623

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MKK Technologies

India . 594 parts In-Stock

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$91.145

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594

$91.145

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DigiPath Technology Company

USA . 594 parts In-Stock

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$91.145

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594

$91.145

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 9,600 parts In-Stock

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9,600

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A-Z Elektronik GmbH

Germany . 6,581 parts In-Stock

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Perfect Parts

USA . 5,803 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Eastek

USA . 2,240 parts In-Stock

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$3.960

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2,240

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$3.960

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Parana Technologies

USA . 1,646 parts In-Stock

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$57.954

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1,646

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$57.954

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Infinite Electronics LLP (Excess)

. 968 parts In-Stock

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968

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Overview

Elevate your projects with the STM8S208R8T6 microcontroller from STMicroelectronics, a trusted leader in innovation and quality. Designed for versatility, this 8-bit powerhouse offers seamless integration in industrial applications, ensuring reliability in demanding environments. Experience enhanced performance with its rich set of peripherals and low power consumption, empowering you to create efficient, cutting-edge solutions tailored to your needs. Unlock potential and drive success with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides good protection against environmental factors, ensuring longevity and reliability in various applications.

Surface Mount: YES

The surface mount design allows for compact circuit designs and easier integration into modern electronics.

Maximum Supply Voltage: 5.5 V

Supports standard power supply levels, making it more versatile for different applications.

Package Shape: SQUARE

A square shape can help optimize PCB space and improve layout versatility.

Bit Size: 8

An 8-bit architecture is suitable for simpler applications, ensuring efficient processing for specific control tasks.

Power Supplies (V): 3.3/5

Dual voltage support allows for flexibility in power supply requirements, accommodating various systems.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample I/O options for complex interfacing and control.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This design offers a low profile, reducing the footprint on the PCB and facilitating easier soldering.

Minimum Supply Voltage: 3 V

A low minimum supply voltage enhances energy efficiency, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

A wide temperature range indicates suitability for industrial applications where environmental conditions may vary.

Minimum Operating Temperature: -40 °C

Operational capability in extreme cold weather conditions enhances its utility in outdoor and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality finish ensures excellent conductivity and corrosion resistance, increasing reliability.

ADC Channels: YES

Integrated ADC channels allow for direct sensor input without the need for external components, simplifying designs.

Terminal Position: QUAD

Quad terminal arrangement improves tracking performance and connection reliability.

ROM Words: 16384

A significant ROM capacity supports complex programming and functionality, allowing for more sophisticated applications.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for space-constrained applications and contributes to a sleek design.

Width: 10 mm

A compact width ensures compatibility with a wide range of PCB layouts, aiding in versatile designs.

Data EEPROM Size: 2K

Adequate EEPROM size for storing essential settings or data, beneficial for applications requiring non-volatile memory.

Peripherals: BOD, POR, TIMER(9)

Various onboard peripherals enhance functionality and facilitate better control over the microcontroller's operation.

Maximum Clock Frequency: 24 MHz

A high clock frequency ensures faster processing speeds, supporting responsive and efficient applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates good soldering compatibility, which is crucial for manufacturing.

Peak Reflow Temperature °C: 260

The microcontroller's ability to withstand high temperatures is essential for reliable soldering during assembly.

Length: 10 mm

Compact length supports efficiency in space management on PCB, allowing for dense designs.

Temperature Grade: INDUSTRIAL

An industrial grade ensures that the microcontroller can operate under more demanding conditions, suitable for tough environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimized performance for embedded systems.

RAM Bytes: 6144

A substantial RAM size supports the execution of complex programs and real-time data processing.

Technology: CMOS

CMOS technology provides low power consumption, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and reliable connections, essential for performance.

Analog To Digital Convertors: 16-Ch 10-Bit

The integrated ADCs provide high-resolution data conversion, useful for applications requiring precise monitoring.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage is efficient for modern low-power applications, maximizing battery life.

PWM Channels: YES

PWM capability is essential for controlling motors and other devices, enhancing its functionality.

Connectivity: CAN, I2C, LIN(2), SPI, UART(2)

Multiple connectivity options enhance integration with various peripherals and networking protocols.

ROM Programmability: FLASH

FLASH ROM allows for easy updates and reprogramming, ensuring the microcontroller can adapt to changing requirements.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports denser PCB layouts, optimizing space usage.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, informing appropriate handling and storage practices.

Speed: 24 rpm

This speed rating indicates the microcontroller's capability to process information quickly, suitable for real-time applications.

On Chip Program ROM Width: 32

32-bit wide program ROM allows for efficient data processing and program execution.

No. of I/O Lines: 52

With 52 I/O lines, this microcontroller can manage a wide array of sensors and devices, making it highly versatile.

Technical Specifications

Microcontrollers STM8S208R8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C, LIN(2), SPI, UART(2)

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STM8S208R8T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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