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STM8S208CBT3

STMicroelectronics

STM8S208CBT3 by STMicroelectronics

STM8S208CBT3 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates up to 125 °C. It features 35 external interrupts, 4 timers, and supports low power modes, making it ideal for automotive applications. Its compact design includes a flatpack package with 48 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Avnet

USA . 500 parts In-Stock

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500

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Vyrian

USA . 7,501 parts In-Stock

1+ parts

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7,501

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Digiode

USA . 3,644 parts In-Stock

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3,644

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Anansix

USA . 933 parts In-Stock

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933

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AZTECH Wire

Italy . 890 parts In-Stock

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$19.650

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890

$19.650

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Microchip USA

USA . 2,535 parts In-Stock

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$20.318

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2,535

$20.318

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IDEA Electronic Components Group

UK . 1,869 parts In-Stock

1+ parts

$33.586

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$30.228

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1,869

$33.586

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$30.228

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MKK Technologies

India . 1,178 parts In-Stock

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$63.157

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1,178

$63.157

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DigiPath Technology Company

USA . 1,178 parts In-Stock

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$63.157

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$63.157

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Corphita

USA . 2,687 parts In-Stock

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2,687

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Parana Technologies

USA . 1,632 parts In-Stock

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$40.158

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1,632

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$40.158

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Eastek

USA . 750 parts In-Stock

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$4.020

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750

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$4.020

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GreenTree Electronics

Israel . 750 parts In-Stock

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750

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Overview

Unlock the potential of your projects with the STM8S208CBT3 microcontroller from STMicroelectronics. Renowned for unmatched quality and reliability, STMicroelectronics delivers cutting-edge solutions that enhance performance across automotive and industrial applications. The STM8S208CBT3's low power consumption and robust design empower you to create innovative, efficient systems while benefiting from extensive support and resources. Elevate your designs and experience superior functionality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures good protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating easier integration into modern circuit boards and saving space.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate reliably with standard voltage levels in most electronic applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width supports efficient data manipulation, ideal for simpler control tasks and processing.

Package Shape: SQUARE

The square package shape helps in uniform heat distribution and integration into various layout designs.

Bit Size: 8

Being an 8-bit microcontroller, it is suitable for low to medium complexity applications, making it cost-effective.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample connectivity options for various peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack and low-profile design allows for easy mounting on PCB, and fine pitch ensures closer terminal placement for better performance.

Minimum Supply Voltage: 2.95 V

The ability to operate at a minimum of 2.95 V enables it to be used in low-power applications.

Maximum Operating Temperature: 125 °C

High operating temperature rating makes this microcontroller suitable for automotive and industrial applications where thermal reliability is essential.

CPU Family: STM8

The STM8 family is known for its reliability and performance, making it a solid choice for various embedded systems.

No. of External Interrupts: 35

Having 35 external interrupts means the microcontroller can efficiently handle multiple asynchronous events, enhancing its responsiveness.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 125 °C) makes this microcontroller ideal for use in harsh environments.

ADC Channels: YES

The inclusion of ADC channels allows for analog signal processing, expanding the range of applications significantly.

Terminal Position: QUAD

Quad terminal positioning contributes to better signal integrity and ease of soldering during assembly.

ROM Words: 131072

With 131072 ROM words, there is sufficient storage for complex programs or firmware, providing versatility in applications.

Maximum Seated Height: 1.6 mm

A low profile design (1.6 mm) allows for space-saving applications, particularly in compact devices.

RAM Words: 6144

Ample RAM words (6144) support larger and more complex applications, allowing for more variable storage and processing.

Width: 7 mm

A compact width of 7 mm enables it to fit into smaller electronic devices without sacrificing performance.

Maximum Clock Frequency: 24 MHz

The 24 MHz clock frequency allows for decent processing speed, suitable for a range of applications.

Length: 7 mm

A minimal length enhances the microcontroller’s capability to fit in confined spaces while maintaining its performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller ensures reliability and durability under challenging conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates various functionalities on a single chip, streamlining designs and reducing costs.

No. of Timers: 4

Four timers facilitate a variety of timing operations, such as delays and frequency generation, making it highly versatile.

RAM Bytes: 6144

The RAM size of 6144 bytes supports complex calculations and data handling for various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminal form provides a stable connection and ease of soldering, essential for quality assembly.

Maximum Supply Current: 18 mA

A maximum supply current of 18 mA enables this microcontroller to function effectively while maintaining low power consumption.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard, making it compatible with a wide range of devices and systems.

PWM Channels: YES

PWM channel support allows for precise control of motor speed and light dimming, enhancing its applicability in various projects.

ROM Programmability: FLASH

Flash programmability facilitates easy updates and modifications to the code, providing flexibility in application development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a more compact design while ensuring good electrical performance.

Format: FIXED POINT

Fixed-point format supports efficient arithmetic operations, particularly beneficial for real-time applications.

Speed: 24 rpm

A speed of 24 rpm enables even low-speed applications to function efficiently, ideal for robotics and automation controls.

Low Power Mode: YES

Low power mode functionality ensures energy efficiency, making it a suitable choice for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports compatibility with 8-bit architectures, optimizing firmware development.

No. of I/O Lines: 38

With 38 I/O lines, this microcontroller provides significant flexibility for connecting multiple inputs and outputs.

Technical Specifications

Microcontrollers STM8S208CBT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

35

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8S208CBT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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