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STM8S207S8T6CTR

STMicroelectronics

STM8S207S8T6CTR by STMicroelectronics

STM8S207S8T6CTR from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 24 MHz. It features 31 external interrupts, 9 ADC channels, and supports I2C, SPI, and UART for versatile applications in industrial settings. Its compact design ensures efficient performance in low-profile environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 9,427 parts In-Stock

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Vyrian

USA . 4,919 parts In-Stock

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Digiode

USA . 1,211 parts In-Stock

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Anansix

USA . 1,160 parts In-Stock

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Demsay Elektronik

Türkiye . 1,000 parts In-Stock

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HZD GmbH

Germany . 351 parts In-Stock

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351

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Vigor

Singapore . 3,647 parts In-Stock

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$3.370

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$3.370

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Microchip USA

USA . 2,127 parts In-Stock

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$14.430

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$14.340

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$14.300

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$14.260

2,127

$14.430

$14.340

$14.300

$14.260

AZTECH Wire

Italy . 725 parts In-Stock

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$16.790

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725

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Component Stockers USA

USA . 1,963 parts In-Stock

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$32.420

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IDEA Electronic Components Group

UK . 1,253 parts In-Stock

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$56.615

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$50.953

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MKK Technologies

India . 1,044 parts In-Stock

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$106.461

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DigiPath Technology Company

USA . 1,044 parts In-Stock

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$106.461

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iodParts Technologies Inc.

India . 49,000 parts In-Stock

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Eastek

USA . 23,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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Lixinc

USA . 6,876 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,804 parts In-Stock

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Corphita

USA . 3,480 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,321 parts In-Stock

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$67.692

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Futuretech Components

Singapore . 520 parts In-Stock

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Overview

Unlock your project’s potential with the STM8S207S8T6CTR microcontroller from STMicroelectronics, a trusted name in innovative technology. Designed for versatility, this high-quality microcontroller excels in various applications—from industrial automation to consumer electronics—ensuring reliable performance in diverse environments. Benefit from its low power consumption and rich peripheral set, empowering you to create efficient, advanced solutions that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable materials enhance the longevity and reliability of the microcontroller in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Supports a wider range of power supplies, accommodating various systems and minimizing compatibility issues.

On Chip Data RAM Width: 8

8-bit RAM width improves processing efficiency for specific applications, streamlining data handling.

Package Shape: SQUARE

Square packages are easier to mount and provide optimal thermal performance in high-density applications.

Bit Size: 8

8-bit architecture is suitable for many embedded applications, balancing performance and simplicity.

No. of Terminals: 44

A higher number of terminals facilitates more I/O options, enabling complex functionalities in designs.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile packages help in minimizing height in design constraints without compromising performance.

Minimum Supply Voltage: 3 V

Lower operating voltage can lead to reduced power consumption, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes it suitable for industrial applications and environments with elevated heat.

CPU Family: STM8

Well-supported family with extensive community and development resources ensures ease of use and reliability.

No. of External Interrupts: 31

A large number of interrupts enables the microcontroller to respond quickly to various external stimuli.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing assembly quality.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to interact with analog signals, expanding its application range.

Terminal Position: QUAD

Quad terminal configuration allows flexible and efficient PCB layout, optimizing space and routing.

ROM Words: 16384

Generous ROM size enables more complex programs or data storage, enhancing the MCU's capability.

Maximum Seated Height: 1.6 mm

Low seated height reduces overall device profile, ideal for compact electronics.

RAM Words: 6144

Sufficient RAM allows more efficient data manipulation during operation, beneficial for intensive applications.

Data EEPROM Size: 1536

On-chip EEPROM allows for data retention even when power is lost, useful for storing configuration settings.

Peripherals: BOD, POR, TIMER(9)

Integrated peripherals reduce the need for external components, streamlining design and lowering costs.

Maximum Clock Frequency: 24 MHz

A high clock frequency provides good processing speed, making it suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

Adapts to various soldering processes, ensuring compatibility with standard manufacturing practices.

Peak Reflow Temperature °C: 260

High-temperature tolerance ensures reliability during soldering, reducing the risk of damage.

Length: 10 mm

Compact size facilitates integration into small devices where space is a limitation.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed to endure harsh environments, ensuring longevity and reliability.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller type streamlines development as it is engineered specifically for control applications.

No. of Timers: 4

Multiple timers allow for precise timing tasks, enabling complex scheduling and control operations.

RAM Bytes: 6144

Provides ample memory for efficient data management and operations during program execution.

Technology: CMOS

CMOS technology offers low power consumption, leading to efficiency in battery-operated projects.

Terminal Form: GULL WING

Gull wing terminals ensure stable connections and are easier to handle during assembly.

Analog To Digital Converters: 9-Ch 10-Bit

Multiple ADC channels enhance the ability to read various sensors, making it versatile for different applications.

Maximum Supply Current: 18 mA

Low supply current consumption is crucial for battery-operated designs, contributing to energy efficiency.

Nominal Supply Voltage: 3.3 V

Common nominal voltage facilitates use in many modern electronic devices.

PWM Channels: YES

PWM capability enhances control over motors and other devices, making it versatile for more applications.

Connectivity: I2C, LIN(2), SPI, UART(2)

Diverse connectivity options allow for easy integration into complex systems and communication with various peripherals.

ROM Programmability: FLASH

Flash memory allows for easier updates and programming, simplifying development and deployment processes.

Terminal Pitch: 0.8 mm

Narrow pitch allows for a high-density PCB layout, optimizing space and functionality.

Format: FIXED POINT

Fixed point operations are beneficial in applications where speed and deterministic behavior are necessary.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, allowing for straightforward handling and assembly processes.

Speed: 24 rpm

Sufficient speed for applications requiring moderate processing capabilities without excessive power consumption.

Low Power Mode: YES

Low power mode extends battery life, making this microcontroller suitable for portable and energy-sensitive applications.

On Chip Program ROM Width: 32

Wider ROM width allows for more sophisticated program storage, enhancing overall device functionality.

No. of I/O Lines: 34

A larger number of I/O lines provides flexibility for interfacing with various sensors and devices.

Technical Specifications

Microcontrollers STM8S207S8T6CTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

31

No. of I/O Lines:

34

No. of Terminals:

44

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

1536

Connectivity:

I2C, LIN(2), SPI, UART(2)

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

STM8S207S8T6CTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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