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STM8S207M8T6B

STMicroelectronics

STM8S207M8T6B by STMicroelectronics

STM8S207M8T6B microcontroller from STMicroelectronics features a 24 MHz CPU, 6144 bytes of RAM, and supports I2C/SPI/UART connectivity. With an operating temp range of -40 °C to 85 °C, it's ideal for industrial applications requiring robust performance. Its low power mode enhances efficiency in embedded systems.

Median Price

$5.246

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 90 parts In-Stock

1+ parts

$4.631

100+ parts

-

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$3.249

10k+ parts

$2.641

90

$4.631

-

$3.249

$2.641

Chip1Stop

Japan . 160 parts In-Stock

1+ parts

$5.860

100+ parts

$2.960

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-

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160

$5.860

$2.960

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-

Verical

USA . 1,860 parts In-Stock

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-

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1,860

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Distributors (In-Stock)

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Digiode

USA . 4,896 parts In-Stock

1+ parts

$4.399

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4,896

$4.399

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Vyrian

USA . 6,186 parts In-Stock

1+ parts

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6,186

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Anansix

USA . 1,507 parts In-Stock

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1,507

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Distributors (Availability)

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Ampacity Inc.

Singapore . 113 parts In-Stock

1+ parts

$2.300

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-

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113

$2.300

-

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Vigor

Singapore . 1,805 parts In-Stock

1+ parts

$2.540

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1,805

$2.540

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Corphita

USA . 4,696 parts In-Stock

1+ parts

$4.168

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-

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4,696

$4.168

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AZTECH Wire

Italy . 731 parts In-Stock

1+ parts

$11.100

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-

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731

$11.100

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IDEA Electronic Components Group

UK . 2,247 parts In-Stock

1+ parts

$16.796

100+ parts

-

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$15.117

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2,247

$16.796

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$15.117

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Microchip USA

USA . 1,521 parts In-Stock

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$22.841

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1,521

$22.841

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MKK Technologies

India . 195 parts In-Stock

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$31.585

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195

$31.585

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DigiPath Technology Company

USA . 195 parts In-Stock

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$31.585

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195

$31.585

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QUARKTWIN TECHNOLOGY LTD

USA . 21,683 parts In-Stock

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21,683

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Perfect Parts

USA . 9,677 parts In-Stock

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9,677

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RC Electronics

USA . 7,090 parts In-Stock

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7,090

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A-Z Elektronik GmbH

Germany . 6,261 parts In-Stock

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6,261

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Parana Technologies

USA . 1,074 parts In-Stock

1+ parts

-

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$20.083

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1,074

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$20.083

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Metaverse IC Inc.

Canada . 610 parts In-Stock

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610

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Futuretech Components

Singapore . 220 parts In-Stock

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220

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Overview

Unlock the potential of your projects with the STM8S207M8T6B microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for versatility and reliability, this powerhouse excels in demanding industrial applications, offering an array of features that streamline development and enhance performance. Benefit from its low power consumption, robust connectivity options, and impressive processing capabilities to elevate your designs and drive innovation confidently!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the microcontroller suitable for various applications.

Surface Mount: YES

The surface mount capability allows for compact design and easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

This voltage range makes the microcontroller versatile for use in different electronic systems without the need for complex power management.

On Chip Data RAM Width: 8

An 8-bit data RAM width ensures efficient processing of byte-oriented data, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape promotes more efficient space utilization on printed circuit boards.

Bit Size: 8

An 8-bit bit size is ideal for handling standard data types commonly used in embedded systems.

No. of Terminals: 80

A higher number of terminals allows for greater connectivity options and integration with multiple peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design reduces height on circuit boards, allowing for more compact layouts.

Minimum Supply Voltage: 2.95 V

This lower voltage requirement means the microcontroller can operate in low-power applications effectively.

Maximum Operating Temperature: 85 °C

The high operating temperature rating makes this microcontroller suitable for industrial environments.

CPU Family: STM8

Part of the STM8 family, this microcontroller benefits from a proven architecture and extensive community support.

No. of External Interrupts: 37

Multiple external interrupts enhance responsiveness in applications that require real-time processing.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold makes this microcontroller suitable for outdoor and harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides long-term reliability.

ADC Channels: YES

Having ADC channels facilitates analog data processing, making it versatile for various sensing applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient use of PCB real estate and easy assembly.

ROM Words: 65536

A large ROM capacity supports extensive program storage, allowing more complex applications to be developed.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a sleeker design for compact modules or devices.

RAM Words: 6144

Ample RAM facilitates more complex computations and data handling within applications.

Width: 14 mm

The compact width enables easy integration into smaller electronic devices.

Data EEPROM Size: 2048

Available EEPROM storage allows for the retention of important data between power cycles.

Peripherals: BOR, POR, TIMER(12), WDT(2)

Integrated peripherals enhance the microcontroller's functionality, allowing for more sophisticated control in applications.

Maximum Clock Frequency: 24 MHz

The 24 MHz clock frequency ensures efficient processing speeds for most applications requiring responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for good compatibility with reflow soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 250

High reflow temperature tolerance ensures durability during manufacturing processes.

Length: 14 mm

The short length is favorable for space-saving designs in compact electronic assemblies.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability under demanding conditions, making it suitable for critical applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is optimized for various embedded applications, providing control and computation.

No. of Timers: 4

Multiple timers enable precise timing operations in control applications, enhancing functionality.

RAM Bytes: 6144

Adequate RAM for handling data-intensive tasks efficiently in embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals help with easy soldering and reliable connections in assembly.

Analog To Digital Convertors: 16-Ch 10-Bit

16-channel ADC allows for multiple sensor inputs, broadening the application potential.

Maximum Supply Current: 18 mA

Low supply current makes it energy-efficient, ideal for power-sensitive applications.

Nominal Supply Voltage: 5 V

Standard 5 V supply voltage simplifies power supply requirements in many systems.

PWM Channels: YES

PWM capabilities allow for effective control in applications such as motor drives and light dimming.

Connectivity: I2C, SPI, UART(2)

Diverse connectivity options facilitate communication with other devices and expand application possibilities.

ROM Programmability: FLASH

With flash programmability, the microcontroller allows easy updates and reprogramming of firmware.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch supports more compact device designs while ensuring reliable connections.

Format: FIXED POINT

Fixed point format allows straightforward implementation of numerical algorithms, enhancing processing speed.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates reasonable handling requirements, promoting compatibility with automated processes.

Speed: 24 rpm

Effective for applications that require controlled motion, such as in robotics and automation.

Low Power Mode: YES

The low power mode feature optimizes energy consumption, extending battery life in portable devices.

On Chip Program ROM Width: 8

The 8-bit width of program ROM is advantageous for compatibility with common data formats in embedded systems.

No. of I/O Lines: 68

A high number of I/O lines maximizes flexibility for interfacing with various components and sensors.

Technical Specifications

Microcontrollers STM8S207M8T6B attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

37

No. of I/O Lines:

68

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

I2C, SPI, UART(2)

Peripherals:

BOR, POR, TIMER(12), WDT(2)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STM8S207M8T6B Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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