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STM8S207M8T3B

STMicroelectronics

STM8S207M8T3B by STMicroelectronics

STM8S207M8T3B microcontroller from STMicroelectronics features a 24 MHz CPU, 6144 bytes of RAM, and operates within -40 °C to 125 °C. With 68 I/O lines and support for ADC channels, it's ideal for automotive applications requiring robust performance. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,812 parts In-Stock

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2,812

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Vyrian

USA . 1,924 parts In-Stock

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1,924

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Anansix

USA . 247 parts In-Stock

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247

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Distributors (Availability)

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Vigor

Singapore . 3,095 parts In-Stock

1+ parts

$2.920

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3,095

$2.920

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AZTECH Wire

Italy . 1,099 parts In-Stock

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$17.320

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1,099

$17.320

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IDEA Electronic Components Group

UK . 1,465 parts In-Stock

1+ parts

$18.941

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$17.047

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1,465

$18.941

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$17.047

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Microchip USA

USA . 2,145 parts In-Stock

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$26.617

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2,145

$26.617

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MKK Technologies

India . 2,079 parts In-Stock

1+ parts

$35.617

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2,079

$35.617

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DigiPath Technology Company

USA . 2,079 parts In-Stock

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$35.617

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2,079

$35.617

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Component Stockers USA

USA . 2,344 parts In-Stock

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$52.380

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2,344

$52.380

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Corphita

USA . 4,777 parts In-Stock

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4,777

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Parana Technologies

USA . 480 parts In-Stock

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$22.647

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480

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$22.647

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Overview

Unlock endless possibilities with the STM8S207M8T3B microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed to thrive in automotive applications, this versatile chip delivers exceptional performance and low power consumption, ensuring your projects run smoothly even under extreme conditions. Experience enhanced efficiency and superior quality, backed by ST’s commitment to excellence, making it the perfect choice for your next groundbreaking design!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability in various environmental conditions.

Surface Mount: YES

Surface mount allows for compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

This range allows for flexibility in integration with various power supply systems.

On Chip Data RAM Width: 8

An 8-bit RAM width indicates a suitable architecture for lower power and simpler applications.

Package Shape: SQUARE

A square package shape aids in even thermal distribution and facilitates efficient PCB layout.

Bit Size: 8

The 8-bit architecture is ideal for many control applications, offering a good balance of performance and resource usage.

No. of Terminals: 80

With 80 terminals, it provides ample connectivity and is capable of handling complex peripheral configurations.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack style is excellent for modern compact electronic designs.

Minimum Supply Voltage: 2.95 V

This low minimum supply voltage helps in reducing power consumption, extending battery life in portable applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability under demanding thermal conditions, suitable for automotive applications.

CPU Family: STM8

Being part of the STM8 family provides access to a wide ecosystem of development tools and community support.

No. of External Interrupts: 37

A high number of external interrupts allows for flexible and responsive designs, essential in real-time applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature is crucial for operation in extreme conditions, such as automotive environments.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and helps in maintaining contact integrity over time.

ADC Channels: YES

Inclusion of ADC channels allows for precise analog-to-digital conversions, essential in sensor applications.

Terminal Position: QUAD

Quad terminal positioning provides better layout flexibility and optimizes PCB space usage.

ROM Words: 65536

A substantial amount of ROM ensures adequate programming space for application code, enhancing functionality.

Maximum Seated Height: 1.6 mm

The low seated height contributes to compact designs, making it easier to integrate into various applications.

RAM Words: 6144

With 6144 RAM words, it supports complex applications requiring significant data handling capability.

Width: 14 mm

The compact width makes it easy to fit into tight spaces within electronic enclosures.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz provides decent processing power for a range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates robustness during manufacturing processes, ensuring product longevity.

Peak Reflow Temperature °C: 250

A high peak reflow temperature allows compatibility with a range of soldering techniques and materials.

Length: 14 mm

The compact length contributes to the overall space efficiency of the design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability and performance in harsh automotive conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is ideal for embedded applications across various industries.

No. of Timers: 4

Multiple timers enhance scheduling and time-critical processes in embedded applications.

RAM Bytes: 6144

A significant amount of RAM allows for efficient processing and data storage for applications.

Technology: CMOS

CMOS technology offers low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, enhancing manufacturability.

Maximum Supply Current: 18 mA

A low maximum supply current aids in reducing overall power consumption in embedded systems.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage ensures compatibility with a wide range of power sources and devices.

PWM Channels: YES

PWM channels enable efficient control of motors and other devices, making it versatile for various applications.

ROM Programmability: FLASH

Flash programmability allows for easier updates and modifications to application code post-deployment.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch facilitates more compact PCB designs without compromising connection quality.

Format: FIXED POINT

The fixed-point format is suitable for arithmetic operations common in control applications, enhancing performance.

Moisture Sensitivity Level (MSL): 3

Recognized moisture sensitivity level ensures proper handling and storage, reducing the risk of component degradation.

Speed: 24 rpm

The speed of 24 rpm is competent for applications requiring moderate actuation or feedback control.

Low Power Mode: YES

The availability of a low power mode extends battery life in portable and battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient code execution and control in embedded applications.

No. of I/O Lines: 68

With 68 I/O lines, this microcontroller is well-equipped for interfacing with a variety of peripherals.

Technical Specifications

Microcontrollers STM8S207M8T3B attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

37

No. of I/O Lines:

68

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM8S207M8T3B Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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