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STM8S207C8T3TR

STMicroelectronics

STM8S207C8T3TR by STMicroelectronics

STM8S207C8T3TR microcontroller from STMicroelectronics features a 24 MHz CPU, 35 external interrupts, and operates within -40 °C to 125°C. Ideal for automotive applications, it offers low power modes and extensive I/O capabilities in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 50,000 parts In-Stock

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50,000

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Vyrian

USA . 6,415 parts In-Stock

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6,415

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Chip Stock

USA . 3,115 parts In-Stock

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3,115

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Digiode

USA . 116 parts In-Stock

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116

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Anansix

USA . 96 parts In-Stock

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96

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Distributors (Availability)

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Vigor

Singapore . 7,500 parts In-Stock

1+ parts

$1.850

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7,500

$1.850

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AZTECH Wire

Italy . 361 parts In-Stock

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$8.550

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361

$8.550

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Microchip USA

USA . 4,563 parts In-Stock

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$15.568

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4,563

$15.568

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IDEA Electronic Components Group

UK . 749 parts In-Stock

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$24.696

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$22.226

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749

$24.696

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MKK Technologies

India . 922 parts In-Stock

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$46.438

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922

$46.438

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DigiPath Technology Company

USA . 922 parts In-Stock

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$46.438

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922

$46.438

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QUARKTWIN TECHNOLOGY LTD

USA . 15,187 parts In-Stock

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Corphita

USA . 4,870 parts In-Stock

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4,870

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Parana Technologies

USA . 109 parts In-Stock

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$29.527

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109

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$29.527

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Overview

Unlock the potential of your designs with the STM8S207C8T3TR from STMicroelectronics—a trusted leader in microcontroller innovation. This versatile and robust microcontroller is engineered for excellence, ensuring reliability in automotive applications and beyond. With its low power consumption and impressive performance, it enhances efficiency while offering seamless integration for complex projects. Choose STM8S207C8T3TR for exceptional quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on PCBs, facilitating more versatile applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V enhances versatility for different power supply configurations.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data handling suitable for entry-level applications.

Package Shape: SQUARE

The square package shape offers a balanced layout, aiding in thermal management and design consistency.

Bit Size: 8

An 8-bit architecture is efficient for many basic control and monitoring tasks, making it ideal for embedded applications.

No. of Terminals: 48

A high number of terminals provides ample options for connectivity, enabling complex interactions with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style allows for low-profile designs that are essential in space-constrained applications.

Minimum Supply Voltage: 2.95 V

The lower minimum supply voltage makes this microcontroller suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range is essential for automotive and industrial applications, ensuring reliability in harsh environments.

CPU Family: STM8

The STM8 family is known for its robustness and efficiency in various electronic applications, providing a proven architecture.

No. of External Interrupts: 35

A large number of external interrupts allows for responsive design and interaction with various sensors and devices.

Minimum Operating Temperature: -40 °C

This wide temperature tolerance makes the microcontroller suitable for extreme environmental conditions, such as automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finishes enhance corrosion resistance and ensure long-term reliability of electrical connections.

ADC Channels: YES

Integration of ADC channels allows for direct interfacing with analog sensors, broadening application possibilities.

Terminal Position: QUAD

Quad terminal positioning simplifies layout and design, enhancing manufacturability.

ROM Words: 65536

A substantial amount of ROM enables the storage of complex programs and algorithms, enhancing functionality.

Maximum Seated Height: 1.6 mm

A low seated height enables compact designs, crucial for space-sensitive electronic configurations.

RAM Words: 6144

Sufficient RAM capacity supports more complex computational tasks and better performance for various applications.

Width: 7 mm

The small width contributes to a compact PCB layout, facilitating miniaturization of electronic devices.

Maximum Clock Frequency: 24 MHz

A clock frequency of 24 MHz enables quick processing times, enhancing the performance of applications.

Maximum Time At Peak Reflow Temperature (s): 40

Catering to manufacturing processes, 40 seconds at peak reflow temperature minimizes the risk of component damage during soldering.

Peak Reflow Temperature °C: 260

Support for high reflow temperatures ensures reliability for modern soldering techniques, enhancing manufacturing flexibility.

Length: 7 mm

The compact length paired with the width allows for efficient use of PCB space in small electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, indicating high reliability and performance under stringent conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is optimized for embedded control tasks, making it a go-to choice for various applications.

No. of Timers: 4

Having multiple timers offers advanced scheduling capabilities for real-time applications.

RAM Bytes: 6144

The available RAM provides ample memory for processing tasks, boosting overall performance.

Technology: CMOS

CMOS technology contributes to low power consumption, ideal for energy-efficient designs.

Terminal Form: GULL WING

Gull-wing terminals provide reliable solder joint integrity and easier PCB assembly.

Maximum Supply Current: 18 mA

A low maximum supply current indicates energy efficiency, crucial for battery-operated devices.

Nominal Supply Voltage: 5 V

Common supply voltage ensures compatibility with numerous existing systems and components.

PWM Channels: YES

PWM capabilities enable precise control of motors and other devices, enhancing versatility in various applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and changes to firmware, promoting flexibility in product development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch accommodates fine-pitch designs, enabling more compact configurations.

Format: FIXED POINT

Fixed-point formatting provides efficient data processing for applications requiring consistent numerical precision.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures proper handling and storage during assembly processes.

Speed: 24 rpm

The specified speed capability allows for adequate performance in time-sensitive control applications.

Low Power Mode: YES

Low power mode functionality is essential for battery conservation in portable applications.

On Chip Program ROM Width: 8

The 8-bit program ROM width efficiently supports application-level storage and logic processing.

No. of I/O Lines: 38

38 I/O lines provide extensive connectivity options, enabling complex interfacing with the external environment.

Technical Specifications

Microcontrollers STM8S207C8T3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

35

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8S207C8T3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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