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STM8S105K6U6

STMicroelectronics

STM8S105K6U6 by STMicroelectronics

STM8S105K6U6 microcontroller from STMicroelectronics features a 16 MHz CPU, 32 terminals, and operates b/w -40 °C to 85°C. With 1K EEPROM and multiple connectivity options (I2C, SPI, UART), it's ideal for industrial applications requiring low power consumption. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,398 parts In-Stock

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2,398

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Vyrian

USA . 2,253 parts In-Stock

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2,253

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Digiode

USA . 973 parts In-Stock

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973

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,797 parts In-Stock

1+ parts

$1.790

100+ parts

-

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-

10k+ parts

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2,797

$1.790

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Microchip USA

USA . 360 parts In-Stock

1+ parts

$17.525

100+ parts

-

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360

$17.525

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AZTECH Wire

Italy . 904 parts In-Stock

1+ parts

$17.750

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-

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904

$17.750

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IDEA Electronic Components Group

UK . 233 parts In-Stock

1+ parts

$43.059

100+ parts

-

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$38.753

10k+ parts

-

233

$43.059

-

$38.753

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$51.378

100+ parts

$46.754

1k+ parts

$42.130

10k+ parts

-

700

$51.378

$46.754

$42.130

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MKK Technologies

India . 1,598 parts In-Stock

1+ parts

$80.969

100+ parts

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1,598

$80.969

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DigiPath Technology Company

USA . 1,598 parts In-Stock

1+ parts

$80.969

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1,598

$80.969

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Corphita

USA . 4,371 parts In-Stock

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4,371

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Perfect Parts

USA . 2,476 parts In-Stock

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2,476

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Parana Technologies

USA . 1,524 parts In-Stock

1+ parts

-

100+ parts

$51.483

1k+ parts

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1,524

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$51.483

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A-Z Elektronik GmbH

Germany . 266 parts In-Stock

1+ parts

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266

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Overview

Unlock the potential of your projects with the STM8S105K6U6 microcontroller from STMicroelectronics, a name synonymous with quality and innovation. This compact powerhouse is designed for diverse applications, delivering exceptional performance in industrial automation, consumer electronics, and more. Enjoy seamless connectivity options, low power consumption, and robust reliability, ensuring your designs are not just effective but also future-ready. Elevate your developments today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact circuit board layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Supports a wide range of power supply options, enhancing compatibility with various systems.

On Chip Data RAM Width: 8

8-bit RAM width aids in efficient processing of 8-bit data, making it suitable for many microcontroller applications.

Package Shape: SQUARE

Square package shape offers uniform thermal performance and simplifies PCB design.

Bit Size: 8

8-bit architecture enhances simplicity and efficiency in application development.

No. of Terminals: 32

32 terminals provide ample connectivity options, enabling versatile configurations and expansions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style allows for better thermal management and is suited for high-density applications.

Minimum Supply Voltage: 2.95 V

Low voltage operation supports energy-efficient designs, extending battery life in portable applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in industrial and harsh environments.

CPU Family: STM8

Based on the proven STM8 architecture, which is known for ease of use and rich development ecosystem.

No. of External Interrupts: 23

High number of external interrupts allows for responsive systems and complex event handling.

Minimum Operating Temperature: -40 °C

Low temperature operation guarantees functionality in extreme weather conditions.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and prevents oxidation, enhancing product reliability.

ADC Channels: YES

Inclusion of ADC channels allows for easy analog signal processing, expanding application possibilities.

Terminal Position: QUAD

Quad terminal position facilitates compact PCB layouts and effective thermal dissipation.

ROM Words: 32768

32768 ROM words provide ample program space for complex applications and extensive firmware.

Maximum Seated Height: 0.6 mm

Low profile design aids in minimizing overall device height for compact applications.

RAM Words: 1024

1024 RAM words enable efficient data processing and temporary storage for active applications.

Width: 5 mm

Compact width is ideal for limited-space designs and small form-factor devices.

Data EEPROM Size: 1K

1K EEPROM provides sufficient non-volatile storage for parameters and calibration data.

Peripherals: BOR, POR, TIMER(10), WDT(2)

Integrated peripherals enhance functionality and reliability, reducing the need for additional components.

Maximum Clock Frequency: 16 MHz

High clock frequency increases processing speed, making it suitable for demanding applications.

Maximum Time At Peak Reflow Temperature: 30 s

Optimized for reliable soldering, ensuring durability and integrity during assembly.

Peak Reflow Temperature: 260 °C

Resilience to high temperatures during manufacturing processes increases assembly quality and reliability.

Length: 5 mm

Short length enhances design flexibility for compact and low-profile configurations.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures long-term reliability and stability in diverse environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller design supports a wide array of control applications across various industries.

No. of Timers: 4

Multiple timers allow for complex time management tasks, enhancing functionality in real-time applications.

RAM Bytes: 2048

2048 bytes of RAM provide ample space for operational data, ensuring smooth performance.

Technology: CMOS

CMOS technology promotes low power consumption and high-speed operation, ideal for battery-powered devices.

Terminal Form: NO LEAD

No lead design contributes to environmental sustainability and eases recycling and disposal.

Analog To Digital Convertors: 7-Ch 10-Bit

7-channel, 10-bit ADCs support a variety of signal measurements, making it versatile for different applications.

Maximum Supply Current: 8 mA

Low supply current enhances energy efficiency, which is essential for portable and battery-powered devices.

Nominal Supply Voltage: 5 V

Nominal operating voltage simplifies power supply design and enhances compatibility with standard components.

PWM Channels: YES

PWM support enables motor control and other applications requiring precise control of power delivery.

Connectivity: I2C, SPI, UART

Multiple connectivity options allow flexible interfacing with various peripherals and components.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, supporting project longevity.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables more compact layouts, maximizing PCB space utilization.

Format: FIXED POINT

Fixed-point format is efficient for mathematical computations, particularly in control applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures appropriate handling during assembly, minimizing moisture-related issues.

Speed: 16 rpm

Operational speed of 16 rpm is optimized for applications requiring steady and controlled operation.

Low Power Mode: YES

Low power mode is ideal for battery-saving applications, extending operational life in portable devices.

On Chip Program ROM Width: 8

8-bit program ROM width supports efficient data access and execution in relevant applications.

No. of I/O Lines: 25

25 input/output lines offer extensive interfacing capabilities, allowing multiple connections in complex systems.

Technical Specifications

Microcontrollers STM8S105K6U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

23

No. of I/O Lines:

25

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, UART

Peripherals:

BOR, POR, TIMER(10), WDT(2)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8S105K6U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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