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STM8L152K4U6TR

STMicroelectronics

STM8L152K4U6TR by STMicroelectronics

STM8L152K4U6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1K data EEPROM size, 22-Ch 12-Bit ADC channels, and 1-Ch 12-bit DAC channels. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, and USART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,508 parts In-Stock

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4,508

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Digiode

USA . 3,398 parts In-Stock

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3,398

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Anansix

USA . 1,786 parts In-Stock

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1,786

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 4,054 parts In-Stock

1+ parts

$9.499

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4,054

$9.499

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AZTECH Wire

Italy . 102 parts In-Stock

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$16.010

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102

$16.010

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IDEA Electronic Components Group

UK . 990 parts In-Stock

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$32.113

100+ parts

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$28.901

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990

$32.113

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$28.901

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MKK Technologies

India . 1,343 parts In-Stock

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$60.386

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1,343

$60.386

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DigiPath Technology Company

USA . 1,343 parts In-Stock

1+ parts

$60.386

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1,343

$60.386

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Parana Technologies

USA . 1,231 parts In-Stock

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$38.396

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1,231

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$38.396

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Corphita

USA . 679 parts In-Stock

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679

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Overview

Unleash the power of innovation with the STM8L152K4U6TR microcontroller from STMicroelectronics. This cutting-edge device offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With advanced features like low power mode, digital-to-analog converters, and multiple connectivity options, this microcontroller provides exceptional value to customers looking to push the boundaries of their designs. Trust in STMicroelectronics to deliver top-of-the-line technology that exceeds expectations and unlocks endless possibilities for your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy integration into compact electronic devices.

Maximum Supply Voltage: 3.6 V

Can handle a high supply voltage, making it versatile for various applications.

On Chip Data RAM Width: 8

Provides sufficient data RAM for efficient processing.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost.

DAC Channels: YES

Integrated DAC channels provide analog output capabilities.

Power Supplies (V): 1.8/3.3

Support for multiple power supply voltages adds flexibility to the design.

No. of Terminals: 32

Sufficient terminals for connecting to external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple package styles for different mounting options.

Minimum Supply Voltage: 1.65 V

Can operate at a low supply voltage, suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

Capable of operating in industrial temperature environments.

CPU Family: ST8

Part of a well-established CPU family known for reliable performance.

No. of External Interrupts: 40

Plenty of external interrupt lines for handling real-time events.

Minimum Operating Temperature: -40 °C

Wide operating temperature range suitable for harsh environments.

ADC Channels: YES

Integrated ADC channels enable analog inputs for sensing and monitoring.

DMA Channels: YES

DMA support for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position for stable connection and easy PCB layout.

ROM Words: 16384

Sufficient ROM for program storage and firmware updates.

Maximum Seated Height: 0.6 mm

Low profile design for space-constrained applications.

Digital To Analog Convertors: 1-Ch 12-bit

High-resolution DAC for accurate analog output.

Width: 5 mm

Compact width for fitting into small devices.

Data EEPROM Size: 1K

Integrated EEPROM for non-volatile data storage.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(4), WDT

Rich set of peripherals for added functionality and system control.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and responsiveness.

Length: 5 mm

Compact length for space-efficient design.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with reliable performance under harsh conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller IC for embedded system applications.

No. of Timers: 4

Multiple timers for precise timing control in applications.

RAM Bytes: 2048

Adequate RAM for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance.

Analog To Digital Convertors: 22-Ch 12-Bit

High-resolution ADC for accurate analog signal acquisition.

Maximum Supply Current: 80 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance.

No. of DMA Channels: 4

Multiple DMA channels for efficient data transfer and processing.

PWM Channels: YES

Support for PWM channels for precise control of analog outputs.

Connectivity: I2C, SPI, USART

Multiple communication interfaces for connecting to external devices.

ROM Programmability: FLASH

Flash ROM for easy programmability and firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB layout.

Format: FIXED POINT

Fixed-point format for efficient numerical computation.

Speed: 16 rpm

Capable of operating at high speeds for real-time processing.

Low Power Mode: YES

Support for low power mode for energy-efficient operation.

On Chip Program ROM Width: 8

On-chip program ROM for storing program code.

No. of I/O Lines: 29

Sufficient I/O lines for interfacing with external devices.

Technical Specifications

Microcontrollers STM8L152K4U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

40

No. of I/O Lines:

29

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

STM8L152K4U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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