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STM8L152C6U6TR

STMicroelectronics

STM8L152C6U6TR by STMicroelectronics

STM8L152C6U6TR by STMicroelectronics is an 8-bit microcontroller with 3.6V max supply voltage, 1K data EEPROM size, and 16MHz clock frequency. Ideal for industrial applications, it features 25-Ch ADC, I2C/SPI/USART connectivity, and low power mode for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,326 parts In-Stock

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4,326

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Anansix

USA . 1,563 parts In-Stock

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1,563

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Digiode

USA . 1,398 parts In-Stock

1+ parts

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1,398

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 4,429 parts In-Stock

1+ parts

$11.400

100+ parts

-

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4,429

$11.400

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Component Stockers USA

USA . 4,198 parts In-Stock

1+ parts

$18.740

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4,198

$18.740

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AZTECH Wire

Italy . 601 parts In-Stock

1+ parts

$20.830

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-

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601

$20.830

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IDEA Electronic Components Group

UK . 299 parts In-Stock

1+ parts

$40.359

100+ parts

-

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$36.323

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299

$40.359

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$36.323

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MKK Technologies

India . 2,074 parts In-Stock

1+ parts

$75.892

100+ parts

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2,074

$75.892

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DigiPath Technology Company

USA . 2,074 parts In-Stock

1+ parts

$75.892

100+ parts

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2,074

$75.892

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Corphita

USA . 3,857 parts In-Stock

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3,857

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Parana Technologies

USA . 383 parts In-Stock

1+ parts

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$48.255

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383

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$48.255

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Overview

Unleash the power of innovation with the STM8L152C6U6TR by STMicroelectronics. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by a trusted manufacturer. Ideal for a wide range of applications, this device boasts a myriad of advantages including low power consumption, high performance, and versatile connectivity options. Experience seamless operation and superior functionality with this exceptional product that delivers exceptional value to customers looking to stay ahead in today's fast-paced technological landscape.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount the microcontroller on a PCB, saving space and improving overall design efficiency.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage options, making the microcontroller versatile for different applications.

On Chip Data RAM Width: 8

Provides ample data RAM width for efficient data processing and storage on the microcontroller.

Package Shape: SQUARE

Square package shape ensures easy integration and efficient use of space on the PCB.

Bit Size: 8

The 8-bit architecture offers a good balance between performance and cost, suitable for various embedded applications.

DAC Channels: YES

Having DAC channels allows for analog output capability, enabling the microcontroller to interface with analog devices.

Power Supplies (V): 1.8/3.3

Supports multiple power supply options, providing flexibility in powering the microcontroller according to the application requirements.

No. of Terminals: 48

With a sufficient number of terminals, the microcontroller can interface with various external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offer options for different mounting and thermal management needs, enhancing versatility.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage allows for operation in low-power applications, promoting energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and high temperature operation.

CPU Family: ST8

Being part of the ST8 CPU family ensures compatibility and support for a range of software and development tools.

No. of External Interrupts: 40

Having a large number of external interrupts allows the microcontroller to efficiently handle external events and prioritize tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables reliable performance even in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and ensures reliable electrical connections.

ADC Channels: YES

Inclusion of ADC channels enables the microcontroller to convert analog signals to digital data, expanding its input capabilities.

DMA Channels: YES

DMA support enhances data transfer efficiency, enabling the microcontroller to offload data movement tasks to dedicated channels.

Terminal Position: QUAD

The quad terminal position facilitates easier PCB layout and assembly, simplifying the design process.

ROM Words: 32768

With a large ROM capacity, the microcontroller can store a significant amount of program code and data for complex applications.

Maximum Seated Height: 0.6 mm

The low maximum seated height enables the microcontroller to be used in compact designs with tight height constraints.

Digital To Analog Convertors: 1-Ch 12-bit

The 12-bit DAC offers high-resolution analog output capability, suitable for applications requiring precise voltage levels.

Technical Specifications

Microcontrollers STM8L152C6U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

40

No. of I/O Lines:

41

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

STM8L152C6U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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