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STM8L152C6U6

STMicroelectronics

STM8L152C6U6 by STMicroelectronics

STM8L152C6U6 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 1.65V and 3.6V, and includes 25 ADC channels. Its compact design with a quad terminal position makes it ideal for industrial applications. With integrated peripherals like DMA and PWM, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,876 parts In-Stock

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5,876

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Digiode

USA . 4,358 parts In-Stock

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4,358

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Anansix

USA . 1,242 parts In-Stock

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1,242

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,840 parts In-Stock

1+ parts

$1.350

100+ parts

-

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5,840

$1.350

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AZTECH Wire

Italy . 71 parts In-Stock

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$9.140

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71

$9.140

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Microchip USA

USA . 3,761 parts In-Stock

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$11.704

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3,761

$11.704

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IDEA Electronic Components Group

UK . 2,196 parts In-Stock

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$29.147

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$26.232

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2,196

$29.147

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$26.232

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MKK Technologies

India . 1,494 parts In-Stock

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$54.808

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1,494

$54.808

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DigiPath Technology Company

USA . 1,494 parts In-Stock

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$54.808

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1,494

$54.808

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A-Z Elektronik GmbH

Germany . 6,413 parts In-Stock

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6,413

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Corphita

USA . 3,763 parts In-Stock

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3,763

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Perfect Parts

USA . 1,747 parts In-Stock

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RC Electronics

USA . 1,500 parts In-Stock

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1,500

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Parana Technologies

USA . 1,444 parts In-Stock

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$34.849

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1,444

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$34.849

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Overview

Unlock the potential of your designs with the STM8L152C6U6 microcontroller by STMicroelectronics. Renowned for its reliability and performance, this compact powerhouse is perfect for a range of applications—from industrial automation to consumer electronics. With low power consumption and versatile connectivity options, it enables seamless integration and efficient operation. Elevate your projects and enjoy the peace of mind that comes with ST’s commitment to quality and innovation.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into modern compact electronic devices, offering flexibility in PCB design.

Maximum Supply Voltage: 3.6 V

The supported maximum supply voltage ensures compatibility with a wide range of power sources, making it versatile for various applications.

Package Shape: SQUARE

The square package shape aids in efficient thermal management and space optimization on the PCB.

Bit Size: 8

An 8-bit architecture is sufficient for many embedded applications while keeping power consumption low.

DAC Channels: YES

The inclusion of digital-to-analog converters allows for direct signal output, useful in applications requiring waveform generation.

Power Supplies (V): 1.8/3.3

Dual voltage support increases flexibility, allowing the microcontroller to operate effectively in different electrical environments.

No. of Terminals: 48

A higher number of terminals enables more peripheral connections, allowing for complex system designs and interactions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style helps in efficient heat dissipation while supporting compact designs essential for advanced electronics.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage extends the application range, particularly in battery-powered devices conserving energy.

Maximum Operating Temperature: 85 °C

Operating at high temperatures increases reliability in demanding environments, ideal for industrial applications.

CPU Family: ST8

The ST8 CPU family provides optimized performance for embedded applications, ensuring efficient processing and control.

Minimum Operating Temperature: -40 °C

Wide temperature range support means this microcontroller can withstand harsh environmental conditions, making it suitable for outdoor and industrial use.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and resistance to oxidation, enhancing reliability during assembly.

ADC Channels: YES

With built-in ADC channels, it can directly interface with various sensors, allowing for real-time data acquisition and control.

DMA Channels: YES

Direct Memory Access (DMA) capability improves data transfer efficiency, reducing CPU load and enhancing performance.

Terminal Position: QUAD

Quad terminal position supports efficient PCB layout and can contribute to better electrical performance.

ROM Words: 32768

A robust ROM size allows for substantial program storage, enabling complex application development.

Maximum Seated Height: 1 mm

Its thin profile promotes compact assembly, essential for space-constrained applications.

Digital To Analog Converters: 1-Ch 12-Bit

The 12-bit resolution of the DAC enables high precision analog outputs, suitable for sensitive applications.

Width: 7 mm

Compact width facilitates placement on space-limited PCBs, enhancing design flexibility.

Data EEPROM Size: 1K

The small EEPROM size is perfect for storing configuration settings and small data logs, enhancing functional efficiency.

Peripherals: BOD, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(7)

Diverse peripherals enable the development of multifunctional systems, enriching application design possibilities.

Maximum Clock Frequency: 16 MHz

The clock speed allows for fast processing, enabling the microcontroller to handle complex tasks efficiently.

Length: 7 mm

Its compact length complements space-saving designs, allowing use in a variety of electronic products.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability in critical and harsh environments, promoting long-term functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances processing efficiency and speed, making it suitable for resource-constrained applications.

RAM Bytes: 2048

Sufficient RAM size allows for effective data handling and processing, accommodating complex operations.

Technology: CMOS

CMOS technology contributes to low power consumption and high integration, ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead design helps in reducing the environmental impact, making it a greener choice for electronic manufacturing.

Analog To Digital Convertors: 25-Ch 12-Bit

With a substantial number of ADC channels, it can interface with multiple analog sensors, enriching data collection capabilities.

Maximum Supply Current: 80 mA

The moderate maximum supply current allows for efficient power management in battery-operated applications.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3V is ideal for modern electronic systems, ensuring a balance between performance and power consumption.

PWM Channels: YES

Supporting PWM channels allows precise control of motors and lights, making it ideal for embedded applications.

Connectivity: I2C, IRDA, SPI, USART

Multi-protocol connectivity enhances interoperability with various devices and sensors, supporting diverse application needs.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware, making the product adaptable to changing requirements.

Terminal Pitch: 0.5 mm

A fine terminal pitch facilitates high-density PCB designs, maximizing the use of available board space.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 allows for standard handling and assembly processes, aiding in manufacturing efficiency.

Speed: 16 rpm

The operational speed specification indicates suitability for low-speed applications without performance sacrifice.

On Chip Program ROM Width: 8

An 8-bit program ROM width is adequate for managing instruction sets needed for efficient microcontroller operation.

No. of I/O Lines: 41

A high number of I/O lines provides great flexibility for connecting external devices, sensors, and components.

Technical Specifications

Microcontrollers STM8L152C6U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(7)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8L152C6U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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